IPB100N06S3-03 Infineon Technologies, IPB100N06S3-03 Datasheet

MOSFET N-CH 55V 100A D2PAK

IPB100N06S3-03

Manufacturer Part Number
IPB100N06S3-03
Description
MOSFET N-CH 55V 100A D2PAK
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPB100N06S3-03

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
3 mOhm @ 80A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
100A
Vgs(th) (max) @ Id
4V @ 230µA
Gate Charge (qg) @ Vgs
480nC @ 10V
Input Capacitance (ciss) @ Vds
21620pF @ 25V
Power - Max
300W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IPB100N06S303XT
SP000087982

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IPB100N06S3-03
Manufacturer:
INFINEON
Quantity:
15 000
Part Number:
IPB100N06S3-03
Manufacturer:
INFINEON
Quantity:
12 500
Rev. 1.1
OptiMOS
Features
• N-channel - Enhancement mode
• Automotive AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Green product (RoHS compliant)
• 100% Avalanche tested
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Avalanche current, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Type
IPB100N06S3-03
IPI100N06S3-03
IPP100N06S3-03
®
-T2 Power-Transistor
2)
3)
Package
PG-TO263-3-2
PG-TO262-3-1
PG-TO220-3-1
j
=25 °C, unless otherwise specified
1)
2)
Symbol
I
I
E
I
V
P
T
D
D,pulse
AS
j
AS
GS
tot
, T
Marking
3PN0603
3PN0603
3PN0603
stg
PG-TO263-3-2
T
T
V
T
I
T
D
C
C
C
C
GS
=50 A
page 1
=25 °C, V
=100 °C,
=25 °C
=25 °C
=10 V
Conditions
2)
GS
Product Summary
V
R
I
D
=10 V
DS
DS(on),max
IPI100N06S3-03, IPP100N06S3-03
PG-TO262-3-1
(SMD version)
-55 ... +175
55/175/56
Value
2390
100
100
400
100
±20
300
IPB100N06S3-03
PG-TO220-3-1
100
3.0
55
2007-11-07
Unit
A
mJ
A
V
W
°C
V
m
A

Related parts for IPB100N06S3-03

IPB100N06S3-03 Summary of contents

Page 1

... Marking 3PN0603 3PN0603 3PN0603 Symbol Conditions I T =25 ° =100 ° = =25 °C D,pulse = =25 °C tot stg page 1 IPB100N06S3-03 IPI100N06S3-03, IPP100N06S3-03 DS (SMD version) DS(on),max D PG-TO262-3-1 PG-TO220-3-1 Value =10 V 100 100 400 2390 100 ±20 300 -55 ... +175 55/175/ 3.0 m 100 A Unit °C 2007-11-07 ...

Page 2

... (BR)DSS =230 µA GS(th = DSS T =25 ° = =125 ° = GSS = =80 A DS( SMD version page 2 IPB100N06S3-03 IPI100N06S3-03, IPP100N06S3-03 Values min. typ. max 0 2.1 3 100 = 100 - 2.8 3.3 - 2.5 Unit K µA nA mΩ 3 2007-11-07 ...

Page 3

... C I S,pulse = =25 ° =27 /dt =100 A/µ 0.5 K/W the chip is able to carry 223 A at 25°C. For detailed thJC 2 (one layer, 70 µm thick) copper area for drain page 3 IPB100N06S3-03 IPI100N06S3-03, IPP100N06S3-03 Values min. typ. max. - 21620 = 3290 - 3140 - 130 - 70 - 320 - 5.6 - ...

Page 4

... V DS Rev. 1.1 2 Drain current 120 100 150 200 4 Max. transient thermal impedance Z = f(t thJC parameter µs 10 µs 100 µ 100 [V] page 4 IPB100N06S3-03 IPI100N06S3-03, IPP100N06S3- ≥ 100 150 T [° 0.5 0.1 0.05 0.01 single pulse - [s] p 200 - 2007-11-07 ...

Page 5

... GS DS parameter 200 175 150 125 100 Rev. 1.1 6 Typ. drain-source on-state resistance DS(on) parameter [V] 8 Typ. drain-source on-state resistance R = f(T DS(on) 5 -55 °C 25 °C 175 ° [V] page 5 IPB100N06S3-03 IPI100N06S3-03, IPP100N06S3- ° 5 [ -60 - 100 T [° 100 120 140 180 2007-11-07 ...

Page 6

... V SD Rev. 1.1 10 Typ. capacitances 2300µ 100 140 180 12 Typ. avalanche characteristics parameter: T 1000 100 25 ° 0.8 1 1.2 1.4 [V] page 6 IPB100N06S3-03 IPI100N06S3-03, IPP100N06S3- MHz GS Ciss Coss Crss [ j(start) 100°C 150° 100 t [µ 25°C 1000 2007-11-07 ...

Page 7

... A 1000 100 T [° Typ. gate charge pulsed GS gate D parameter 100 200 Q gate Rev. 1.1 14 Typ. drain-source breakdown voltage V BR(DSS 150 200 16 Gate charge waveforms 300 400 500 [nC] page 7 IPB100N06S3-03 IPI100N06S3-03, IPP100N06S3- -60 - 100 T [° 140 180 gate gate 2007-11-07 ...

Page 8

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.1 IPI100N06S3-03, IPP100N06S3-03 page 8 IPB100N06S3-03 2007-11-07 ...

Page 9

... IPB100N06S3-03 Changes Removal of ordering code Update of Infineon Logo Implementation of avalanche current single pulse Removal of ESD class Update of Infineon address Removal of foot note 3, avalanche diagrams Update Qrr and trr typ Update of disclaimer ...

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