IRFBC30SPBF Vishay, IRFBC30SPBF Datasheet

MOSFET N-CH 600V 3.6A D2PAK

IRFBC30SPBF

Manufacturer Part Number
IRFBC30SPBF
Description
MOSFET N-CH 600V 3.6A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRFBC30SPBF

Transistor Polarity
N-Channel
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
2.2 Ohm @ 2.2A, 10V
Drain To Source Voltage (vdss)
600V
Current - Continuous Drain (id) @ 25° C
3.6A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
31nC @ 10V
Input Capacitance (ciss) @ Vds
660pF @ 25V
Power - Max
3.1W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Minimum Operating Temperature
- 55 C
Configuration
Single
Resistance Drain-source Rds (on)
2.2 Ohm @ 10 V
Drain-source Breakdown Voltage
600 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
3.6 A
Power Dissipation
3100 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Continuous Drain Current Id
3.6A
Drain Source Voltage Vds
600V
On Resistance Rds(on)
2.2ohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs Typ
4V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
*IRFBC30SPBF
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
e. Uses IRFBC30, SiHFBC30 data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91111
S10-2433-Rev. B, 25-Oct-10
I
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
2
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS (T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Single Pulse Avalanche Energy
Avalanche Current
Repetiitive Avalanche Energy
Maximum Power Dissipation
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
PAK
DS
DS(on)
g
gs
gd
SD
DD
(Max.) (nC)
(nC)
(V)
(nC)
 3.6 A, dI/dt  60 A/μs, V
= 50 V, starting T
(TO-262)
()
G
D
S
a
G
a, e
D
J
D
2
PAK (TO-263)
= 25 °C, L = 41 mH, R
S
e
c, e
a
DD
b, e
V
 V
GS
= 10 V
DS
, T
IRFBC30S, SiHFBC30S, IRFBC30L, SiHFBC30L
G
J
D
SiHFBC30S-GE3
IRFBC30SPbF
SiHFBC30S-E3
IRFBC30S
SiHFBC30S
Single
 150 °C.
2
600
N-Channel MOSFET
4.6
31
17
PAK (TO-263)
g
= 25 , I
C
= 25 °C, unless otherwise noted)
Power MOSFET
D
S
V
2.2
GS
AS
at 10 V
= 3.6 A (see fig. 12).
T
T
A
C
for 10 s
= 25 °C
= 25 °C
T
T
C
C
= 100 °C
= 25 °C
FEATURES
• Halogen-free According to IEC 61249-2-21
• Surface Mount (IRFBC30S, SiHFBC30S)
• Low-Profile Through-Hole (IRFBC30L, SiHFBC30L)
• Available in Tape and Reel (IRFBC30S, SiHFBC30S)
• Dynamic dV/dt Rating
• 150 °C Operating Temperature
• Fast Switching
• Fully Avalanche Rated
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The D
the accommodating die sizes up to HEX-4. It provides the
highest
on-resistance in any existing surface mount package. The
D
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface mount application. The
through-hole version (IRFBC30L, SiHFBC30L) is a available
for low-profile applications.
2
Definition
D
SiHFBC30STRL-GE3
IRFBC30STRLPbF
SiHFBC30STL-E3
-
-
PAK is suitable for high current applications because of
2
PAK (TO-263)
2
PAK is a surface mount power package capable of
power
SYMBOL
T
dV/dt
J
V
V
E
E
I
I
, T
P
device
DM
I
AR
GS
DS
AS
AR
D
D
stg
capability
a
a
a
design,
- 55 to + 150
and
LIMIT
I
SiHFBC30L-GE3
IRFBC30LPbF
SiHFBC30L-E3
IRFBC30L
SiHFBC30L
300
± 20
0.59
600
290
2
3.6
2.3
3.6
7.4
3.1
3.0
14
74
low
PAK (TO-262)
Vishay Siliconix
d
the
on-resistance
lowest
www.vishay.com
UNIT
W/°C
V/ns
possible
mJ
mJ
°C
W
V
A
A
and
1

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IRFBC30SPBF Summary of contents

Page 1

... N-Channel MOSFET its low internal connection resistance and can dissipate typical surface mount application. The through-hole version (IRFBC30L, SiHFBC30L available for low-profile applications PAK (TO-263) D PAK (TO-263) SiHFBC30S-GE3 SiHFBC30STRL-GE3 IRFBC30SPbF IRFBC30STRLPbF SiHFBC30S-E3 SiHFBC30STL-E3 IRFBC30S - SiHFBC30S - = 25 °C, unless otherwise noted °C C ...

Page 2

... IRFBC30S, SiHFBC30S, IRFBC30L, SiHFBC30L Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient (PCB a Mounted, steady-state) Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). For recommended footprint and soldering techniques refer to application note #AN-994. SPECIFICATIONS ( °C, unless otherwise noted) ...

Page 3

... TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) Fig Typical Output Characteristics Fig Typical Output Characteristics Document Number: 91111 S10-2433-Rev. B, 25-Oct-10 IRFBC30S, SiHFBC30S, IRFBC30L, SiHFBC30L Fig Normalized On-Resistance vs. Temperature Vishay Siliconix Fig Typical Transfer Characteristics www.vishay.com 3 ...

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... IRFBC30S, SiHFBC30S, IRFBC30L, SiHFBC30L Vishay Siliconix Fig Typical Capacitance vs. Drain-to-Source Voltage Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 Fig Typical Source-Drain Diode Forward Voltage Fig Maximum Safe Operating Area Document Number: 91111 S10-2433-Rev. B, 25-Oct-10 ...

Page 5

... Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case Vary t to obtain p required D.U. 0.01 Ω Fig. 12a - Unclamped Inductive Test Circuit Document Number: 91111 S10-2433-Rev. B, 25-Oct-10 IRFBC30S, SiHFBC30S, IRFBC30L, SiHFBC30L + Vishay Siliconix D.U. Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit ...

Page 6

... IRFBC30S, SiHFBC30S, IRFBC30L, SiHFBC30L Vishay Siliconix Fig. 12c - Maximum Avalanche Energy vs. Drain Current Charge Fig. 13a - Maximum Avalanche Energy vs. Drain Current www.vishay.com 6 Current regulator Same type as D.U.T. 50 kΩ 0.2 µF 0.3 µ D.U. Current sampling resistors Fig. 13b - Gate Charge Test Circuit Document Number: 91111 S10-2433-Rev ...

Page 7

... Note Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91111. Document Number: 91111 S10-2433-Rev ...

Page 8

... Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part ...

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