IRF1010EL International Rectifier, IRF1010EL Datasheet

MOSFET N-CH 60V 84A TO-262

IRF1010EL

Manufacturer Part Number
IRF1010EL
Description
MOSFET N-CH 60V 84A TO-262
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF1010EL

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
12 mOhm @ 50A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
84A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
130nC @ 10V
Input Capacitance (ciss) @ Vds
3210pF @ 25V
Power - Max
200W
Mounting Type
Through Hole
Package / Case
TO-262-3 (Straight Leads)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF1010EL

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF1010EL
Manufacturer:
IR
Quantity:
12 500
l
l
l
l
l
l
Description
Absolute Maximum Ratings
Thermal Resistance
Advanced HEXFET
Rectifier utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET power MOSFETs
are well known for, provides the designer with an
extremely efficient and reliable device for use in a wide
variety of applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
low internal connection resistance and can dissipate up to
2.0W in a typical surface mount application.
The through-hole version (IRF1010EL) is available for low-
profile applications.
www.irf.com
I
I
I
P
V
I
E
dv/dt
T
T
R
R
D
D
DM
AR
2
J
STG
D
GS
AR
Pak is suitable for high current applications because of its
@ T
@ T
JC
JA
Advanced Process Technology
Surface Mount (IRF1010ES)
Low-profile through-hole (IRF1010EL)
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
2
C
C
C
Pak is a surface mount power package capable of
= 25°C
= 100°C
= 25°C
®
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Junction-to-Ambient (PCB mount)**
Power MOSFETs from International
Parameter
Parameter


ƒ
GS
GS

@ 10V
@ 10V
G
Typ.
300 (1.6mm from case )
–––
–––
10 lbf•in (1.1N•m)
HEXFET
-55 to + 175
IRF1010ES
S
D
D
Max.
84
330
200
± 20
1.4
4.0
59
50
17
2
Pak
®
IRF1010ES
IRF1010EL
R
Power MOSFET
DS(on)
Max.
V
0.75
I
40
D
DSS
= 84A‡
IRF1010EL
TO-262
PD - 91720
= 60V
= 12m
Units
Units
°C/W
W/°C
V/ns
mJ
°C
W
A
V
A
02/14/02
1

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IRF1010EL Summary of contents

Page 1

... The 2 D Pak is suitable for high current applications because of its low internal connection resistance and can dissipate typical surface mount application. The through-hole version (IRF1010EL) is available for low- profile applications. Absolute Maximum Ratings Parameter 25° ...

Page 2

... IRF1010ES/IRF1010EL Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 1000  ° 100  V DS 20µs PULSE WIDTH Gate-to-Source Voltage (V) GS Fig 3. Typical Transfer Characteristics www.irf.com IRF1010ES/IRF1010EL  1000 TOP BOTTOM 100 ° 10 0.1 10 100 Fig 2. Typical Output Characteristics 3 2.5 2.0  ° 175 C J 1.5 1.0 ...

Page 4

... IRF1010ES/IRF1010EL 6000 0V, C iss = rss = C gd 5000 C oss = Ciss 4000 3000 Coss 2000 Crss 1000 Drain-to-Source Voltage (V) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 100  ° 175 ° 0.1 0.0 0.6 1.2 V ,Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode Forward Voltage 4 20 ...

Page 5

... Case Temperature 0.50 0.20 0.1 0.10 0.05  SINGLE PULSE 0.02 (THERMAL RESPONSE) 0.01 0.01 0.00001 0.0001 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com IRF1010ES/IRF1010EL R G Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 150 175 ° 10 d(on) Fig 10b ...

Page 6

... IRF1010ES/IRF1010EL Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform 6 800 600 + - 400 200 Starting T , Junction Temperature ( C) Fig 12c. Maximum Avalanche Energy Fig 13b. Gate Charge Test Circuit  I D TOP 20A 35A ...

Page 7

... Reverse Polarity of D.U.T for P-Channel Driver Gate Drive D.U.T. I Reverse Recovery Current D.U.T. V Re-Applied Voltage Inductor Curent *** V Fig 14. For N-channel www.irf.com IRF1010ES/IRF1010EL Peak Diode Recovery dv/dt Test Circuit + Circuit Layout Considerations * Low Stray Inductance Ground Plane ƒ Low Leakage Inductance Current Transformer - - dv/dt controlled controlled by Duty Factor " ...

Page 8

... IRF1010ES/IRF1010EL 2 D Pak Package Outline 1 0.54 (.4 15) 1 0.29 (.4 05) 1.4 0 (.055 ) - AX. 2 1 (.6 10) 1 (.5 80 1.40 (.0 55) 3X 1.14 (.0 45) 0 .93 (. .69 (. .08 (. .25 (. FTER IP & 4.5M , 198 TRO L LIN SIO ATSINK & Pak Part Marking Information TIO 4.69 (.1 85) 4.20 (.1 65) 1 ...

Page 9

... TO-262 Package Outline TO-262 Part Marking Information www.irf.com IRF1010ES/IRF1010EL 9 ...

Page 10

... IRF1010ES/IRF1010EL 2 D Pak Tape & Reel Information TIO . -418 . LIN SIO LIM DIM DIST WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 (. (. (. (. 1 1 .42 (. .22 (. .75 (. 0 .25 (. 0 13.50 (.532 ) 2 7.4 0 (1.079 ) 12.80 (.504 ) 2 3.9 0 (.9 41 ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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