IRF9530 Vishay, IRF9530 Datasheet

MOSFET P-CH 100V 12A TO-220AB

IRF9530

Manufacturer Part Number
IRF9530
Description
MOSFET P-CH 100V 12A TO-220AB
Manufacturer
Vishay
Datasheet

Specifications of IRF9530

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
300 mOhm @ 7.2A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
12A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
38nC @ 10V
Input Capacitance (ciss) @ Vds
860pF @ 25V
Power - Max
88W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF9530

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Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91076
S-81272-Rev. A, 16-Jun-08
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
Mounting Torque
DS
DS(on)
g
gs
gd
SD
DD
(Max.) (nC)
(nC)
(nC)
(V)
≤ - 12 A, dI/dt ≤ 140 A/µs, V
= - 25 V, starting T
(Ω)
TO-220
G
a
D
J
S
= 25 °C, L = 4.2 mH, R
c
a
a
V
b
GS
DD
= - 10 V
≤ V
G
DS
, T
P-Channel MOSFET
Single
- 100
J
6.8
38
21
≤ 175 °C.
G
S
D
= 25 Ω, I
C
Power MOSFET
0.30
V
= 25 °C, unless otherwise noted
GS
at - 10 V
6-32 or M3 screw
AS
T
= - 12 A (see fig. 12).
C
for 10 s
= 25 °C
T
T
C
TO-220
IRF9530PbF
SiHF9530-E3
IRF9530
SiHF9530
C
= 100 °C
= 25 °C
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• P-Channel
• 175 °C Operating Temperature
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 W. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
SYMBOL
T
dV/dt
J
V
V
E
E
device
I
I
P
, T
I
DM
AR
DS
GS
AS
AR
D
D
stg
design,
IRF9530, SiHF9530
- 55 to + 175
LIMIT
- 100
± 20
- 8.2
- 5.5
300
0.59
- 12
- 48
400
- 12
8.8
1.1
88
10
low
Vishay Siliconix
d
on-resistance
www.vishay.com
lbf · in
N · m
UNIT
W/°C
RoHS*
COMPLIANT
V/ns
mJ
mJ
°C
W
V
A
A
Available
and
1

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IRF9530 Summary of contents

Page 1

... TO-220 IRF9530PbF SiHF9530-E3 IRF9530 SiHF9530 = 25 °C, unless otherwise noted ° 100 ° °C C for screw = 25 Ω (see fig. 12 ≤ 175 ° IRF9530, SiHF9530 Vishay Siliconix device design, low on-resistance SYMBOL LIMIT V - 100 DS V ± 8 0.59 E 400 ...

Page 2

... IRF9530, SiHF9530 Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Case-to-Sink, Flat, Greased Surface Maximum Junction-to-Case (Drain) SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current Drain-Source On-State Resistance ...

Page 3

... TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Fig Typical Output Characteristics, T Fig Typical Output Characteristics, T Document Number: 91076 S-81272-Rev. A, 16-Jun- °C Fig Typical Transfer Characteristics C Fig Normalized On-Resistance vs. Temperature = 175 °C C IRF9530, SiHF9530 Vishay Siliconix www.vishay.com 3 ...

Page 4

... IRF9530, SiHF9530 Vishay Siliconix Fig Typical Capacitance vs. Drain-to-Source Voltage Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 Fig Typical Source-Drain Diode Forward Voltage Fig Maximum Safe Operating Area Document Number: 91076 S-81272-Rev. A, 16-Jun-08 ...

Page 5

... Fig Maximum Drain Current vs. Case Temperature Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case Document Number: 91076 S-81272-Rev. A, 16-Jun-08 IRF9530, SiHF9530 Vishay Siliconix D.U. Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit d(on) r d(off Fig. 10b - Switching Time Waveforms www ...

Page 6

... IRF9530, SiHF9530 Vishay Siliconix Vary t to obtain p required I AS D.U 0.01 Ω Fig. 12a - Unclamped Inductive Test Circuit Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com Fig. 12c - Maximum Avalanche Energy vs. Drain Current Fig. 12b - Unclamped Inductive Waveforms Current regulator Same type as D.U.T. ...

Page 7

... SD • D.U.T. - device under test Period D = Period P.W. waveform SD Body diode forward current dI/dt waveform DS Diode recovery dV/dt Body diode forward drop Ripple ≤ for logic level and - 3 V drive devices GS Fig For P-Channel IRF9530, SiHF9530 Vishay Siliconix + + P. www.vishay.com 7 ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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