NTP27N06L ON Semiconductor, NTP27N06L Datasheet

MOSFET N-CH 60V 27A TO220AB

NTP27N06L

Manufacturer Part Number
NTP27N06L
Description
MOSFET N-CH 60V 27A TO220AB
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTP27N06L

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
48 mOhm @ 13.5A, 5V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
27A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
32nC @ 5V
Input Capacitance (ciss) @ Vds
990pF @ 25V
Power - Max
88.2W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
NTP27N06LOS
NTP27N06L, NTB27N06L
Power MOSFET
27 Amps, 60 Volts, Logic Level
N−Channel TO−220 and D
power supplies, converters, power motor controls and bridge circuits.
Typical Applications
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 2
Drain−to−Source Voltage
Drain−to−Gate Voltage (R
Gate−to−Source Voltage
Drain Current
Total Power Dissipation @ T
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Thermal Resistance − Junction−to−Case
Maximum Lead Temperature for Soldering
Designed for low voltage, high speed switching applications in
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
Derate above 25°C
Energy − Starting T
(V
L = 0.3 mH, I
Purposes, 1/8″ from case for 10 seconds
DD
− Continuous
− Non−Repetitive (t
− Continuous @ T
− Continuous @ T
− Single Pulse (t
= 50 Vdc, V
L
(pk) = 25 A,V
Rating
GS
J
p
= 5.0 Vdc,
v10 μs)
(T
= 25°C
A
A
p
C
= 25°C
100°C
GS
v10 ms)
= 25°C unless otherwise noted)
A
= 10 MΩ)
DS
= 25°C
= 60 Vdc)
2
Symbol
T
PAK
V
V
R
J
V
V
E
I
P
DGR
, T
T
DSS
DM
I
I
θJC
GS
GS
AS
D
D
D
L
stg
−55 to
Value
+175
"15
"20
88.2
0.59
260
1.7
60
60
27
15
80
94
1
W/°C
°C/W
Unit
Vdc
Vdc
Vdc
Adc
Apk
mJ
°C
°C
W
Gate
NTP27N06L
NTB27N06L
NTB27N06LT4
1
2
1
Device
NTx27N06L
LLYWW
3
Drain
Drain
ORDERING INFORMATION
4
2
4
G
CASE 221A
MARKING DIAGRAMS
TO−220AB
& PIN ASSIGNMENTS
R
STYLE 5
http://onsemi.com
27 AMPERES
DS(on)
3
Source
60 VOLTS
TO−220AB
N−Channel
Package
D
D
NTx27N06L = Device Code
x
LL
Y
WW
2
2
D
PAK
PAK
= 48 mΩ
Publication Order Number:
S
Gate
1
1
NTx27N06L
LLYWW
800/Tape & Reel
CASE 418B
2
= B or P
= Location Code
= Year
= Work Week
Drain
Drain
50 Units/Rail
50 Units/Rail
STYLE 2
NTP27N06L/D
D
3
Shipping
4
2
2
PAK
3
Source
4

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NTP27N06L Summary of contents

Page 1

... NTP27N06L, NTB27N06L Power MOSFET 27 Amps, 60 Volts, Logic Level N−Channel TO−220 and D Designed for low voltage, high speed switching applications in power supplies, converters, power motor controls and bridge circuits. Typical Applications • Power Supplies • Converters • Power Motor Controls • Bridge Circuits ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage (Note Vdc 250 μAdc Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc ...

Page 3

DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0 0.09 0.08 0.07 T ...

Page 4

Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (Δt) are determined by how fast the FET input capacitance can be charged by current from the ...

Page 5

TOTAL GATE CHARGE (nC) G Figure 8. Gate−To−Source and Drain−To−Source Voltage versus Total Charge DRAIN−TO−SOURCE DIODE CHARACTERISTICS ...

Page 6

SINGLE PULSE T = 25° μs 10 100 μ LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated ...

Page 7

INFORMATION FOR USING THE D RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection 0.42 ...

Page 8

Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of ...

Page 9

For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings ...

Page 10

PACKAGE DIMENSIONS −B− −T− SEATING PLANE 0.13 (0.005 PAK CASE 418B−03 ISSUE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. ...

Page 11

... V 0.045 −−− 1.15 −−− Z −−− 0.080 −−− 2.04 STYLE 5: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NTP27N06L/D ...

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