IRFL024ZTRPBF International Rectifier, IRFL024ZTRPBF Datasheet

MOSFET N-CH 55V 5.1A SOT223

IRFL024ZTRPBF

Manufacturer Part Number
IRFL024ZTRPBF
Description
MOSFET N-CH 55V 5.1A SOT223
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRFL024ZTRPBF

Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Mounting Type
Surface Mount
Power - Max
1W
Fet Type
MOSFET N-Channel, Metal Oxide
Gate Charge (qg) @ Vgs
14nC @ 10V
Vgs(th) (max) @ Id
4V @ 250µA
Current - Continuous Drain (id) @ 25° C
5.1A
Drain To Source Voltage (vdss)
55V
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
57.5 mOhm @ 3.1A, 10V
Transistor Polarity
N Channel
Continuous Drain Current Id
5.1A
Drain Source Voltage Vds
55V
On Resistance Rds(on)
57.5mohm
Rds(on) Test Voltage Vgs
10V
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRFL024ZTRPBF
Manufacturer:
IR
Quantity:
8 000
Part Number:
IRFL024ZTRPBF
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRFL024ZTRPBF
0
Company:
Part Number:
IRFL024ZTRPBF
Quantity:
8 000
Company:
Part Number:
IRFL024ZTRPBF
Quantity:
10 000
Features
l
l
l
l
l
l
Description
This HEXFET
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of
this design are a 150°C junction operating temperature,
fast switching speed and improved repetitive
avalanche rating . These features combine to make
this design an extremely efficient and reliable device
for use in a wide variety of applications.
I
I
I
P
P
V
E
E
I
E
T
T
R
R
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
D
D
DM
AR
J
STG
D
D
GS
AS (Thermally limited)
AS
AR
JA
JA
@ T
@ T
Advanced Process Technology
Ultra Low On-Resistance
150°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
@T
@T
(Tested )
A
A
A
A
= 25°C
= 70°C
= 25°C Power Dissipation
= 25°C Power Dissipation
®
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Junction-to-Ambient (PCB mount, steady state)
Junction-to-Ambient (PCB mount, steady state)
Power MOSFET utilizes the latest
Ù
j
Parameter
Parameter
GS
GS
g
@ 10V
@ 10V
d
(Silicon Limited)
h
j
G
IRFL024ZPbF
HEXFET
Typ.
See Fig.12a, 12b, 15, 16
–––
–––
D
S
-55 to + 150
Max.
0.02
± 20
5.1
4.1
2.8
1.0
41
13
32
®
R
DS(on)
Power MOSFET
V
I
DSS
Max.
D
120
45
SOT-223
= 5.1A
= 57.5m
PD - 95312A
= 55V
Units
Units
W/°C
°C/W
mJ
mJ
°C
W
A
V
A
1

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IRFL024ZTRPBF Summary of contents

Page 1

Features Advanced Process Technology l Ultra Low On-Resistance l 150°C Operating Temperature l Fast Switching l Repetitive Avalanche Allowed up to Tjmax l Lead-Free l Description ® This HEXFET Power MOSFET utilizes the latest processing techniques to achieve extremely low ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) gfs Forward Transconductance I Drain-to-Source Leakage Current DSS I Gate-to-Source Forward ...

Page 3

VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 10 4.5V 30µs PULSE WIDTH Tj = 25° Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 100 150°C 10 ...

Page 4

0V MHZ C iss = SHORTED C rss = oss = 1000 C iss C oss 100 ...

Page 5

T A ,Ambient Temperature (°C) Fig 9. Maximum Drain Current vs. Ambient Temperature 100 D = 0.50 0.20 10 0.10 0.05 0.02 1 0.01 0.1 SINGLE PULSE ( THERMAL ...

Page 6

D.U 20V Fig 12a. Unclamped Inductive Test Circuit V (BR)DSS Fig 12b. Unclamped Inductive Waveforms Charge ...

Page 7

Duty Cycle = Single Pulse 1 0.01 0.05 0.10 0.1 0.01 1.0E-05 1.0E-04 Fig 15. Typical Avalanche Current vs.Pulsewidth 14 TOP Single Pulse BOTTOM 1% Duty Cycle 3. ...

Page 8

D.U.T + ƒ ‚ -  SD Fig 17. Fig 18a. Switching Time Test Circuit V DS 90% 10 Fig 18b. Switching Time Waveforms 8 Driver Gate Drive P.W. D.U.T. I Waveform SD Reverse Recovery „ ...

Page 9

HEXFET PRODUCT MARKING THIS IS AN IRFL014 INT ERNAT IONAL RECTIF IER LOGO Notes: 1. For an Automotive Qualified version of this part please see http://www.irf.com/product-info/auto/ 2. For the most current drawing please refer to IR website at http://www.irf.com/package/ www.irf.com ...

Page 10

TR FEED DIRECTION 12.10 (.475) 11.90 (.469) NOTES : 1. CONTROLLING DIMENSION: MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 3. EACH O330.00 (13.00) REEL CONTAINS 2,500 DEVICES. 13.20 (.519) 12.80 (.504) 330.00 (13.000) MAX. NOTES ...

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