NTR4003NT1G ON Semiconductor, NTR4003NT1G Datasheet

MOSFET N-CH 30V 500MA SOT-23

NTR4003NT1G

Manufacturer Part Number
NTR4003NT1G
Description
MOSFET N-CH 30V 500MA SOT-23
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTR4003NT1G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
1.5 Ohm @ 10mA, 4V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
500mA
Vgs(th) (max) @ Id
1.4V @ 250µA
Gate Charge (qg) @ Vgs
1.15nC @ 5V
Input Capacitance (ciss) @ Vds
21pF @ 5V
Power - Max
690mW
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.5 Ohm @ 4 V
Forward Transconductance Gfs (max / Min)
0.33 S
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.5 A
Power Dissipation
690 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTR4003NT1G
NTR4003NT1GOSTR

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NTR4003N
Small Signal MOSFET
30 V, 0.56 A, Single N−Channel, SOT−23
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size
2. Surface−mounted on FR4 board using the minimum recommended pad size.
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 0
THERMAL RESISTANCE RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − t < 10 s (Note 1)
Junction−to−Ambient − Steady State (Note 2)
Design
Low Gate Voltage Threshold (V
Low Gate Charge for Fast Switching
ESD Protected Gate
SOT−23 Package Provides Excellent Thermal Performance
Minimum Breakdown Voltage Rating of 30 V
These are Pb−Free Devices
Notebooks:
Portable Applications
(Cu area = 1.127 in sq [1 oz] including traces).
Level Shifters
Logic Switches
Low Side Load Switches
Parameter
Parameter
(T
J
Steady
State
t < 10 s
= 25°C unless otherwise noted)
Steady State
t
p
t < 5 s
= 10 ms
T
T
T
T
GS(TH)
A
A
A
A
= 25°C
= 85°C
= 25°C
= 85°C
) to Facilitate Drive Circuit
Symbol
Symbol
V
V
Tstg
R
R
R
I
P
P
T
DSS
T
I
I
DM
I
GS
D
D
S
qJA
qJA
qJA
J
D
D
L
,
−55 to
Value
0.37
0.69
0.56
0.40
0.83
Max
±20
150
260
180
150
300
0.5
1.7
1.0
30
1
°C/W
Unit
Unit
°C
°C
W
W
V
V
A
A
A
A
†For information on tape and reel specifications,
NTR4003NT1G
NTR4003NT3G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
V
Device
(BR)DSS
1
*Date Code orientation and overbar may vary
30 V
CASE 318
STYLE 21
(Note: Microdot may be in either location)
depending upon manufacturing location.
SOT−23
2
TR8
M
G
ORDERING INFORMATION
1
http://onsemi.com
3
(Pb−Free)
(Pb−Free)
Package
SOT−23
SOT−23
1.0 W @ 4.0 V
1.5 W @ 2.5 V
= Specific Device Code
= Date Code
= Pb−Free Package
N−Channel
R
DS(on)
MARKING DIAGRAM/
PIN ASSIGNMENT
Publication Order Number:
3
Gate
TYP
1
TR8 M G
2
Drain
10,000/Tape & Reel
3000/Tape & Reel
3
G
Source
Shipping
NTR4003N/D
2
I
D
0.56 A
MAX

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NTR4003NT1G Summary of contents

Page 1

... A DM ° − 150 Tstg I 1 °C T 260 L NTR4003NT1G Symbol Max Unit °C/W R 180 qJA NTR4003NT3G 150 R qJA R 300 qJA †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. ...

Page 2

ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance CHARGES AND CAPACITANCES ...

Page 3

TYPICAL PERFORMANCE CURVES 1 1.2 0.8 0 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 2.4 2.8 3 GATE−TO−SOURCE ...

Page 4

TYPICAL PERFORMANCE CURVES DRAIN−TO−SOURCE VOLTAGE (V) Figure 7. Capacitance Variation 1 0.1 0.01 0.001 0.4 Figure 9. Diode Forward Voltage vs. Current NTR4003N (T = 25°C unless otherwise noted) J ...

Page 5

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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