IRF7523D1TRPBF International Rectifier, IRF7523D1TRPBF Datasheet

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IRF7523D1TRPBF

Manufacturer Part Number
IRF7523D1TRPBF
Description
MOSFET N-CH 30V 2.7A MICRO8
Manufacturer
International Rectifier
Series
FETKY™r
Datasheet

Specifications of IRF7523D1TRPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Diode (Isolated)
Rds On (max) @ Id, Vgs
130 mOhm @ 1.7A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
2.7A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
12nC @ 10V
Input Capacitance (ciss) @ Vds
210pF @ 25V
Power - Max
1.25W
Mounting Type
Surface Mount
Package / Case
Micro8™
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF7523D1TRPBF
Manufacturer:
IR
Quantity:
20 000
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Description
The FETKY
designer an innovative board space saving solution for switching regulator
applications. Generation 5 HEXFETs utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area. Combining this technology
with International Rectifier's low forward drop Schottky rectifiers results in an
extremely efficient device suitable for use in a wide variety of portable electronics
applications like cell phone, PDA, etc.
The new Micro8
the smallest footprint available in an SOIC outline. This makes the Micro8
device for applications where printed circuit board space is at a premium. The low
profile (<1.1mm) of the Micro8
environments such as portable electronics and PCMCIA cards.
Absolute Maximum Ratings (T
Thermal Resistance Ratings
Notes:

ƒ
www.irf.com
Parameter
R
Parameter
I
I
I
P
P
V
dv/dt
T
D
D
DM
θJA
D
D
GS
J,
Co-packaged HEXFET
and Schottky Diode
N-Channel HEXFET
Low V
Generation 5 Technology
Micro8
Lead-Free
Repetitive rating; pulse width limited by maximum junction temperature (see figure 11)
I
Pulse width ≤ 300µs; duty cycle ≤ 2%
When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance
@ T
@ T
SD
T
@T
@T
STG
≤ 1.7A, di/dt ≤ 120A/µs, V
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
F
TM
Schottky Rectifier
Footprint
TM
family of co-packaged HEXFETs and Schottky diodes offer the
package, with half the footprint area of the standard SO-8, provides
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
TM
Junction-to-Ambient
DD
®
will allow it to fit easily into extremely thin application
≤ V
Power MOSFET
(BR)DSS
A
, T
= 25°C unless otherwise noted)
J
≤ 150°C

GS
@10V
G
A
S
A
FETKY
1
2
3
4
Top View
IRF7523D1PbF
ä
TM
MOSFET / Schottky Diode
an ideal
8
6
5
7
-55 to +150
Maximum
1.25
± 20
Maximum
K
K
D
D
2.7
2.1
0.8
6.2
21
10
100
Schottky Vf = 0.39V
R
DS(on)
V
DSS
Micro8
PD- 95434
= 0.11Ω
= 30V
TM
Units
°C/W
Units
W/°C
V/ns
°C
W
A
V
1
02/22/05

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IRF7523D1TRPBF Summary of contents

Page 1

... Generation 5 HEXFETs utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. Combining this technology with International Rectifier's low forward drop Schottky rectifiers results in an extremely efficient device suitable for use in a wide variety of portable electronics applications like cell phone, PDA, etc. ...

Page 2

IRF7523D1PbF MOSFET Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS I Gate-to-Source Forward Leakage GSS Gate-to-Source Reverse Leakage Q ...

Page 3

VGS TOP 15V 10V 7.0V 5.5V 4.5V 4.0V 3.5V BOTTOM 3. 20µs PULSE WIDTH T = 25°C J 0.1 0 Drain-to-Source Voltage (V) DS 100 T = 25° 150°C J ...

Page 4

IRF7523D1PbF 2 1.7A D 1.5 1.0 0.5 0.0 -60 -40 - Junction Temperature (°C) J Fig 5. Normalized On-Resistance Vs. Temperature .16 .14 . ...

Page 5

1MHz iss rss oss ds gd 300 C iss C oss 200 C rss 100 ...

Page 6

IRF7523D1PbF Schottky Diode Characteristics 10 1 0.1 0.0 0.2 0.4 0.6 Forward Voltage Drop - V Forward Voltage Drop - V Fig. 12 -Typical Forward Voltage Drop Characteristics ...

Page 7

Charge Fig 15a. Basic Gate Charge Waveform Fig 16a. Switching Time Test Circuit V DS 90% 10 Fig 16b. Switching Time Waveforms www.irf.com 12V V GS Fig 15b. Gate Charge ...

Page 8

IRF7523D1PbF + - + - • • • Driver Gate Drive Period P.W. D.U.T. I Waveform SD Reverse Recovery Body Diode Forward Current D.U.T. V Waveform DS Re-Applied Voltage Body Diode Inductor Curent Ripple ≤ • • • ...

Page 9

Micro8 Package Outline Dimensions are shown in milimeters (inches 0.25 (.010 ...

Page 10

IRF7523D1PbF Micro8 Tape & Reel Information Dimensions are shown in millimeters (inches) TERMINAL NUMBER 1 8.1 ( .318 ) 7.9 ( .312 ) NOTES: 1. OUTLINE CONFORMS TO EIA-481 & EIA-541. 2. CONTROLLING DIMENSION : MILLIMETER. 330.00 (12.992) MAX. NOTES ...

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