IRFD123 Vishay, IRFD123 Datasheet

HEX/MOS N-CH 100V 1A 4-DIP

IRFD123

Manufacturer Part Number
IRFD123
Description
HEX/MOS N-CH 100V 1A 4-DIP
Manufacturer
Vishay
Datasheet

Specifications of IRFD123

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
270 mOhm @ 780mA, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
1.3A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
16nC @ 10V
Input Capacitance (ciss) @ Vds
360pF @ 25V
Power - Max
1.3W
Mounting Type
Through Hole
Package / Case
*
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRFD123
Quantity:
40
Part Number:
IRFD123
Quantity:
5 510
Part Number:
IRFD123
Manufacturer:
NSC
Quantity:
5 510
Company:
Part Number:
IRFD123
Quantity:
43
Part Number:
IRFD123D
Manufacturer:
IR
Quantity:
20 000
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 90161
S-82994-Rev. A, 12-Jan-09
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
DS
DS(on)
g
gs
gd
SD
DD
(Max.) (nC)
(nC)
(nC)
(V)
≤ 9.2 A, dI/dt ≤ 110 A/µs, V
= 25 V, starting T
(Ω)
D
HEXDIP
a
S
J
G
= 25 °C, L = 22 mH, R
c
a
a
b
DD
V
GS
≤ V
= 10 V
G
DS
, T
N-Channel MOSFET
Single
J
100
≤ 175 °C.
4.4
7.7
16
G
= 25 Ω, I
D
S
C
Power MOSFET
= 25 °C, unless otherwise noted
V
0.27
GS
AS
at 10 V
= 2.6 A (see fig. 12).
T
for 10 s
C
= 25 °C
T
T
C
C
HEXDIP
IRFD123PbF
SiHFD123-E3
IRFD123
SiHFD123
= 100 °C
= 25 °C
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• For Automatic Insertion
• End Stackable
• 175 °C Operating Temperature
• Fast Switching
• Ease of Paralleling
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The 4 pin DIP package is a low cost machine-insertable case
style which can be stacked in multiple combinations on
standard 0.1" pin centers. The dual drain serves as a thermal
link to the mounting surface for power dissipation levels up to
1 W.
SYMBOL
T
dV/dt
J
V
V
E
E
I
I
P
, T
device
I
DM
AR
DS
GS
AS
AR
D
D
stg
IRFD123, SiHFD123
design,
- 55 to + 175
0.0083
LIMIT
300
± 20
0.94
0.13
100
100
1.3
1.3
1.3
5.5
10
low
Vishay Siliconix
d
on-resistance
www.vishay.com
UNIT
W/°C
V/ns
RoHS*
COMPLIANT
mJ
mJ
°C
W
V
A
A
Available
and
1

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IRFD123 Summary of contents

Page 1

... W. HEXDIP IRFD123PbF SiHFD123-E3 IRFD123 SiHFD123 = 25 °C, unless otherwise noted ° 100 ° °C C for Ω 2.6 A (see fig. 12 ≤ 175 ° IRFD123, SiHFD123 Vishay Siliconix device design, low on-resistance SYMBOL LIMIT V 100 DS V ± 1 0. 0.0083 E 100 ...

Page 2

... IRFD123, SiHFD123 Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current Drain-Source On-State Resistance Forward Transconductance Dynamic Input Capacitance Output Capacitance ...

Page 3

... TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Fig Typical Output Characteristics, T Fig Typical Output Characteristics, T Document Number: 90161 S-82994-Rev. A, 12-Jan- °C Fig Typical Transfer Characteristics C Fig Normalized On-Resistance vs. Temperature = 175 °C C IRFD123, SiHFD123 Vishay Siliconix www.vishay.com 3 ...

Page 4

... IRFD123, SiHFD123 Vishay Siliconix Fig Typical Capacitance vs. Drain-to-Source Voltage Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 Fig Typical Source-Drain Diode Forward Voltage Fig Maximum Safe Operating Area Document Number: 90161 S-82994-Rev. A, 12-Jan-09 ...

Page 5

... Fig Maximum Drain Current vs. Case Temperature Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case Document Number: 90161 S-82994-Rev. A, 12-Jan-09 IRFD123, SiHFD123 Vishay Siliconix D.U. Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit d(on) r d(off) f Fig. 10b - Switching Time Waveforms www ...

Page 6

... IRFD123, SiHFD123 Vishay Siliconix Vary t to obtain p required I AS D.U. 0. Fig. 12a - Unclamped Inductive Test Circuit Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com Fig. 12c - Maximum Avalanche Energy vs. Drain Current Fig. 12b - Unclamped Inductive Waveforms Current regulator Same type as D.U.T. ...

Page 7

... D.U.T. - device under test P.W. Period D = Period P.W. waveform SD Body diode forward current dI/dt waveform DS Diode recovery dV/dt Body diode forward drop Ripple ≤ for logic level devices and 3 V drive devices Fig For N-Channel IRFD123, SiHFD123 Vishay Siliconix + + www.vishay.com 7 ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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