IPB100N06S3L-04 Infineon Technologies, IPB100N06S3L-04 Datasheet

MOSFET N-CH 55V 100A TO-263

IPB100N06S3L-04

Manufacturer Part Number
IPB100N06S3L-04
Description
MOSFET N-CH 55V 100A TO-263
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPB100N06S3L-04

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
3.5 mOhm @ 80A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
100A
Vgs(th) (max) @ Id
2.2V @ 150µA
Gate Charge (qg) @ Vgs
362nC @ 10V
Input Capacitance (ciss) @ Vds
17270pF @ 25V
Power - Max
214W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IPB100N06S3L-04
IPB100N06S3L-04INTR
IPB100N06S3L04XT
SP000102219

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IPB100N06S3L-04
Manufacturer:
INFINEON
Quantity:
12 500
Rev. 1.1
OptiMOS
Features
• N-channel - Enhancement mode
• Automotive AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Green product (RoHS compliant)
• 100% Avalanche tested
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Avalanche current, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Type
IPB100N06S3L-04
IPI100N06S3L-04
IPP100N06S3L-04
®
-T2 Power-Transistor
2)
3)
Package
PG-TO263-3-2
PG-TO262-3-1
PG-TO220-3-1
j
=25 °C, unless otherwise specified
1)
2)
Symbol
I
I
E
I
V
P
T
D
D,pulse
AS
j
AS
GS
tot
, T
Marking
3PN06L04
3PN06L04
3PN06L04
stg
PG-TO263-3-2
T
T
V
T
I
T
D
C
C
C
C
GS
=50 A
page 1
=25 °C, V
=100 °C,
=25 °C
=25 °C
=10 V
Conditions
2)
GS
Product Summary
V
R
I
D
=10 V
DS
DS(on),max
IPI100N06S3L-04, IPP100N06S3L-04
PG-TO262-3-1
(SMD version)
-55 ... +175
55/175/56
Value
1090
100
100
400
100
±16
214
IPB100N06S3L-04
PG-TO220-3-1
100
3.5
55
2007-11-07
Unit
A
mJ
A
V
W
°C
V
m
A

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IPB100N06S3L-04 Summary of contents

Page 1

... Marking 3PN06L04 3PN06L04 3PN06L04 Symbol Conditions I T =25 ° =100 ° = =25 °C D,pulse = =25 °C tot stg page 1 IPB100N06S3L-04 IPI100N06S3L-04, IPP100N06S3L-04 DS (SMD version) DS(on),max D PG-TO262-3-1 PG-TO220-3-1 Value =10 V 100 100 400 1090 100 ±16 214 -55 ... +175 55/175/ 3.5 m 100 A Unit °C 2007-11-07 ...

Page 2

... =150 µA GS(th = DSS T =25 ° = =125 ° = GSS =59 A DS(on = SMD version SMD version page 2 IPB100N06S3L-04 IPI100N06S3L-04, IPP100N06S3L-04 Values min. typ. max 0 1.2 1 100 = 100 - 4.9 6.2 - 4.6 5.9 - 3.1 3.8 - 2.8 3.5 Unit K µ 2007-11-07 ...

Page 3

... =25 ° S,pulse = =25 ° =27 /dt =100 A/µ 0.7 K/W the chip is able to carry 176 A at 25°C. For detailed thJC 2 (one layer, 70 µm thick) copper area for drain page 3 IPB100N06S3L-04 IPI100N06S3L-04, IPP100N06S3L-04 Values min. typ. max. - 17270 = 2165 - 2070 - 241 - 3 0.6 0.9 ...

Page 4

... V DS Rev. 1.1 2 Drain current I =f 120 100 150 200 4 Max. transient thermal impedance Z =f(t thJC parameter µs 10 µs 100 µ 100 [V] page 4 IPB100N06S3L-04 IPI100N06S3L-04, IPP100N06S3L-04 ≥ 100 150 T [° 0.5 0.1 0.05 0.01 single pulse - [s] p 200 - 2007-11-07 ...

Page 5

... GS DS parameter 200 150 100 Rev. 1.1 6 Typ. drain-source on-state resistance R = f(I DS(on) parameter 4 3 [V] 8 Typ. drain-source on-state resistance R = f(T DS(on) 6 -55 °C 25 °C 5 175 ° [V] page 5 IPB100N06S3L-04 IPI100N06S3L-04, IPP100N06S3L- ° 3 [ -60 - 100 T [° 100 120 140 180 2007-11-07 ...

Page 6

... V SD Rev. 1.1 10 Typ. capacitances 1500µ 100 140 180 12 Typ. avalanche characteristics parameter: T 1000 100 25 ° 0.8 1 1.2 1.4 [V] page 6 IPB100N06S3L-04 IPI100N06S3L-04, IPP100N06S3L- MHz DS GS Ciss Coss Crss [ j(start) 100°C 150° 100 t [µ 25°C 1000 2007-11-07 ...

Page 7

... T [° Typ. gate charge pulsed GS gate D parameter 100 150 Q gate Rev. 1.1 14 Drain-source breakdown voltage V BR(DSS 150 200 16 Gate charge waveforms 200 250 300 350 [nC] page 7 IPB100N06S3L-04 IPI100N06S3L-04, IPP100N06S3L- -60 - 100 T [° 140 180 Q Q gate gate 2007-11-07 ...

Page 8

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.1 IPI100N06S3L-04, IPP100N06S3L-04 page 8 IPB100N06S3L-04 2007-11-07 ...

Page 9

... IPB100N06S3L-04 Changes Removal of ordering code Implementation of avalanche current single pulse Update of Infineon address Removal of foot note 3, avalanche diagrams Implementation of Qrr and trr typ Update of disclaimer Implementation of RoHS and AEC logo, update of feature list ...

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