IRF6714MTRPBF International Rectifier, IRF6714MTRPBF Datasheet

MOSFET N-CH 25V 29A DIRECTFET

IRF6714MTRPBF

Manufacturer Part Number
IRF6714MTRPBF
Description
MOSFET N-CH 25V 29A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF6714MTRPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
2.1 mOhm @ 29A, 10V
Drain To Source Voltage (vdss)
25V
Current - Continuous Drain (id) @ 25° C
29A
Vgs(th) (max) @ Id
2.4V @ 100µA
Gate Charge (qg) @ Vgs
44nC @ 4.5V
Input Capacitance (ciss) @ Vds
3890pF @ 13V
Power - Max
2.8W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MX
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
3.4 mOhms
Drain-source Breakdown Voltage
25 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
166 A
Power Dissipation
89 W
Gate Charge Qg
29 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
l
l
l
l
l
l
l
l
l
l
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)

ƒ
www.irf.com
Description
The IRF6714MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET
the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows
dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6714MPbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and
switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of
processors operating at higher frequencies. The IRF6714MPbF has been optimized for parameters that are critical in synchronous buck
including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6714MPbF offers particularly low Rds(on) and high Cdv/dt
immunity for synchronous FET applications.
V
V
I
I
I
I
E
I
Absolute Maximum Ratings
D
D
D
DM
AR
RoHs Compliant and Halogen Free 
Low Profile (<0.6 mm)
Dual Sided Cooling Compatible 
Ultra Low Package Inductance
Optimized for High Frequency Switching 
Ideal for CPU Core DC-DC Converters
Optimized for Sync. FET socket of Sync. Buck Converter
Low Conduction and Switching Losses
Compatible with existing Surface Mount Techniques 
100% Rg tested
DS
GS
AS
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
@ T
@ T
@ T
SQ
5
4
3
2
1
0
A
A
C
2
= 25°C
= 70°C
= 25°C
T J = 25°C
Fig 1. Typical On-Resistance Vs. Gate Voltage
4
V GS, Gate -to -Source Voltage (V)
SX
6
8
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Single Pulse Avalanche Energy
Avalanche Current
ST
10
T J = 125°C
12
14
16
I D = 29A
g
Parameter
18
MQ
GS
GS
GS
@ 10V
@ 10V
@ 10V
20
f
MX
25V max ±20V max 1.6mΩ@ 10V 2.6mΩ@ 4.5V
Q
29nC
T
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
V
C
g tot
measured with thermocouple mounted to top (Drain) of part.
DSS
14
12
10
8
6
4
2
0
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage
MT
0

J
I D = 23A
8.3nC
= 25°C, L = 0.651mH, R
Q
IRF6714MTRPbF
10
gd
V
DirectFET™ Power MOSFET ‚
GS
MP
Q G Total Gate Charge (nC)
20
MX
IRF6714MPbF
V DS = 20V
V DS = 13V
4.1nC
Q
gs2
30
Max.
166
234
175
±20
25
29
23
23
R
40
DS(on)
36nC
G
Q
= 25Ω, I
rr
50
TM
DirectFET™ ISOMETRIC
packaging to achieve
AS
60
23nC
Q
= 23A.
oss
70
R
DS(on)
Units
V
mJ
1.9V
80
V
A
A
04/29/09
gs(th)
1

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IRF6714MTRPBF Summary of contents

Page 1

... Fig 1. Typical On-Resistance Vs. Gate Voltage  Click on this section to link to the appropriate technical paper. ‚ Click on this section to link to the DirectFET Website. ƒ Surface mounted on 1 in. square Cu board, steady state. www.irf.com IRF6714MTRPbF V DSS 25V max ±20V max 1.6mΩ@ 10V 2.6mΩ@ 4. tot gd 29nC 8 ...

Page 2

Parameter BV Drain-to-Source Breakdown Voltage DSS ∆ΒV /∆T Breakdown Voltage Temp. Coefficient DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) ∆V /∆T Gate Threshold Voltage Coefficient GS(th Drain-to-Source Leakage Current DSS I Gate-to-Source Forward ...

Page 3

Absolute Maximum Ratings 25°C Power Dissipation D A Power Dissipation 70° 25°C Power Dissipation D C Peak Soldering Temperature Operating Junction and J T Storage Temperature ...

Page 4

PULSE WIDTH Tj = 25°C 0.01 0 Drain-to-Source Voltage (V) Fig 4. Typical Output Characteristics 1000 15V ≤60µs PULSE WIDTH 100 ...

Page 5

150° 25° -40° 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1 Source-to-Drain Voltage (V) Fig 10. Typical Source-Drain Diode Forward ...

Page 6

DUT 0 1K 20K S Fig 15a. Gate Charge Test Circuit D.U 20V 0.01 Ω Fig 16a. Unclamped Inductive Test Circuit ≤ 1 ≤ 0.1 % Fig 17a. Switching Time ...

Page 7

D.U.T + ƒ • • - • + ‚ -  • • • SD • Fig 18. ™ www.irf.com Driver Gate Drive P.W. D.U.T. I Waveform SD Reverse Recovery „ Current - + D.U.T. V Waveform DS ...

Page 8

DIM EN SION S METRIC CO DE MIN 6.25 6.35 0.246 B 4.80 5.05 0.189 0.152 C 3.85 3.95 D 0.35 0.45 0.014 0.027 E 0.68 0.72 0.027 F 0.68 0.72 G 1.42 0.054 ...

Page 9

... NOTE: Controlling dimensions in mm Std reel quantity is 4800 parts. (ordered as IRF6714MTRPBF). For 1000 parts on 7" reel, order IRF6714MTR1PBF STANDARD OPTION (QTY 4800) CODE NOTE: CONTROLLING DIMENSIONS WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com REEL DIMENSIONS ...

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