IRFP9140N International Rectifier, IRFP9140N Datasheet

MOSFET P-CH 100V 23A TO-247AC

IRFP9140N

Manufacturer Part Number
IRFP9140N
Description
MOSFET P-CH 100V 23A TO-247AC
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRFP9140N

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
117 mOhm @ 13A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
23A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
97nC @ 10V
Input Capacitance (ciss) @ Vds
1300pF @ 25V
Power - Max
140W
Mounting Type
Through Hole
Package / Case
TO-247-3 (Straight Leads), TO-247AC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRFP9140N

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Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The TO-247 package is preferred for commercial-
industrial applications where higher power levels
preclude the use of TO-220 devices. The TO-247 is
similar but superior to the earlier TO-218 package
because of its isolated mounting hole.
Absolute Maximum Ratings
Thermal Resistance
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
R
D
D
DM
AR
J
STG
D
GS
AS
AR
@ T
@ T
JC
CS
JA
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
P-Channel
Fast Switching
Fully Avalanche Rated
@T
C
C
C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
PRELIMINARY
GS
GS
@ -10V
@ -10V
G
Typ.
300 (1.6mm from case )
0.24
–––
–––
HEXFET
10 lbf•in (1.1N•m)
-55 to + 175
S
D
IRFP9140N
Max.
TO-247AC
0.91
-5.0
140
± 20
430
-23
-16
-76
-11
14
®
R
Power MOSFET
DS(on)
V
Max.
–––
DSS
1.1
40
I
D
= -23A
PD - 9.1492A
= -100V
= 0.117
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
W
°C
A
V
A
3/16/98

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IRFP9140N Summary of contents

Page 1

... J T Storage Temperature Range STG Soldering Temperature, for 10 seconds Mounting torque, 6- screw Thermal Resistance Parameter R Junction-to-Case JC R Case-to-Sink, Flat, Greased Surface CS R Junction-to-Ambient JA IRFP9140N PRELIMINARY HEXFET TO-247AC Max. @ -10V GS @ -10V GS 0.91 -5.0 - 175 300 (1.6mm from case ) 10 lbf•in (1.1N•m) Typ. – ...

Page 2

... IRFP9140N Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Fig 3. Typical Transfer Characteristics 100 VGS TOP - 15V - 10V - 8.0V - 7.0V - 6.0V - 5.5V - 5.0V BOTTOM - 4. 0 rain-to-S ource V oltage ( Fig 2. Typical Output Characteristics 2 -19A D 2.0 1.5 1.0 0.5 0 -60 -40 - Junction T em perature (° Fig 4. Normalized On-Resistance Vs. Temperature IRFP9140N -4.5V 20µ 175° 100 V = -10V ...

Page 4

... IRFP9140N 3000 2500 oss ds gd 2000 1500 1000 500 rain-to-S ource V oltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 175° 25° 0.1 0.2 0.4 0.6 0.8 1 ource-to-D rain V oltage ( Fig 7. Typical Source-Drain Diode Forward Voltage 100 0 Fig 6. Typical Gate Charge Vs. 1000 TIO LIM ITE D ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case -10V Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit t d(on 10% 150 175 ° 90 Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.001 0. Rectangular Pulse Duration (sec) 1 IRFP9140N D.U. µ d(off ...

Page 6

... IRFP9140N -20V 0. Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Q G -10V Charge Fig 13a. Basic Gate Charge Waveform 1200 1000 800 600 15V 400 200 tarting T , Junction T em perature (°C ) Fig 12c. Maximum Avalanche Energy 12V V Fig 13b. Gate Charge Test Circuit ...

Page 7

... D.U.T. V Waveform DS Re-Applied Voltage Body Diode Inductor Curent Ripple *** V = 5.0V for Logic Level and 3V Drive Devices GS Fig 14. For P-Channel HEXFETS IRFP9140N Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + dv/dt controlled controlled by Duty Factor "D" SD D.U.T. - Device Under Test P ...

Page 8

... IRFP9140N Package Outline TO-247AC Outline Dimensions are shown in millimeters (inches) 1 5.90 (. 5.30 (. .30 (. .70 (. 4 4 .40 (. .00 (. 5. Part Marking Information TO-247AC ITH WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel 1883 732020 IR CANADA: 7321 Victoria Park Ave ...

Page 9

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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