IPB09N03LA Infineon Technologies, IPB09N03LA Datasheet
IPB09N03LA
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IPB09N03LA Summary of contents
Page 1
... P-TO262-3-1 Ordering Code Marking Q67042-S4151 09N03LA Q67042-S4152 09N03LA Q67042-S4153 09N03LA Symbol Conditions =25 ° =100 ° =25 °C D,pulse = = = = /dt di /dt =200 A/µs, T =175 °C j,max =25 °C tot stg page 1 IPB09N03LA IPI09N03LA, IPP09N03LA P-TO220-3-1 Value Unit 350 kV/µs ± -55 ... 175 °C 55/175/56 2003-12-18 ...
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... A DS( SMD version SMD version |>2 DS(on)max = =2.4 K/W the chip is able to carry 64 A. thJC <- (one layer, 70 µm thick) copper area for drain page 2 IPB09N03LA IPI09N03LA, IPP09N03LA Values Unit typ. max 2.4 K 1.2 1 0.1 1 µ 100 - 10 100 nA - 12.4 15 12.1 15 ...
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... DS C oss f =1 MHz C rss t d( d(off g( plateau V =0 g(sync = oss =25 ° S,pulse = =25 ° = /dt =400 A/µs F page 3 IPB09N03LA IPI09N03LA, IPP09N03LA Values Unit typ. max. - 1240 1649 pF - 530 704 - 81 122 - 132 - 4 4.4 5 2.0 2.6 - 3.1 4.7 - 5 350 - 0.98 1 2003-12-18 ...
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... 0 [V] DS Rev. 1.3 2 Drain current I =f _10 150 200 0 4 Max. transient thermal impedance Z =f(t ) thJC p parameter µs 0.5 10 µs 1 0.2 100 µs 0.1 0. 0.1 0. 0.01 single pulse 0. 100 page 4 IPB09N03LA IPI09N03LA, IPP09N03LA 50 100 150 200 T [° [s] p 2003-12-18 ...
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... Typ. transfer characteristics I =f |>2 DS(on)max parameter 100 175 ° [V] GS Rev. 1.3 6 Typ. drain-source on resistance R =f =25 °C DS(on parameter 3.5 V 3 Typ. forward transconductance g =f =25 ° ° page 5 IPB09N03LA IPI09N03LA, IPP09N03LA 4.1 V 3 100 I [ [A] D 2003-12-18 ...
Page 6
... I D 2.5 2 1.5 1 0.5 0 100 140 180 -60 -20 12 Forward characteristics of reverse diode I =f parameter 1000 100 page 6 IPB09N03LA IPI09N03LA, IPP09N03LA =V DS 200 µA 20 µ 100 140 180 T [° °C 175°C 98% 175 °C 25°C 98% 0.5 1.0 1.5 2.0 V [V] SD 2003-12-18 ...
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... AV 15 Drain-source breakdown voltage V =f BR(DSS -60 - [°C] j Rev. 1.3 14 Typ. gate charge V =f =25 A pulsed GS gate D parameter ° 100 1000 0 16 Gate charge waveforms s(th (th 100 140 180 page 7 IPB09N03LA IPI09N03LA, IPP09N03LA [nC] gate gate 2003-12-18 ...
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... Package Outline P-TO263-3-2: Outline Footprint Dimensions in mm Rev. 1.3 IPI09N03LA, IPP09N03LA Packaging page 8 IPB09N03LA 2003-12-18 ...
Page 9
... P-TO262-3-1: Outline P-TO220-3-1: Outline Dimensions in mm Rev. 1.3 IPI09N03LA, IPP09N03LA Packaging page 9 IPB09N03LA 2003-12-18 ...
Page 10
... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.3 IPI09N03LA, IPP09N03LA page 10 IPB09N03LA 2003-12-18 ...