IPD09N03LB G Infineon Technologies, IPD09N03LB G Datasheet

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IPD09N03LB G

Manufacturer Part Number
IPD09N03LB G
Description
MOSFET N-CH 30V 50A DPAK
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPD09N03LB G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
9.1 mOhm @ 50A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
50A
Vgs(th) (max) @ Id
2V @ 20µA
Gate Charge (qg) @ Vgs
13nC @ 5V
Input Capacitance (ciss) @ Vds
1600pF @ 15V
Power - Max
58W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IPD09N03LBGXT
SP000016412
Rev. 1.55
Features
• Ideal for high-frequency dc/dc converters
• Qualified according to JEDEC
• N-channel, logic level
• Excellent gate charge x R
• Superior thermal resistance
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
OptiMOS
Type
Package
Marking
®
2 Power-Transistor
IPD09N03LB G
PG-TO252-3-11
09N03LB
4)
j
=25 °C, unless otherwise specified
DS(on)
1)
product (FOM)
for target applications
Symbol Conditions
I
I
E
dv /dt
V
P
T
D
D,pulse
j
AS
GS
tot
, T
IPF09N03LB G
PG-TO252-3-23
09N03LB
stg
T
T
T
I
I
di /dt =200 A/µs,
T
T
D
D
page 1
C
C
C
j,max
C
=50 A, R
=50 A, V
=25 °C
=100 °C
=25 °C
=25 °C
=175 °C
2)
3)
DS
GS
=20 V,
=25 Ω
Product Summary
V
R
I
D
DS
IPS09N03LB G
PG-TO251-3-11
09N03LB
DS(on),max
IPS09N03LB G IPU09N03LB G
IPD09N03LB G IPF09N03LB G
(SMD version)
-55 ... 175
55/175/56
Value
200
±20
50
42
57
58
6
IPU09N03LB G
PG-TO251-3-21
09N03LB
9.1
30
50
Unit
A
mJ
kV/µs
V
W
°C
V
mΩ
A
2008-04-14

Related parts for IPD09N03LB G

IPD09N03LB G Summary of contents

Page 1

... Symbol Conditions =25 ° =100 ° =25 °C D,pulse C =25 Ω = = = /dt di /dt =200 A/µs, T =175 °C j,max =25 °C tot stg page 1 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB (SMD version) 9.1 mΩ IPU09N03LB G PG-TO251-3-21 09N03LB Value Unit 200 kV/µs ± -55 ... 175 °C 55/175/56 2008-04-14 ...

Page 2

... SMD version SMD version |>2 DS(on)max = =2.6 K/W the chip is able to carry 59 A. thJC <- (one layer, 70 µm thick) copper area for drain page 2 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB G Values Unit min. typ. max 2.6 K 1.2 1 0.1 1 µ 100 - 10 100 nA - 11.6 14.4 mΩ ...

Page 3

... Symbol Conditions C iss = oss f =1 MHz C rss t d( =2.7 Ω d(off g( plateau V =0 g(sync = oss =25 ° S,pulse = =25 ° = /dt =400 A/µs F page 3 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB G Values Unit min. typ. max. - 1200 1600 pF - 440 590 - 3 2.0 2 350 - 0.96 1 2008-04-14 ...

Page 4

... Rev. 1.55 2 Drain current I =f 100 150 200 0 [° Max. transient thermal impedance Z =f(t thJC p parameter µs 10 µs 100 µ 0.001 10 100 10 [V] DS page 4 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB G ≥ 100 150 T [° 0.5 0.2 0.1 0.05 0.02 single pulse 0. [s] p ...

Page 5

... Typ. transfer characteristics I =f |>2 DS(on)max parameter 100 175 ° Rev. 1.55 6 Typ. drain-source on resistance R =f(I DS(on) parameter Typ. forward transconductance g =f ° [V] GS page 5 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB =25 ° 3.5 V 3.8 V 4 [A] D =25 ° [ 100 60 2008-04-14 ...

Page 6

... Forward characteristics of reverse diode I =f parameter: T 1000 Ciss 100 10 Crss 0.0 [V] DS page 6 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB 200 µA 20 µA - 100 140 T [° °C 25 °C, 98% 175 °C, 98% 175 °C 0.5 1.0 1.5 V [V] SD 180 2.0 2008-04-14 ...

Page 7

... Drain-source breakdown voltage V =f BR(DSS -60 - Rev. 1.55 14 Typ. gate charge V =f(Q GS parameter °C 8 100 °C 150 ° 100 1000 [µ Gate charge waveforms s(th) Q g(th) 60 100 140 180 [°C] j page 7 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB =25 A pulsed gate [nC] gate ate 2008-04-14 ...

Page 8

... Package Outline Rev. 1.55 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB G PG-TO252-3-11 page 8 2008-04-14 ...

Page 9

... Package Outline PG-TO252-3-11: Outline Footprint: Rev. 1.55 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB G PG-TO252-3-23 Packaging: page 9 2008-04-14 ...

Page 10

... Package Outline Rev. 1.55 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB G PG-TO251-3-11 page 10 2008-04-14 ...

Page 11

... Package Outline Rev. 1.55 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB G PG-TO251-3-21 page 11 2008-04-14 ...

Page 12

... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.55 IPD09N03LB G IPF09N03LB G IPS09N03LB G IPU09N03LB G page 12 2008-04-14 ...

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