NTHD5904NT3 ON Semiconductor, NTHD5904NT3 Datasheet

NTHD5904NT3

Manufacturer Part Number

NTHD5904NT3

Description

MOSFET N-CH 20V 2.5A CHIPFET

Manufacturer

ON Semiconductor

Datasheet

1.NTHD5904NT1.pdf (6 pages)

Specifications of NTHD5904NT3

Fet Type

MOSFET N-Channel, Metal Oxide

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

65 mOhm @ 3.3A, 4.5V

Drain To Source Voltage (vdss)

20V

Current - Continuous Drain (id) @ 25° C

2.5A

Vgs(th) (max) @ Id

1.2V @ 250µA

Gate Charge (qg) @ Vgs

6nC @ 4.5V

Input Capacitance (ciss) @ Vds

465pF @ 16V

Power - Max

640mW

Mounting Type

Surface Mount

Package / Case

8-ChipFET™

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

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NTHD5904N

Power MOSFET

20 V, 4.5 A, Dual N−Channel, ChipFETt

Features

•

Applications

•

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq

2. Surface Mounted on FR4 Board using the minimum recommended pad size

3. ESD Rating Information: Human Body Model (HBM) Class 0.

November, 2005 − Rev. 2

MAXIMUM RATINGS

THERMAL RESISTANCE RATINGS

Drain−to−Source Voltage

Gate−to−Source Voltage

Continuous Drain

Current (Note 1)

Power Dissipation

(Note 1)

Continuous Drain

Current (Note 2)

Power Dissipation

(Note 2)

Pulsed Drain Current

Operating Junction and Storage Temperature

Source Current (Body Diode)

Lead Temperature for Soldering Purposes

(1/8” from case for 10 s)

Junction−to−Ambient – Steady State (Note 1)

Junction−to−Ambient – t ≤ 5 s (Note 1)

Junction−to−Ambient – Steady State (Note 2)

Ideal Device for Applications Where Board Space is at a Premium.

Applications Where Heat Transfer is Required.

Computing and Portable Equipment

Low R

Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6.

ChipFET Package Exhibits Excellent Thermal Capabilities. Ideal for

Pb−Free Packages are Available

DC−DC Buck or Boost Converters

Low Side Switching

Optimized for Battery and Low Side Switching Applications in

[1 oz] including traces).

(Cu area = 0.214 in sq).

DS(on)

and Fast Switching Speed

Parameter

Steady

t ≤ 5 s

State

= 25°C unless otherwise noted)

=10 ms

=25°C

=85°C

=25°C

=85°C

=25°C

Symbol

DSS

STG

qJA

−55 to

Value

±8.0

1.13

0.64

Max

150

260

195

110

3.3

2.4

4.5

2.5

1.8

2.6

°C/W

Unit

°C

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

CONNECTIONS

(BR)DSS

20 V

ORDERING INFORMATION

D3 = Specific Device Code

, G

http://onsemi.com

N−Channel MOSFET

= Month Code

= Pb−Free Package

40 mW @ 4.5 V

55 mW @ 2.5 V

DS(on)

, D

Publication Order Number:

TYP

CASE 1206A

MARKING

DIAGRAM

(Top View)

ChipFET

STYLE 2

, S

NTHD5904N/D

4.5 A

MAX

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NTHD5904NT3 Summary of contents

Page 1

NTHD5904N Power MOSFET 20 V, 4.5 A, Dual N−Channel, ChipFETt Features • Low R and Fast Switching Speed DS(on) • Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6. Ideal Device for Applications Where Board Space Premium. ...

Page 2

... Switching characteristics are independent of operating junction temperatures. ORDERING INFORMATION Device NTHD5904NT1 NTHD5904NT1G NTHD5904NT3 NTHD5904NT3G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NTHD5904N (T = 25°C unless otherwise noted) ...

Page 3

TYPICAL PERFORMANCE CURVES 2 0 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS ...

Page 4

TYPICAL PERFORMANCE CURVES 1200 iss 1000 800 600 400 200 C oss C rss GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) Figure ...

Page 5

... SCALE 20:1 0.026 Basic *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTHD5904N PACKAGE DIMENSIONS ChipFET] CASE 1206A−03 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...

Page 6

... Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com NTHD5904N N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 ON Semiconductor Website: http://onsemi ...

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