IRLU2908PBF International Rectifier, IRLU2908PBF Datasheet

MOSFET N-CH 80V 30A I-PAK

IRLU2908PBF

Manufacturer Part Number
IRLU2908PBF
Description
MOSFET N-CH 80V 30A I-PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRLU2908PBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
28 mOhm @ 23A, 10V
Drain To Source Voltage (vdss)
80V
Current - Continuous Drain (id) @ 25° C
30A
Vgs(th) (max) @ Id
2.5V @ 250µA
Gate Charge (qg) @ Vgs
33nC @ 4.5V
Input Capacitance (ciss) @ Vds
1890pF @ 25V
Power - Max
120W
Mounting Type
Through Hole
Package / Case
IPak, TO-251, DPak, VPak (3 straight leads + tab)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*IRLU2908PBF
Description
This HEXFET ® Power MOSFET utilizes the latest processing techniques
to achieve extremely low on-resistance per silicon area. Additional features
of this HEXFET power MOSFET are a 175°C junction operating temperature,
low R JC, fast switching speed and improved repetitive avalanche rating.
These features combine to make this design an extremely efficient and
reliable device for use in a wide variety of applications.
The D-Pak is designed for surface mounting using vapor phase, infrared,
or wave soldering techniques. The straight lead version (IRFU series) is
for through-hole mounting applications. Power dissipation levels up to 1.5
watts are possible in typical surface mount applications.
Features
I
I
I
I
P
V
E
E
I
E
dv/dt
T
T
R
R
R
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
D
D
D
DM
AR
J
STG
D
GS
AS
AS
AR
JC
JA
JA
@ T
@ T
@ T
@T
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
(tested)
C
C
C
C
= 25°C
= 100°C
= 25°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Maximum Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Junction-to-Case
Junction-to-Ambient (PCB Mount)
Junction-to-Ambient
Parameter
Parameter
e
GS
GS
GS
h
@ 10V (Silicon Limited)
@ 10V (See Fig. 9)
@ 10V
(Package Limited)
G
i
d
300 (1.6mm from case )
See Fig.12a,12b,15,16
HEXFET
Typ.
–––
–––
–––
IRLR2908PbF
D
S
-55 to + 175
D-Pak
Max.
0.77
IRLR2908PbF
IRLU2908PbF
± 16
150
120
180
250
2.3
39
28
30
®
R
Power MOSFET
Max.
DS(on)
110
V
1.3
40
DSS
I
IRLU2908PbF
D
= 30A
PD - 95552B
I-Pak
= 28m
= 80V
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
1

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IRLU2908PBF Summary of contents

Page 1

... Limited Parameter jà 95552B IRLR2908PbF IRLU2908PbF ® HEXFET Power MOSFET 80V DSS R = 28m DS(on 30A D S I-Pak D-Pak IRLU2908PbF IRLR2908PbF Max. Units 150 120 W 0.77 W/°C ± 180 mJ 250 See Fig.12a,12b,15, 2.3 V/ns - 175 °C 300 (1.6mm from case ) Typ. ...

Page 2

... Q Reverse Recovery Charge rr t Forward Turn-On Time on  ˆ Notes through are on page 11 ® HEXFET is a registered trademark of International Rectifier. 2 Min. Typ. Max. Units 80 ––– ––– 0V ––– 0.085 ––– V/°C Reference to 25°C, I – ...

Page 3

VGS TOP 15V 10V 4.5V 100 4.0V 3.5V 3.0V 2.7V BOTTOM 2. 0.1 20µs PULSE WIDTH Tj = 25°C 0.01 0.01 0 Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 1000 100 T ...

Page 4

0V MHZ C iss = SHORTED C rss = oss = 10000 C iss 1000 C oss ...

Page 5

Case Temperature (°C) Fig 9. Maximum Drain Current vs. Case Temperature 0.50 0.20 0.10 0.1 0.05 0.02 0.01 0.01 ...

Page 6

D.U 20V Fig 12a. Unclamped Inductive Test Circuit V (BR)DSS Fig 12b. Unclamped Inductive Waveforms Charge ...

Page 7

Duty Cycle = Single Pulse 100 0.01 10 0.05 0.10 1 0.1 1.0E-08 1.0E-07 Fig 15. Typical Avalanche Current vs.Pulsewidth 200 TOP Single Pulse BOTTOM 10% Duty Cycle 23A 150 100 ...

Page 8

D.U.T + ƒ ‚ -  SD Fig 17. Fig 18a. Switching Time Test Circuit V DS 90% 10 Fig 18b. Switching Time Waveforms 8 Driver Gate Drive P.W. D.U.T. I Waveform SD Reverse Recovery „ ...

Page 9

EXAMPLE: T HIS IS AN IRFR120 WIT H ASS EMBLY LOT CODE 1234 ASS EMBLED ON WW 16, 2001 SEMB LY LINE "A" Note: "P" in assembly line position indicates "Lead-Free" "P" in assembly line position ...

Page 10

E XAMPLE: T HIS IS AN IRF U120 WIT H AS SEMBLY LOT CODE 5678 ASS EMBLED ON WW 19, 2001 SEMBLY LINE "A" Note: "P" embly line pos ition indicates Lead-Free" OR ...

Page 11

TR 12.1 ( .476 ) 11.9 ( .469 ) NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 13 INCH NOTES : 1. OUTLINE CONFORMS ...

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