SSM2211SZ Analog Devices Inc, SSM2211SZ Datasheet - Page 5

• Manufacturer Part Number: SSM2211SZ
• Description: Audio Amp Speaker 1-CH Mono Class-AB 8-Pin SOIC N
• Manufacturer: Analog Devices Inc
• Type: Class ABr

Specifications of SSM2211SZ

• Package: 8SOIC N
• Function: Speaker
• Amplifier Type: Class-AB
• Maximum Output Power X Channels @ Load: 1.5x1@4Ohm W
• Total Harmonic Distortion Noise: 0.2@8Ohm@1W|0.1@8Ohm@0.35W %
• Typical Psrr: 66 dB
• Output Signal Type: Differential
• Rail To Rail: Rail to Rail Input
• Typical Gain Bandwidth Product: 4 MHz
• Maximum Load Resistance: 8 Ohm
• Output Type: 1-Channel Mono
• Max Output Power X Channels @ Load: 1.5W x 1 @ 4 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Differential Inputs, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Amplifier Class: AB
• No. Of Channels: 1
• Output Power: 1.5W
• Supply Voltage Range: 2.7V To 5.5V
• Load Impedance: 8ohm
• Operating Temperature Range: -20°C To +85°C
• Amplifier Case Style: SOIC
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at T
otherwise noted.
Table 4.
Parameter
Supply Voltage
Input Voltage
Common-Mode Input Voltage
ESD Susceptibility
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature, Soldering (60 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
A
= 25°C, unless
Rating
6 V
V
V
2000 V
−65°C to +150°C
−40°C to +85°C
−65°C to +165°C
300°C
DD
DD
Rev. E | Page 5 of 24
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
8-Lead LFCSP_VD (CP-Suffix)
8-Lead SOIC_N (S-Suffix)
1
2
ESD CAUTION
For the LFCSP_VD, θ
For the SOIC_N, θ
JA
is specified for the worst-case conditions, that is, a device
JA
JA
is measured with the device soldered to a four-layer PCB.
is measured with exposed lead frame soldered to the PCB.
2
1
θ
50
121
JA
SSM2211
Unit
°C/W
°C/W