IRF6100PBF International Rectifier, IRF6100PBF Datasheet

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IRF6100PBF

Manufacturer Part Number
IRF6100PBF
Description
MOSFET P-CH 20V 5.1A FLIPFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF6100PBF

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
65 mOhm @ 5.1A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
5.1A
Vgs(th) (max) @ Id
1.2V @ 250µA
Gate Charge (qg) @ Vgs
21nC @ 5V
Input Capacitance (ciss) @ Vds
1230pF @ 15V
Power - Max
2.2W
Mounting Type
Surface Mount
Package / Case
4-FlipFet™
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF6100PBF
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IRF6100PBF
Quantity:
15 922
Description
True chip-scale packaging is available from International
Rectifier. Through the use of advanced processing tech-
niques, and a unique packaging concept, extremely low
on-resistance and the highest power densities in the
industry have been made available for battery and load
management applications. These benefits, combined with
the ruggedized device design , that International Rectifier
is well known for,
tremely efficient and reliable device.
The FlipFET™ package, is one-third the footprint of a
comparable SOT-23 package and has a profile of less
than .8mm. Combined with the low thermal resistance of
the die level device, this makes the FlipFET™ the best
device for application where printed circuit board space is
at a premium and in extremely thin application environ-
ments such as battery packs, cell phones and PCMCIA
cards.
Absolute Maximum Ratings
Thermal Resistance
l
l
l
l
l
l
l
V
I
I
I
P
P
V
T
Symbol
R
R
www.irf.com
D
D
DM
J,
DS
D
D
GS
θJA
θJ-PCB
@ T
@ T
P-Channel MOSFET
@T
@T
T
Ultra Low
Low
One-third Footprint of SOT-23
Super Low Profile (<.8mm)
Available Tested on Tape & Reel
Lead-Free
STG
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
Thermal Resistance
R
provides the designer with an ex-
DS(on)
Junction-to-PCB mounted
Drain- Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Junction-to-Ambient
per Footprint Area
Parameter
Parameter
ƒ
ƒ
ƒ
GS
GS
@ 4.5V
@ 4.5V
V
-20V
G
DSS
Typ.
35
HEXFET
0.065
0.095
IRF6100PbF
-55 to + 150
R
S
D
Max.
DS(on)
±5.1
±3.5
±35
± 12
-20
2.2
1.4
17
@V
@V
®
GS
GS
FlipFET
Power MOSFET
max
= -4.5V
= -2.5V
Max.
56.5
–––
PD - 96012B
ISOMETRIC
-5.1A
-4.1A
mW/°C
Units
Units
I
05/17/06
°C/W
D
W
°C
V
A
V
1

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IRF6100PBF Summary of contents

Page 1

... Junction and Storage Temperature Range J, STG Thermal Resistance Symbol Parameter R Junction-to-Ambient θJA R Junction-to-PCB mounted θJ-PCB www.irf.com V DSS -20V 4.5V GS ƒ ƒ ƒ 96012B IRF6100PbF ® HEXFET Power MOSFET R max I DS(on) D 0.065 @V = -4.5V -5.1A Ω GS 0.095 @V = -2.5V -4.1A Ω FlipFET ISOMETRIC Max ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient ∆V /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage ...

Page 3

VGS TOP -7.00V -5.00V -4.50V -2.50V -1.80V -1.50V 10 -1.20V BOTTOM -1.00V 1 -1.00V 0.1 20µs PULSE WIDTH 0.01 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100 ...

Page 4

1MHz iss rss 1600 oss iss 1200 800 400 C oss C ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 100 D = 0.50 0.20 10 0.10 0.05 0.02 1 0.01 SINGLE PULSE (THERMAL ...

Page 6

-5.1A 0.04 0.03 1.0 2.0 3.0 4.0 -V GS, Gate -to -Source Voltage (V) Fig 12. Typical On-Resistance Vs. Gate Voltage Charge Fig 14a. Basic ...

Page 7

Temperature ( °C ) Fig 15. Threshold Voltage Vs. Temperature FlipFET™ Part Marking Information www.irf.com -250µA 8 ...

Page 8

FlipFET™ Outline Dimension and Tape and Reel (Refer to application note AN-1011 for details about board mounting the 0.8mm ball pitch Flip FET)  Ãb# $!# 7 b%d # # #Y b %d ' b"!d !Y 'Ãb"!d T‚ˆ…pr ...

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