IRF6722MTR1PBF International Rectifier, IRF6722MTR1PBF Datasheet - Page 3
IRF6722MTR1PBF
Manufacturer Part Number
IRF6722MTR1PBF
Description
MOSFET N-CH 30V 13A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet
1.IRF6722MTR1PBF.pdf
(9 pages)
Specifications of IRF6722MTR1PBF
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
7.7 mOhm @ 13A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
13A
Vgs(th) (max) @ Id
2.4V @ 50µA
Gate Charge (qg) @ Vgs
17nC @ 4.5V
Input Capacitance (ciss) @ Vds
1300pF @ 15V
Power - Max
2.3W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MP
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
10.8 mOhms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
56 A
Power Dissipation
42 W
Gate Charge Qg
11 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IRF6722MTR1PBFTR
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Used double sided cooling , mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
(still air).
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fl
f
jl
kl
l
Parameter
Parameter
Ã
0.001
t 1 , Rectangular Pulse Duration (sec)
small clip heatsink (still air)
0.01
R
τ
θ
J
τ
is measured at
J
τ
1
Ci= τi/Ri
τ
1
Ci= τi/Ri
0.1
R
1
R
1
with
τ
2
R
τ
2
2
R
2
T
1
J
Typ.
12.5
–––
–––
of approximately 90°C.
1.0
20
R
τ
3
3
R
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
τ
3
3
τ
-40 to + 150
A
τ
A
Ri (°C/W)
Max.
0.018
footprint full size board with
metalized back and with small
clip heatsink (still air)
10
270
Mounted on minimum
2.3
1.5
IRF6722MPbF
42
6.3466
26.688
21.955
Max.
–––
–––
–––
3.0
55
0.00237
0.9124
43.9
100
τi (sec)
1000
Units
Units
°C/W
W/°C
°C
W
3