IRL1104L International Rectifier, IRL1104L Datasheet

MOSFET N-CH 40V 104A TO-262

IRL1104L

Manufacturer Part Number
IRL1104L
Description
MOSFET N-CH 40V 104A TO-262
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRL1104L

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
8 mOhm @ 62A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
104A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
68nC @ 4.5V
Input Capacitance (ciss) @ Vds
3445pF @ 25V
Power - Max
2.4W
Mounting Type
Through Hole
Package / Case
TO-262-3 (Straight Leads)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRL1104L

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRL1104L
Manufacturer:
IR
Quantity:
12 500
Description
Absolute Maximum Ratings
Thermal Resistance
Fifth Generation HEXFETs from International Rectifier utilize
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
HEXFET Power MOSFETs are well known for, provides the
designer with an extremely efficient and reliable device for
use in a wide variety of applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-resistance
in any existing surface mount package. The D
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0W
in a typical surface mount application.
The through-hole version (IRL1104L) is available for low-
profile applications.
www.irf.com
I
I
I
P
P
V
E
I
E
dv/dt
T
T
R
R
D
D
AR
DM
GS
AS
STG
D
D
AR
J
@ T
@ T
JC
JA
Logic-Level Gate Drive
Advanced Process Technology
Surface Mount (IRL1104S)
Low-profile through-hole (IRL1104L)
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
@T
2
Pak is a surface mount power package capable of
C
C
A
C
= 25°C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Junction-to-Case
Junction-to-Ambient(PCB Mounted,steady-state)**
Parameter
Parameter
GS
GS
PRELIMINARY
2
Pak is
@ 10V
@ 10V
G
300 (1.6mm from case )
Typ.
–––
–––
D P ak
HEXFET
2
-55 to + 175
D
S
IRL1104S/L
Max.
104
416
167
340
74
2.4
1.1
±16
5.0
62
17
®
R
T O -26 2
Power MOSFET
DS(on)
Max.
V
I
0.9
D
62
DSS
= 104A
= 0.008
= 40V
PD -91840
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
10/28/98
1

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IRL1104L Summary of contents

Page 1

... The D suitable for high current applications because of its low internal connection resistance and can dissipate typical surface mount application. The through-hole version (IRL1104L) is available for low- profile applications. Absolute Maximum Ratings Parameter 25° ...

Page 2

IRL1104S/L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source ...

Page 3

VGS TOP 15V 10V 7.0V 5.5V 4.5V 4.0V 3.5V BOTTOM 2.7V 100 10 2.7V 20µs PULSE WIDTH 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 1000 ° T ...

Page 4

IRL1104S/L 6000 1MHz iss rss gd 5000 oss ds gd 4000 C iss 3000 2000 C oss 1000 ...

Page 5

LIMITED BY PACKAGE 100 100 125 T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 0.50 0.20 0.10 0.1 0.05 0.02 SINGLE ...

Page 6

IRL1104S 0 Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Q G 4.5 ...

Page 7

D.U Driver Gate Drive P.W. D.U. Reverse Recovery Current D.U. Re-Applied Voltage Inductor Curent * for Logic Level Devices GS Fig 14. For N-Channel HEXFETS www.irf.com Peak Diode Recovery ...

Page 8

IRL1104S Pak Package Details 1 0.54 (.4 15) 1 0.29 (.4 05) 1.4 0 (.055 ) - AX. 2 1 (.6 10) 1 ...

Page 9

TO-262 Package Details Part Marking www.irf.com IRL1104S/L 9 ...

Page 10

IRL1104S Pak Tape and Reel IRE CTIO (. (. IRE C ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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