TDA8932T NXP Semiconductors, TDA8932T Datasheet - Page 45

Audio Amplifiers 2X15W BTL CLASS D AMP+VOLCTRL

TDA8932T

Manufacturer Part Number
TDA8932T
Description
Audio Amplifiers 2X15W BTL CLASS D AMP+VOLCTRL
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA8932T

Product
Class-D
Output Power
50 W
Available Set Gain
36 dB
Common Mode Rejection Ratio (min)
56 dB
Thd Plus Noise
0.015 %
Operating Supply Voltage
22 V
Maximum Power Dissipation
5000 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Audio Load Resistance
8 Ohms
Dual Supply Voltage
+/- 11 V
Input Signal Type
Differential
Minimum Operating Temperature
- 40 C
Output Signal Type
Differential, Single
Supply Type
Single or Dual
Supply Voltage (max)
36 V
Supply Voltage (min)
10 V
Output Type
1-Channel Mono or 2-Channel Stereo
Package / Case
SOIC-32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TDA8932T/N1,112

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Part Number
Manufacturer
Quantity
Price
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Part Number:
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NXP Semiconductors
22. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
8.5
8.6
8.7
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
14.6
14.7
14.8
14.9
14.10
14.11
15
15.1
16
17
17.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 6
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 13
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17
Thermal characteristics. . . . . . . . . . . . . . . . . . 17
Static characteristics. . . . . . . . . . . . . . . . . . . . 18
Dynamic characteristics . . . . . . . . . . . . . . . . . 20
Application information. . . . . . . . . . . . . . . . . . 23
Test information . . . . . . . . . . . . . . . . . . . . . . . . 38
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 39
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mode selection and interfacing . . . . . . . . . . . . . 6
Pulse width modulation frequency . . . . . . . . . . 7
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal Foldback (TF) . . . . . . . . . . . . . . . . . . . 9
OverTemperature Protection (OTP) . . . . . . . . . 9
OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
Window Protection (WP). . . . . . . . . . . . . . . . . 10
Supply voltage protection . . . . . . . . . . . . . . . . 10
Diagnostic input and output . . . . . . . . . . . . . . 11
Differential inputs . . . . . . . . . . . . . . . . . . . . . . 11
Output voltage buffers. . . . . . . . . . . . . . . . . . . 12
Output power estimation. . . . . . . . . . . . . . . . . 23
Output current limiting. . . . . . . . . . . . . . . . . . . 25
Speaker configuration and impedance . . . . . . 25
Single-ended capacitor . . . . . . . . . . . . . . . . . . 25
Gain reduction . . . . . . . . . . . . . . . . . . . . . . . . 26
Device synchronization. . . . . . . . . . . . . . . . . . 27
Thermal behavior (printed-circuit board
considerations) . . . . . . . . . . . . . . . . . . . . . . . . 27
Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 29
SE curves measured in reference design. . . . 30
BTL curves measured in reference design . . . 32
Typical application schematics (simplified) . . . 35
Quality information . . . . . . . . . . . . . . . . . . . . . 38
Introduction to soldering . . . . . . . . . . . . . . . . . 40
17.2
17.3
17.4
18
19
20
20.1
20.2
20.3
20.4
21
22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 42
Revision history . . . . . . . . . . . . . . . . . . . . . . . 43
Legal information . . . . . . . . . . . . . . . . . . . . . . 44
Contact information . . . . . . . . . . . . . . . . . . . . 44
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Wave and reflow soldering . . . . . . . . . . . . . . . 40
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 40
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 41
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 44
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Class-D audio amplifier
Date of release: 12 December 2006
Document identifier: TDA8932_2
TDA8932
All rights reserved.

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