IRFB4410ZGPBF International Rectifier, IRFB4410ZGPBF Datasheet

MOSFET N-CH 100V 97A TO-220AB

IRFB4410ZGPBF

Manufacturer Part Number
IRFB4410ZGPBF
Description
MOSFET N-CH 100V 97A TO-220AB
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRFB4410ZGPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
9 mOhm @ 58A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
97A
Vgs(th) (max) @ Id
4V @ 150µA
Gate Charge (qg) @ Vgs
120nC @ 10V
Input Capacitance (ciss) @ Vds
4820pF @ 50V
Power - Max
230W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
97 A
Power Dissipation
230 W
Mounting Style
Through Hole
Gate Charge Qg
83 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Benefits
l
l
l
l
l
www.irf.com
Applications
l
l
l
l
Absolute Maximum Ratings
I
I
I
P
V
dv/dt
T
T
Avalanche Characteristics
E
I
E
Thermal Resistance
R
R
R
D
D
DM
AR
J
STG
D
GS
AS (Thermally limited)
AR
θJC
θCS
θJA
@ T
@ T
High Efficiency Synchronous Rectification in SMPS
Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
Fully Characterized Capacitance and Avalanche
Enhanced body diode dV/dt and dI/dt Capability
Lead-Free
Halogen-Free
Uninterruptible Power Supply
High Speed Power Switching
Hard Switched and High Frequency Circuits
SOA
@T
Symbol
Symbol
C
C
C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Pulsed Drain Current
Maximum Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
Mounting torque, 6-32 or M3 screw
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Junction-to-Case
Case-to-Sink, Flat Greased Surface , TO-220
Junction-to-Ambient, TO-220
i
Parameter
Parameter
Ã
e
GS
@ 10V (Silicon Limited)
d
G
Gate
G
S
D
See Fig. 14, 15, 22a, 22b,
Typ.
0.50
IRFB4410ZGPbF
–––
–––
V
R
I
D (Silicon Limited)
IRFB4410ZGPbF
DSS
DS(on)
10lbf
D
-55 to + 175
TO-220AB
x
Max.
in (1.1N
Drain
HEXFET Power MOSFET
390
230
± 20
300
242
1.5
97
69
16
D
typ.
max.
G
x
D
m)
S
Max.
0.65
–––
62
7.2m
9.0m
Source
100V
97A
PD - 96213
S
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
01/06/09
1

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IRFB4410ZGPBF Summary of contents

Page 1

... Limited à Parameter i IRFB4410ZGPbF HEXFET Power MOSFET V D DSS R typ. DS(on) max (Silicon Limited TO-220AB IRFB4410ZGPbF G D Drain Max 390 230 1.5 ± - 175 300 x x 10lbf in (1.1N m) 242 See Fig. 14, 15, 22a, 22b, Typ. Max. ––– ...

Page 2

Static @ T = 25°C (unless otherwise specified) J Symbol Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V /∆T Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) I Drain-to-Source Leakage Current DSS I ...

Page 3

VGS TOP 15V 10V 8.0V 6.0V 5.5V 5.0V 100 4.8V BOTTOM 4.5V 4.5V 10 ≤ 60µs PULSE WIDTH Tj = 25° Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 1000 ...

Page 4

175° 25°C 1 0.1 0.0 0.5 1.0 1 Source-to-Drain Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage 100 100 ...

Page 5

D = 0.50 0.20 0.1 0.10 0.05 0.02 0.01 0.01 0.001 1E-006 Fig 13. Maximum Effective Transient Thermal Impedance, Junction-to-Case 100 Duty Cycle = Single Pulse 0.05 10 0.10 1 Allowed avalanche Current vs avalanche pulsewidth, tav, assuming ∆Τ ...

Page 6

150µA 2 250µ 1.0mA 1 1.0A 1.0 -75 -50 - 100 125 150 175 200 Temperature ...

Page 7

D.U.T + ƒ ‚ -  • • • SD • Fig 21 D.U 20V 0.01 Ω Fig 22a. Unclamped Inductive Test Circuit Second Pulse ...

Page 8

TO-220AB packages are not recommended for Surface Mount Application. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 8 Data and specifications subject to change without notice. This product has been designed and qualified for ...

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