IRFL024ZPBF International Rectifier, IRFL024ZPBF Datasheet

MOSFET N-CH 55V 5.1A SOT223

IRFL024ZPBF

Manufacturer Part Number
IRFL024ZPBF
Description
MOSFET N-CH 55V 5.1A SOT223
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheets

Specifications of IRFL024ZPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
57.5 mOhm @ 3.1A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
5.1A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
14nC @ 10V
Input Capacitance (ciss) @ Vds
340pF @ 25V
Power - Max
1W
Mounting Type
Surface Mount
Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Current, Drain
5.1 A
Gate Charge, Total
9.1 nC
Package Type
SOT-223
Polarization
N-Channel
Power Dissipation
1 W
Resistance, Drain To Source On
46.2 Milliohms
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
30 ns
Time, Turn-on Delay
7.8 ns
Transconductance, Forward
6.2 S
Voltage, Breakdown, Drain To Source
55 V
Voltage, Forward, Diode
1.3 V
Voltage, Gate To Source
±20 V
Configuration
Single Dual Drain
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
57.5 m Ohms
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
5.1 A
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Fall Time
23 ns
Gate Charge Qg
9.1 nC
Minimum Operating Temperature
- 55 C
Rise Time
21 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*IRFL024ZPBF
Features
l
l
l
l
l
l
Description
This HEXFET
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of
this design are a 150°C junction operating temperature,
fast switching speed and improved repetitive
avalanche rating . These features combine to make
this design an extremely efficient and reliable device
for use in a wide variety of applications.
I
I
I
P
P
V
E
E
I
E
T
T
R
R
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
D
D
DM
AR
J
STG
D
D
GS
AS (Thermally limited)
AS
AR
JA
JA
@ T
@ T
Advanced Process Technology
Ultra Low On-Resistance
150°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
@T
@T
(Tested )
A
A
A
A
= 25°C
= 70°C
= 25°C Power Dissipation
= 25°C Power Dissipation
®
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Junction-to-Ambient (PCB mount, steady state)
Junction-to-Ambient (PCB mount, steady state)
Power MOSFET utilizes the latest
Ù
j
Parameter
Parameter
GS
GS
g
@ 10V
@ 10V
d
(Silicon Limited)
h
j
G
IRFL024ZPbF
HEXFET
Typ.
See Fig.12a, 12b, 15, 16
–––
–––
D
S
-55 to + 150
Max.
0.02
± 20
5.1
4.1
2.8
1.0
41
13
32
®
R
DS(on)
Power MOSFET
V
I
DSS
Max.
D
120
45
SOT-223
= 5.1A
= 57.5m
PD - 95312A
= 55V
Units
Units
W/°C
°C/W
mJ
mJ
°C
W
A
V
A
1

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IRFL024ZPBF Summary of contents

Page 1

... Storage Temperature Range STG Thermal Resistance R Junction-to-Ambient (PCB mount, steady state Junction-to-Ambient (PCB mount, steady state) JA www.irf.com G Parameter @ 10V (Silicon Limited 10V GS ™ Parameter 95312A IRFL024ZPbF ® HEXFET Power MOSFET 55V DSS R = 57.5m DS(on 5. SOT-223 Max. Units 5.1 4.1 41 2.8 1.0 W 0.02 W/° ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) gfs Forward Transconductance I Drain-to-Source Leakage Current DSS I Gate-to-Source Forward ...

Page 3

VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 10 4.5V 30µs PULSE WIDTH Tj = 25° Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 100 150°C 10 ...

Page 4

0V MHZ C iss = SHORTED C rss = oss = 1000 C iss C oss 100 ...

Page 5

T A ,Ambient Temperature (°C) Fig 9. Maximum Drain Current vs. Ambient Temperature 100 D = 0.50 0.20 10 0.10 0.05 0.02 1 0.01 0.1 SINGLE PULSE ( THERMAL ...

Page 6

D.U 20V Fig 12a. Unclamped Inductive Test Circuit V (BR)DSS Fig 12b. Unclamped Inductive Waveforms Charge ...

Page 7

Duty Cycle = Single Pulse 1 0.01 0.05 0.10 0.1 0.01 1.0E-05 1.0E-04 Fig 15. Typical Avalanche Current vs.Pulsewidth 14 TOP Single Pulse BOTTOM 1% Duty Cycle 3. ...

Page 8

D.U.T + ƒ ‚ -  SD Fig 17. Fig 18a. Switching Time Test Circuit V DS 90% 10 Fig 18b. Switching Time Waveforms 8 Driver Gate Drive P.W. D.U.T. I Waveform SD Reverse Recovery „ ...

Page 9

HEXFET PRODUCT MARKING THIS IS AN IRFL014 INT ERNAT IONAL RECTIF IER LOGO Notes: 1. For an Automotive Qualified version of this part please see http://www.irf.com/product-info/auto/ 2. For the most current drawing please refer to IR website at http://www.irf.com/package/ www.irf.com ...

Page 10

TR FEED DIRECTION 12.10 (.475) 11.90 (.469) NOTES : 1. CONTROLLING DIMENSION: MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 3. EACH O330.00 (13.00) REEL CONTAINS 2,500 DEVICES. 13.20 (.519) 12.80 (.504) 330.00 (13.000) MAX. NOTES ...

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