IRF9530STRLPBF Vishay, IRF9530STRLPBF Datasheet

MOSFET P-CH 100V 12A D2PAK

IRF9530STRLPBF

Manufacturer Part Number
IRF9530STRLPBF
Description
MOSFET P-CH 100V 12A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRF9530STRLPBF

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
300 mOhm @ 7.2A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
12A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
38nC @ 10V
Input Capacitance (ciss) @ Vds
860pF @ 25V
Power - Max
3.7W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Transistor Polarity
P Channel
Continuous Drain Current Id
-12A
Drain Source Voltage Vds
-100V
On Resistance Rds(on)
300mohm
Rds(on) Test Voltage Vgs
-10V
Leaded Process Compatible
Yes
Configuration
Single
Resistance Drain-source Rds (on)
0.3 Ohms
Drain-source Breakdown Voltage
- 100 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
12 A
Power Dissipation
3.7 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91077
S10-1728-Rev. B, 02-Aug-10
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS (T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Linear Derating Factor (PCB Mount)
Single Pulse Avalanche Energy
Avalanche Current
Repetiitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
DS
DS(on)
g
gs
gd
SD
DD
(Max.) (nC)
(nC)
(V)
(nC)
 - 12 A, dI/dt  140 A/μs, V
= - 25 V, starting T
G D
()
D
S
2
PAK (TO-263)
a
a
J
= 25 °C, L = 4.2 mH, R
c
a
b
V
DD
GS
 V
= - 10 V
e
G
DS
, T
P-Channel MOSFET
e
Single
D
SiHF9530S-GE3
IRF9530SPbF
SiHF9530S-E3
IRF9530S
SiHF9530S
- 100
J
6.8
38
21
2
 175 °C.
PAK (TO-263)
g
C
S
D
= 25 , I
= 25 °C, unless otherwise noted)
Power MOSFET
V
0.30
GS
at - 10 V
AS
T
T
= - 12 A (see fig. 12).
C
A
for 10 s
= 25 °C
= 25 °C
T
T
C
C
= 100 °C
= 25 °C
FEATURES
• Halogen-free According to IEC 61249-2-21
• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• P-Channel
• 175 °C Operating Temperature
• Fast Switching
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The D
capable of accommodating die sizes up to HEX-4. It
provides the highest power capability and the lowest
possible on-resistance in any existing surface mount
package. The D
applications because of its low internal connection
resistance and can dissipate up to 2.0 W in a typical surface
mount application.
Definition
D
SiHF9530STRL-GE3
IRF9530STRLPbF
SiHF9530STL-E3
IRF9530STRL
SiHF9530STL
2
PAK (TO-263)
2
PAK (TO-263) is a surface mount power package
SYMBOL
T
dV/dt
J
V
V
E
E
I
I
, T
P
device
DM
I
AR
GS
DS
AS
AR
D
D
a
a
stg
2
PAK (TO-263) is suitable for high current
a
IRF9530S, SiHF9530S
a
a
design,
- 55 to + 175
LIMIT
0.025
- 100
300
± 20
- 8.2
0.59
- 5.5
D
SiHF9530STRR-GE3
IRF9530STRRPbF
SiHF9530STR-E3
IRF9530STRR
SiHF9530STR
- 12
- 48
- 12
400
8.8
3.7
88
low
2
PAK (TO-263)
Vishay Siliconix
d
on-resistance
a
www.vishay.com
a
a
a
UNIT
W/°C
a
V/ns
mJ
mJ
°C
W
V
A
A
and
1

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IRF9530STRLPBF Summary of contents

Page 1

... D package. The D P-Channel MOSFET applications because of its low internal connection resistance and can dissipate typical surface mount application PAK (TO-263) D PAK (TO-263) SiHF9530S-GE3 SiHF9530STRL-GE3 IRF9530SPbF IRF9530STRLPbF SiHF9530S-E3 SiHF9530STL-E3 IRF9530S IRF9530STRL SiHF9530S SiHF9530STL = 25 °C, unless otherwise noted ° 100 ° ...

Page 2

... IRF9530S, SiHF9530S Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Maximum Junction-to-Ambient a (PCB Mount) Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS ( °C, unless otherwise noted) J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage ...

Page 3

... Document Number: 91077 S10-1728-Rev. B, 02-Aug- µs Pulse Width ° 91077_03 = 25 ° 4 µs Pulse Width T = 175 ° 91077_04 = 175 °C Fig Normalized On-Resistance vs. Temperature C IRF9530S, SiHF9530S Vishay Siliconix ° ° 10 175 C 20 µs Pulse Width Gate-to-Source Voltage ( Fig Typical Transfer Characteristics 3.0 ...

Page 4

... IRF9530S, SiHF9530S Vishay Siliconix 1800 MHz iss gs 1500 rss oss ds 1200 C 900 C 600 300 Drain-to-Source Voltage ( 91077_05 Fig Typical Capacitance vs. Drain-to-Source Voltage Total Gate Charge (nC) 91077_06 G Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com Shorted iss 10 oss rss 10 91076_07 Fig Typical Source-Drain Diode Forward Voltage ...

Page 5

... Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case Document Number: 91077 S10-1728-Rev. B, 02-Aug-10 125 150 175 Single Pulse (Thermal Response Rectangular Pulse Duration (s) 1 IRF9530S, SiHF9530S Vishay Siliconix D.U. Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit ...

Page 6

... IRF9530S, SiHF9530S Vishay Siliconix Vary t to obtain p required I AS D.U. 0.01 Ω Fig. 12a - Unclamped Inductive Test Circuit 91077_12c Fig. 12c - Maximum Avalanche Energy vs. Drain Current Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com Fig. 12b - Unclamped Inductive Waveforms 1200 Top ...

Page 7

... Note Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91077. Document Number: 91077 S10-1728-Rev ...

Page 8

... Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part ...

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