IRFL4310TRPBF International Rectifier, IRFL4310TRPBF Datasheet

MOSFET N-CH 100V 1.6A SOT223

IRFL4310TRPBF

Manufacturer Part Number
IRFL4310TRPBF
Description
MOSFET N-CH 100V 1.6A SOT223
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheets

Specifications of IRFL4310TRPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
200 mOhm @ 1.6A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
1.6A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
25nC @ 10V
Input Capacitance (ciss) @ Vds
330pF @ 25V
Power - Max
1W
Mounting Type
Surface Mount
Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Current, Drain
1.6 A
Gate Charge, Total
17 nC
Package Type
SOT-223
Polarization
N-Channel
Power Dissipation
1 W
Resistance, Drain To Source On
0.2 Ohm
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
34 ns
Time, Turn-on Delay
7.8 ns
Transconductance, Forward
1.5 S
Voltage, Breakdown, Drain To Source
100 V
Voltage, Forward, Diode
1.3 V
Voltage, Gate To Source
±20 V
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
1.6 A
Mounting Style
SMD/SMT
Gate Charge Qg
17 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IRFL4310TRPBF
IRFL4310TRPBFTR

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
IRFL4310TRPBF
Manufacturer:
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39 301
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IR
Quantity:
20 000
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Part Number:
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1 654
l Surface Mount
l Dynamic dv/dt Rating
l Fast Switching
l Ease of Paralleling
l Advanced Process Technology
l Ultra Low On-Resistance
l Lead-Free
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The SOT-223 package is designed for surface-mount
using vapor phase, infra red, or wave soldering techniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application.
Thermal Resistance
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
www.irf.com
Description
Absolute Maximum Ratings
HEXFET
I
I
I
I
P
P
V
E
I
E
dv/dt
T
R
R
D
D
D
DM
AR
J,
D
D
GS
AS
AR
θJA
θJA
@ T
@ T
@ T
T
@T
@T
STG
A
A
A
A
A
= 25°C
= 25°C
= 70°C
= 25°C
= 25°C
®
Power MOSFET
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy*
Peak Diode Recovery dv/dt ƒ
Junction and Storage Temperature Range
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
Parameter
Parameter
GS
GS
GS
@ 10V**
@ 10V*
@ 10V*
G
Typ.
48
93
IRFL4310PbF
-55 to + 150
S
D
S O T -2 2 3
Max.
0.10
± 20
2.2
1.6
1.3
2.1
1.0
8.3
5.0
1.6
13
47
R
Max.
V
120
DS(on)
60
DSS
I
D
= 1.6A
= 100V
= 0.20Ω
PD - 95144
mW/°C
Units
Units
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
1
04/22/04

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IRFL4310TRPBF Summary of contents

Page 1

... Advanced Process Technology l Ultra Low On-Resistance l Lead-Free Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications ...

Page 2

IRFL4310PbF Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient ∆V /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward ...

Page 3

IRFL4310PbF 3 ...

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IRFL4310PbF 4 www.irf.com ...

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IRFL4310PbF 5 ...

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IRFL4310PbF 6 www.irf.com ...

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IRFL4310PbF 7 ...

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IRFL4310PbF SOT-223 (TO-261AA) Package Outline Dimensions are shown in milimeters (inches) SOT-223 (TO-261AA) Part Marking Information PRODUCT MARKING T HIS IS AN IRF L014 INT E RNAT IONAL F L014 ...

Page 9

SOT-223 (TO-261AA) Tape & Reel Information (. (. ...

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