IRF9530NS International Rectifier, IRF9530NS Datasheet

MOSFET P-CH 100V 14A D2PAK

IRF9530NS

Manufacturer Part Number
IRF9530NS
Description
MOSFET P-CH 100V 14A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF9530NS

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
200 mOhm @ 8.4A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
14A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
58nC @ 10V
Input Capacitance (ciss) @ Vds
760pF @ 25V
Power - Max
3.8W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF9530NS

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Description
Absolute Maximum Ratings
Thermal Resistance
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRF9530NL) is available for low-
profile applications.
I
I
I
P
P
V
E
I
E
dv/dt
T
T
R
R
AR
D
D
DM
2
AS
AR
J
STG
D
D
GS
Pak is suitable for high current applications because of
JA
@ T
@ T
JC
@T
@T
Advanced Process Technology
Surface Mount (IRF9530NS)
Low-profile through-hole (IRF9530NL)
175°C Operating Temperature
Fast Switching
P-Channel
Fully Avalanche Rated
2
C
C
Pak is a surface mount power package capable of
A
C
= 25°C
= 25°C
= 100°C
= 25°C
on-resistance per silicon area.
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
Parameter
Parameter
GS
GS
@ -10V
@ -10V
This
G
300 (1.6mm from case )
Typ.
–––
–––
D P ak
IRF9530NS/L
HEXFET
2
-55 to + 175
S
D
Max.
0.53
-8.4
-5.0
± 20
250
-14
-10
-56
3.8
7.9
79
®
R
T O -26 2
Power MOSFET
V
DS(on)
Max.
1.9
DSS
40
I
D
= -14A
PD - 91523A
= -100V
= 0.20
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
5/13/98

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IRF9530NS Summary of contents

Page 1

... Advanced Process Technology Surface Mount (IRF9530NS) Low-profile through-hole (IRF9530NL) 175°C Operating Temperature Fast Switching P-Channel Fully Avalanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. benefit, combined with the fast switching speed and ...

Page 2

... IRF9530NS/L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... BOTTOM - rain-to-S ource V oltage ( Fig 2. Typical Output Characteristics 2.5 -14A 2.0 1.5 1.0 0.5 0 -60 -40 - Junction Temperature ( C) J Fig 4. Normalized On-Resistance Vs. Temperature IRF9530NS/L -4.5V 2 0µ 175° ° -10V 100 120 140 160 180 ° ...

Page 4

... IRF9530NS iss iss oss C rss rain-to-S ourc e V oltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 0° 5° 0.1 0.4 0.6 0.8 1 ourc e-to-D rain V oltage ( Fig 7. Typical Source-Drain Diode Forward Voltage Fig 6. Typical Gate Charge Vs. 1000 100 Single Pulse 1.2 1.4 1.6 1 Fig 8 ...

Page 5

... Fig 9. Maximum Drain Current Vs. Case Temperature 0 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case -10V Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit t d(on 10% 150 175 ° 90 Fig 10b. Switching Time Waveforms ula lse D u ratio IRF9530NS D.U. µ d(off 0 ...

Page 6

... IRF9530NS Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Q G -10V Charge Fig 13a. Basic Gate Charge Waveform 700 600 500 400 300 200 100 0 25 Fig 12c. Maximum Avalanche Energy V (BR)DSS 12V Fig 13b. Gate Charge Test Circuit ...

Page 7

... D.U.T. V Waveform DS Re-Applied Voltage Body Diode Inductor Curent Ripple *** V = 5.0V for Logic Level and 3V Drive Devices GS Fig 14. For P-Channel HEXFETS IRF9530NS/L Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + dv/dt controlled controlled by Duty Factor "D" SD D.U.T. - Device Under Test P ...

Page 8

... IRF9530NS Pak Package Outline 1 0.54 (.4 15) 1 0.29 (.4 05) 1.4 0 (.055 ) - AX. 2 1 (.6 10) 1 (.5 80 1.40 (.0 55) 3X 1.14 (.0 45) 0 .93 (. .69 (. .08 (. .25 (. FTER IP & 4.5M , 198 TRO L LIN SIO ATSINK & Part Marking Information 2 D Pak TIO 4.69 (.1 85) 4.20 (.1 65) 1 ...

Page 9

... Package Outline TO-262 Outline Part Marking Information TO-262 IRF9530NS/L ...

Page 10

... IRF9530NS/L Tape & Reel Information 2 D Pak IRE CTIO (. (. IRE C TIO N 33 0.00 (1 4 LLIN ILL WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel 6172 96590 IR FAR EAST: K& ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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