IRF6721STR1PBF International Rectifier, IRF6721STR1PBF Datasheet

IRF6721STR1PBF

Manufacturer Part Number

IRF6721STR1PBF

Description

MOSFET N-CH 30V 14A DIRECTFET

Manufacturer

International Rectifier

Series

HEXFET®r

Datasheet

1.IRF6721STR1PBF.pdf (9 pages)

Specifications of IRF6721STR1PBF

Fet Type

MOSFET N-Channel, Metal Oxide

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

7.3 mOhm @ 14A, 10V

Drain To Source Voltage (vdss)

30V

Current - Continuous Drain (id) @ 25° C

14A

Vgs(th) (max) @ Id

2.4V @ 25µA

Gate Charge (qg) @ Vgs

17nC @ 4.5V

Input Capacitance (ciss) @ Vds

1430pF @ 15V

Power - Max

2.2W

Mounting Type

Surface Mount

Package / Case

DirectFET™ Isometric SQ

Transistor Polarity

N-Channel

Resistance Drain-source Rds (on)

10.9 mOhms

Drain-source Breakdown Voltage

30 V

Gate-source Breakdown Voltage

20 V

Continuous Drain Current

60 A

Power Dissipation

42 W

Gate Charge Qg

11 nC

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

IRF6721STR1PBFTR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

IRF6721STR1PBF

Manufacturer:

OMRN

Quantity:

6 556

Current page: 1 of 9
Download datasheet (269Kb)

Description

The IRF6721SPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET

the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is

compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection

soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET pack-

age allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

The IRF6721SPbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and

switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of

processors operating at higher frequencies. The IRF6721SPbF has been optimized for parameters that are critical in synchronous buck

operating from 12 volt bus converters including Rds(on) and gate charge to minimize losses.

Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)

‚

www.irf.com

Absolute Maximum Ratings

RoHS Compliant and Halogen Free

Low Profile (<0.7 mm)

Dual Sided Cooling Compatible

Ultra Low Package Inductance

Optimized for High Frequency Switching

Ideal for CPU Core DC-DC Converters

Optimized for Control FET application

Low Conduction and Switching Losses

Compatible with existing Surface Mount Techniques

100% Rg tested

Click on this section to link to the appropriate technical paper.

Click on this section to link to the DirectFET Website.

Surface mounted on 1 in. square Cu board, steady state.

@ T

Fig 1. Typical On-Resistance vs. Gate Voltage

= 25°C

= 70°C

= 25°C

T J = 25°C

V GS, Gate -to -Source Voltage (V)

Drain-to-Source Voltage

Gate-to-Source Voltage

Continuous Drain Current, V

Pulsed Drain Current

Single Pulse Avalanche Energy

Avalanche Current

T J = 125°C

Ãg

Parameter

I D = 14A

@ 10V

„

…

†

30V max ±20V max 5.1mΩ@ 10V 8.5mΩ@ 4.5V

Fig 2. Typical Total Gate Charge vs. Gate-to-Source Voltage

11nC

Repetitive rating; pulse width limited by max. junction temperature.

Starting T

g tot

14.0

12.0

10.0

8.0

6.0

4.0

2.0

0.0

DSS

measured with thermocouple mounted to top (Drain) of part.

I D = 11A

3.7nC

= 25°C, L = 1.1mH, R

IRF6721STRPbF

DirectFET™ Power MOSFET ‚

Q G , Total Gate Charge (nC)

1.3nC

IRF6721SPbF

V DS = 24V

V DS = 15V

gs2

Max.

110

±20

DS(on)

19nC

= 25Ω, I

DirectFET™ ISOMETRIC

packaging to achieve

7.9nC

= 11A.

oss

DS(on)

Units

04/30/09

1.9V

gs(th)

Related parts for IRF6721STR1PBF

IRF6721STR1PBF Summary of contents

Page 1

RoHS Compliant and Halogen Free l Low Profile (<0.7 mm) l Dual Sided Cooling Compatible l Ultra Low Package Inductance l Optimized for High Frequency Switching l Ideal for CPU Core DC-DC Converters l Optimized for Control ...

Page 2

Static @ T = 25°C (unless otherwise specified) J Parameter BV Drain-to-Source Breakdown Voltage DSS ∆ΒV /∆T Breakdown Voltage Temp. Coefficient DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) ∆V /∆T Gate Threshold Voltage Coefficient GS(th) ...

Page 3

Absolute Maximum Ratings 25°C Power Dissipation 70°C Power Dissipation 25°C Power Dissipation Peak Soldering Temperature P Operating Junction and Storage Temperature ...

Page 4

PULSE WIDTH Tj = 25°C 0.01 0 Drain-to-Source Voltage (V) Fig 4. Typical Output Characteristics 1000 15V ≤60µs PULSE WIDTH 100 150°C ...

Page 5

150°C 100 25° -40° 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1 Source-to-Drain Voltage (V) Fig 10. Typical Source-Drain Diode Forward Voltage ...

Page 6

DUT 0 1K 20K S Fig 15a. Gate Charge Test Circuit D.U 20V 0.01 Ω Fig 16a. Unclamped Inductive Test Circuit ≤ 1 ≤ 0.1 % Fig 17a. Switching Time ...

Page 7

D.U.T + ƒ • • - • + ‚ - • • • SD • Fig 18. ™ www.irf.com Driver Gate Drive P.W. D.U.T. I Waveform SD Reverse Recovery „ Current - + D.U.T. V Waveform DS Re-Applied G ...

Page 8

DirectFET™ Part Marking 8 DIMENSIONS METRIC MAX MIN CODE MIN 4.85 A 4.75 0.187 B 3.95 0.146 3.70 2.85 C 2.75 0.108 D 0.35 0.45 0.014 0.52 0.019 E 0.48 0.82 F 0.78 0.031 G 0.92 0.035 0.88 0.82 ...

Page 9

... DirectFET™ Tape & Reel Dimension (Showing component orientation). NOTE: Controlling dimensions in mm Std reel quantity is 4800 parts. (ordered as IRF6721STRPBF). For 1000 parts on 7" reel, order IRF6721STR1PBF CODE IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com ...

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