Audio Amplifiers 2X15W BTL CLASS D AMP+VOLCTRL

TDA8932T

Manufacturer Part NumberTDA8932T
DescriptionAudio Amplifiers 2X15W BTL CLASS D AMP+VOLCTRL
ManufacturerNXP Semiconductors
TDA8932T datasheet
 


Specifications of TDA8932T

ProductClass-DOutput Power50 W
Available Set Gain36 dBCommon Mode Rejection Ratio (min)56 dB
Thd Plus Noise0.015 %Operating Supply Voltage22 V
Maximum Power Dissipation5000 mWMaximum Operating Temperature+ 85 C
Mounting StyleSMD/SMTAudio Load Resistance8 Ohms
Dual Supply Voltage+/- 11 VInput Signal TypeDifferential
Minimum Operating Temperature- 40 COutput Signal TypeDifferential, Single
Supply TypeSingle or DualSupply Voltage (max)36 V
Supply Voltage (min)10 VOutput Type1-Channel Mono or 2-Channel Stereo
Package / CaseSOIC-32Lead Free Status / RoHS StatusLead free / RoHS Compliant
Other namesTDA8932T/N1,112  
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NXP Semiconductors
R
=
EQ
Where:
R
= equivalent resistance [ ]
EQ
R3 = parallel resistor [ ]
Z
= internal input impedance
i
Example:
Substituting R1 = R2 = 4.7 k , Z
results in a gain of G
14.6 Device synchronization
If two or more TDA8932 devices are used in one application it is recommended that all
devices are synchronized running at the same switching frequency to avoid beat tones.
Synchronization can be realized by connecting all OSCIO pins together and configure one
of the TDA8932 devices as master, while the other TDA8932 devices are configured as
slaves (see
A device is configured as master by connecting a resistor between pins OSCREF and
V
SSD(HW)
oscillator output for synchronization. The OSCREF pins of the slave devices should be
shorted to V
Fig 10. Master slave concept in two chip application
14.7 Thermal behavior (printed-circuit board considerations)
The heatsink in the application with the TDA8932 is made with the copper on the
Printed-Circuit Board (PCB). The TDA8932 uses the four corner leads (pins 1, 16, 17 and
32) for heat transfer from the die to the PCB. The thermal foldback will limit the maximum
junction temperature to 140 C.
TDA8932_2
Preliminary data sheet
R3
Z
i
----------------- -
R3
+
Z
i
= 100 k and R3 = 22 k in
i
= 26.3 dB.
v(tot)
Figure
10).
setting the carrier frequency. Pin OSCIO of the master is then configured as an
configuring pin OSCIO as an input.
SSD(HW)
master
IC1
TDA8932
OSCREF
OSCIO
C osc
R osc
100 nF
39 k
V
SSD
Rev. 02 — 12 December 2006
TDA8932
Class-D audio amplifier
Equation 8
and
Equation 9
slave
IC2
TDA8932
OSCIO
OSCREF
V SSD
001aad761
© NXP B.V. 2006. All rights reserved.
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