IRFL014NTRPBF International Rectifier, IRFL014NTRPBF Datasheet

MOSFET N-CH 55V 1.9A SOT223

IRFL014NTRPBF

Manufacturer Part Number
IRFL014NTRPBF
Description
MOSFET N-CH 55V 1.9A SOT223
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheets

Specifications of IRFL014NTRPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
160 mOhm @ 1.9A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
1.9A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
11nC @ 10V
Input Capacitance (ciss) @ Vds
190pF @ 25V
Power - Max
1W
Mounting Type
Surface Mount
Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Current, Drain
1.9 A
Gate Charge, Total
7 nC
Package Type
SOT-223
Polarization
N-Channel
Power Dissipation
2.1 W
Resistance, Drain To Source On
0.16 Ohm
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
12 ns
Time, Turn-on Delay
6.6 ns
Transconductance, Forward
1.6 S
Voltage, Breakdown, Drain To Source
55 V
Voltage, Forward, Diode
1 V
Voltage, Gate To Source
±20 V
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
1.9 A
Mounting Style
SMD/SMT
Gate Charge Qg
7 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IRFL014NPBFTR
IRFL014NTRPBF
IRFL014NTRPBFTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRFL014NTRPBF
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IRFL014NTRPBF
Quantity:
9 000
Company:
Part Number:
IRFL014NTRPBF
Quantity:
12 000
www.irf.com
Description
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
Fifth Generation HEXFET
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The SOT-223 package is designed for surface-mount
using vapor phase, infrared, or wave soldering techniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application.
l
l
l
l
l
l
l
Absolute Maximum Ratings
Thermal Resistance
I
I
I
I
P
P
V
E
I
E
dv/dt
T
R
R
D
D
D
DM
AR
J,
D
D
GS
AS
AR
θJA
θJA
@ T
@ T
@ T
Surface Mount
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
Fast Switching
Fully Avalanche Rated
Lead-Free
@T
@T
T
STG
A
A
A
A
A
= 25°C
= 25°C
= 70°C
= 25°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy*
Peak Diode Recovery dv/dt ƒ
Junction and Storage Temperature Range
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
®
MOSFETs from International
®
power MOSFETs are well
Parameter
Parameter
GS
GS
GS
@ 10V**
@ 10V*
@ 10V*
G
Typ.
90
50
IRFL014NPbF
HEXFET
-55 to + 150
S
D
Max.
1.7
SOT-223
± 20
2.7
1.9
1.5
2.1
1.0
8.3
0.1
5.0
15
48
®
R
Max.
Power MOSFET
120
DS(on)
60
V
I
DSS
D
= 1.9A
= 0.16Ω
= 55V
mW/°C
Units
Units
V/ns
mJ
mJ
°C
W
W
V
A
1
06/07/04

Related parts for IRFL014NTRPBF

IRFL014NTRPBF Summary of contents

Page 1

Surface Mount l l Advanced Process Technology Ultra Low On-Resistance l Dynamic dv/dt Rating l l Fast Switching Fully Avalanche Rated l l Lead-Free Description ® Fifth Generation HEXFET MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely ...

Page 2

IRFL014NPbF Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V Breakdown Voltage Temp. Coefficient /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Q ...

Page 3

VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4. 4.5V 20µs PULSE WIDTH T = 25°C C 0.1 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100 ...

Page 4

IRFL014NPbF 350 1MHz iss 300 rss oss iss 250 C oss 200 150 C 100 ...

Page 5

Charge Fig 9a. Basic Gate Charge Waveform Current Regulator Same Type as D.U.T. 50KΩ .2µF 12V .3µF D.U. 3mA Current Sampling Resistors Fig 9b. Gate Charge ...

Page 6

IRFL014NPbF D.U 20V 0.01 Ω Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms 6 120 15V 100 DRIVER ...

Page 7

HEXFET PRODUCT MARKING T HIS IS AN IRFL014 INT ERNAT IONAL FL014 RECT IFIER LOGO T OP www.irf.com PART NUMBER 314P EMBLY S ITE DAT E CODE CODE (YYWW YEAR WW = WEEK P ...

Page 8

IRFL014NPbF 2.05 (.080) 1.95 (.077) TR FEED DIRECTION 12.10 (.475) 11.90 (.469) NOTES : 1. CONTROLLING DIMENSION: MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 3. EACH O330.00 (13.00) REEL CONTAINS 2,500 DEVICES. 13.20 (.519) 12.80 (.504) 330.00 (13.000) MAX. ...

Related keywords