IPP100N04S2-04 Infineon Technologies, IPP100N04S2-04 Datasheet

MOSFET N-CH 40V 100A TO220-3

IPP100N04S2-04

Manufacturer Part Number
IPP100N04S2-04
Description
MOSFET N-CH 40V 100A TO220-3
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPP100N04S2-04

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
3.6 mOhm @ 80A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
100A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
172nC @ 10V
Input Capacitance (ciss) @ Vds
5300pF @ 25V
Power - Max
300W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
3.6 m Ohms
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
100 A
Power Dissipation
300 W
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SP000219056

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IPP100N04S2-04
Manufacturer:
INFINEON
Quantity:
12 500
Rev. 1.0
OptiMOS
Features
• N-channel - Enhancement mode
• Automotive AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Ultra low Rds(on)
• 100% Avalanche tested
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
Type
IPB100N04S2-04
IPP100N04S2-04
Green package (lead free)
®
Power-Transistor
2)
4)
Package
PG-TO263-3-2
PG-TO220-3-1
j
=25 °C, unless otherwise specified
1)
2)
Symbol
I
I
E
V
P
T
D
D,pulse
j
AS
GS
tot
, T
Ordering Code
SP0002-19061
SP0002-19056
stg
T
T
V
T
I
T
D
C
C
C
C
GS
=80A
page 1
=25 °C, V
=100 °C,
=25 °C
=25 °C
=10 V
Conditions
2)
GS
PG-TO263-3-2
Product Summary
V
R
I
Marking
PN0404
PN0404
D
=10 V
DS
DS(on),max
(SMD version)
-55 ... +175
Value
100
100
400
810
±20
300
PG-TO220-3-1
IPB100N04S2-04
IPP100N04S2-04
100
3.3
40
2006-03-02
Unit
A
mJ
V
W
°C
V
m
A

Related parts for IPP100N04S2-04

IPP100N04S2-04 Summary of contents

Page 1

... Ordering Code SP0002-19061 SP0002-19056 Symbol Conditions I T =25 ° =100 ° = =25 °C D,pulse =80A =25 °C tot stg page 1 IPB100N04S2-04 IPP100N04S2-04 DS (SMD version) DS(on),max D PG-TO220-3-1 Marking PN0404 PN0404 Value =10 V 100 100 400 810 ±20 300 -55 ... +175 40 V 3.3 m 100 A Unit °C 2006-03-02 ...

Page 2

... (BR)DSS =250 µA GS(th = DSS T =25 ° = =125 ° = GSS = =80 A, DS( SMD version page 2 IPB100N04S2-04 IPP100N04S2-04 Values min. typ. max 0 2.1 3 100 = 100 - 2.8 3.6 - 2.5 3.3 Unit K µA nA mΩ 2006-03-02 ...

Page 3

... =25 ° S,pulse = =25 ° = /dt =100 A/µ = /dt =100 A/µ 0.5K/W the chip is able to carry 210A at 25°C. For detailed thJC 2 (one layer, 70 µm thick) copper area for drain page 3 IPB100N04S2-04 IPP100N04S2-04 Values min. typ. max. - 5300 = 2200 - 580 - = 125 - 4 0 153 Unit ...

Page 4

... V DS Rev. 1.0 2 Drain current 120 100 150 200 4 Max. transient thermal impedance Z = f(t thJC parameter µs 10 µs 100 µ 100 [V] page 4 IPB100N04S2-04 IPP100N04S2- ≥ 100 150 T [° 0.5 0.1 0.05 0.01 single pulse - [s] p 200 - 2006-03-02 ...

Page 5

... V GS Rev. 1.0 6 Typ. drain-source on-state resistance DS(on) parameter 6. 6.0V 6 5. [V] 8 Typ. Forward transconductance parameter: g 200 150 100 50 -55 ° [V] page 5 IPB100N04S2-04 IPP100N04S2- ° 5. [ 25° 100 150 I [ 6.5V 10V 100 120 200 2006-03-02 ...

Page 6

... GS(th) parameter 3.5 3 2.5 2 1.5 1 0.5 0 100 140 180 12 Typical forward diode characteristicis IF = f(V SD parameter Ciss Coss 2 10 Crss [V] page 6 IPB100N04S2-04 IPP100N04S2- 1250µA 250µA -60 - 100 T [° °C 175 °C 0 0.2 0.4 0.6 0 [V] SD 140 180 1.2 1.4 2006-03-02 ...

Page 7

... T [° Typ. drain-source breakdown voltage BR(DSS -60 - [°C] j Rev. 1.0 14 Typ. gate charge V = f(Q GS gate 125 175 0 16 Gate charge waveforms 100 140 180 page 7 IPB100N04S2-04 IPP100N04S2- 100A pulsed 120 Q [nC] gate gate gate 2006-03-02 32V ...

Page 8

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 IPB100N04S2-04 IPP100N04S2-04 2006-03-02 ...

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