IXTK110N30 IXYS, IXTK110N30 Datasheet

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IXTK110N30

Manufacturer Part Number
IXTK110N30
Description
MOSFET N-CH 300V 110A TO-264
Manufacturer
IXYS
Series
MegaMOS™r
Datasheet

Specifications of IXTK110N30

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
26 mOhm @ 500mA, 10V
Drain To Source Voltage (vdss)
300V
Current - Continuous Drain (id) @ 25° C
110A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
390nC @ 10V
Input Capacitance (ciss) @ Vds
7800pF @ 25V
Power - Max
730W
Mounting Type
Through Hole
Package / Case
TO-264AA
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.026 Ohms
Drain-source Breakdown Voltage
300 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
110 A
Power Dissipation
730 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Vdss, Max, (v)
300
Id(cont), Tc=25°c, (a)
110
Rds(on), Max, Tj=25°c, (?)
0.025
Ciss, Typ, (pf)
7800
Qg, Typ, (nc)
390
Trr, Typ, (ns)
350
Pd, (w)
730
Rthjc, Max, (k/w)
0.17
Package Style
TO-264
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
© 2003 IXYS All rights reserved
High Current
MegaMOS
N-Channel Enhancement Mode
Symbol
V
V
V
V
I
I
I
I
E
E
dv/dt
P
T
T
T
T
M
Weight
Symbol
(T
V
V
I
I
R
D(RMS)
DM
AR
D25
GSS
DSS
J
JM
stg
L
DGR
GS
GSM
AR
D
GS(th)
DSS
AS
DSS
DS(on)
d
J
= 25°C unless otherwise specified)
T
1.6 mm (0.063 in.) from case for 10 s
Mounting torque
TO-264
Test conditions
T
T
Continuous
Transient
T
External lead current limit
T
T
I
T
Test Conditions
V
V
V
V
V
V
Pulse test, t 300 ms, duty cycle d 2%
T
T
S
C
J
J
C
C
C
J
GS
GS
C
C
DS
GS
DS
GS
= 25°C to 150°C
= 25°C to 150°C; R
= 25 C MOSFET chip capability
= 25 C, pulse width limited by T
= 25 C
= 25 C
= 25 C
= 25 C
= 0 V, I
= V
= ±20 V DC, V
= V
= 0 V
= 10 V, I
I
150 C, R
DM
GS
DSS
, di/dt
, I
TM
D
D
= 1 mA
D
= 250 A
= 0.5 I
G
FET
100 A/ s, V
= 2
DS
D25
= 0
GS
= 1.0 M
DD
T
T
Advance Technical Information
J
J
V
= 25°C
= 125°C
DSS
JM
300
IXTK 110N30
Min. Typ.
2.0
Characteristic Values
-55 ... +150
-55 ... +150
Maximum ratings
0.7/6
±20
±30
300
300
110
440
730
150
300
4.0
75
90
80
10
5
±200
4.0
50
26 m
Nm/lb.in.
Max.
3 mA
V/ns
mJ
nA
W
V
C
C
C
C
A
A
A
A
V
A
g
J
V
V
V
V
TO-264 AA (IXTK)
G = Gate
S = Source
Features
Applications
Advantages
V
I
R
Low R
Rugged polysilicon gate cell structure
International standard package
Fast switching times
Motor controls
DC choppers
Switched-mode power supplies
Easy to mount with one screw
(isolated mounting screw hole)
Space savings
High power density
D25
DSS
DS(on)
G
DS (on)
D
S
HDMOS
= 300
= 110
=
D
Tab = Drain
TM
26 m
= Drain
process
DS99013(03/03)
V
A
D (TAB)

Related parts for IXTK110N30

IXTK110N30 Summary of contents

Page 1

... ± GSS DSS DS DSS 0.5 I DS(on D25 Pulse test, t 300 ms, duty cycle d 2% © 2003 IXYS All rights reserved Advance Technical Information IXTK 110N30 Maximum ratings 300 = 1.0 M 300 ±20 ±30 110 75 440 4 DSS 730 -55 ... +150 150 -55 ... +150 300 0.7/6 ...

Page 2

... S GS Pulse test, t 300 µs, duty cycle 25A, -di/dt = 100 A/µ IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: Characteristic values Min. Typ. Max. 85 101 7800 1700 ...

Page 3

... V - Volts DS Fig Normalized to I DS(on) Junction Temperature 2 0.5 -50 - Degrees Centigrade J Fig. 5. Drain Current vs. Case T emperature -50 - Degrees Centigrade C © 2003 IXYS All rights reserved Value vs. D25 I = 55A IXTK 110N30 Fig. 2. Output Characteristics @ 125 Deg 4 Volts DS Fig Normalized to I DS(on) Value vs. I ...

Page 4

... Q - nanoCoulombs G Fig. 11. Maximum Transient Thermal Resistance 1 0.1 0. Pulse Width - milliseconds IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents 0000 1 000 240 320 400 000 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1 ...

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