SSM2211SZ Analog Devices Inc, SSM2211SZ Datasheet - Page 2

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SSM2211SZ

Manufacturer Part Number
SSM2211SZ
Description
Audio Amp Speaker 1-CH Mono Class-AB 8-Pin SOIC N
Manufacturer
Analog Devices Inc
Type
Class ABr
Datasheet

Specifications of SSM2211SZ

Package
8SOIC N
Function
Speaker
Amplifier Type
Class-AB
Maximum Output Power X Channels @ Load
1.5x1@4Ohm W
Total Harmonic Distortion Noise
0.2@8Ohm@1W|0.1@8Ohm@0.35W %
Typical Psrr
66 dB
Output Signal Type
Differential
Rail To Rail
Rail to Rail Input
Typical Gain Bandwidth Product
4 MHz
Maximum Load Resistance
8 Ohm
Output Type
1-Channel Mono
Max Output Power X Channels @ Load
1.5W x 1 @ 4 Ohm
Voltage - Supply
2.7 V ~ 5.5 V
Features
Differential Inputs, Shutdown
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Amplifier Class
AB
No. Of Channels
1
Output Power
1.5W
Supply Voltage Range
2.7V To 5.5V
Load Impedance
8ohm
Operating Temperature Range
-20°C To +85°C
Amplifier Case Style
SOIC
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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SSM2211
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Electrical Characteristics ................................................................. 3
Absolute Maximum Ratings ............................................................ 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 7
Product Overview ........................................................................... 14
Typical Applications ....................................................................... 15
REVISION HISTORY
4/08—Rev. D to Rev. E
Changes to Features .......................................................................... 1
Changes to General Description .................................................... 1
Changes to Supply Current in Table 1 and Table 2 ...................... 3
Changes to Supply Current in Table 3 ........................................... 4
Changes to Absolute Maximum Ratings ....................................... 5
Changes to Figure 41 ...................................................................... 14
Changes to Equation 7, Equation 8, and Equation 10 ............... 16
Changes to Figure 47 ...................................................................... 17
Changes to Automatic Shutdown-Sensing Circuit Section ...... 18
Changes to SSM2211Amplifier Design Example Section ......... 19
Changes to Driving Two Speakers Single Endedly Section ...... 20
Changes to Figure 50 ...................................................................... 20
Changes to Evaluation Board Section .......................................... 20
Changes to Figure 51 ...................................................................... 20
Changes to Ordering Guide .......................................................... 22
11/06—Rev. C to Rev. D
Updated Format .................................................................. Universal
Changes to General Description .................................................... 1
Changes to Electrical Characteristics ............................................ 3
Changes to Absolute Maximum Ratings ....................................... 5
Added Table 6 .................................................................................... 6
Changes to Figure 32 ...................................................................... 11
Changes to the Product Overview Section ................................. 14
Changes to the Output Voltage Headroom Section ................... 17
Changes to the Start-Up Popping Noise Section ........................ 18
Changes to the Evaluation Board Section ................................... 20
Thermal Resistance ...................................................................... 5
ESD Caution .................................................................................. 5
Thermal Performance—LFCSP ................................................ 14
Bridged Output vs. Single-Ended Output Configurations ... 15
Rev. E | Page 2 of 24
Outline Dimensions ....................................................................... 21
Updated Outline Dimensions ....................................................... 21
Changes to Ordering Guide .......................................................... 21
10/04—Data Sheet Changed from Rev. B to Rev. C
Updated Format .................................................................. Universal
Changes to General Description ..................................................... 1
Changes to Table 5 ............................................................................. 4
Deleted Thermal Performance—SOIC Section ........................... 8
Changes to Figure 31 ...................................................................... 10
Changes to Figure 40 ...................................................................... 12
Changes to Thermal Performance—LFCSP Section ................. 13
Deleted Figure 52, Renumbered Successive Figures .................. 14
Deleted Printed Circuit Board Layout—SOIC Section ............. 14
Changes to Output Voltage Headroom Section ......................... 16
Changes to Start-Up Popping Noise Section .............................. 17
Changes to Ordering Guide .......................................................... 20
10/02—Data Sheet Changed from Rev. A to Rev. B
Deleted 8-Lead PDIP ......................................................... Universal
Updated Outline Dimensions ....................................................... 15
5/02—Data Sheet Changed from Rev. 0 to Rev. A
Edits to General Description ........................................................... 1
Edits to Package Type ....................................................................... 3
Edits to Ordering Guide ................................................................... 3
Edits to Product Overview ............................................................... 8
Edits to Printed Circuit Board Layout Considerations ............. 13
Added section Printed Circuit Board Layout
Considerations—LFCSP ................................................................ 14
Speaker Efficiency and Loudness ............................................. 15
Power Dissipation....................................................................... 16
Output Voltage Headroom ........................................................ 17
Automatic Shutdown-Sensing Circuit ..................................... 17
Shutdown-Circuit Design Example ......................................... 18
Start-Up Popping Noise ............................................................. 18
Single-Ended Applications ........................................................ 19
Driving Two Speakers Single Endedly ..................................... 19
Evaluation Board ........................................................................ 20
LFCSP PCB Considerations ...................................................... 20
Ordering Guide .......................................................................... 22
SSM2211 Amplifier Design Example .................................. 18

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