MAL215371109E3 Vishay, MAL215371109E3 Datasheet - Page 3

• Manufacturer Part Number: MAL215371109E3
• Description: Cap Aluminum 10uF 50VDC 20% 6.3 X 5.3mm SMD 3 Ohm 26mA 2000 hr Blister T/R
• Manufacturer: Vishay

Specifications of MAL215371109E3

• Mounting: Surface Mount
• Capacitance Value: 10 uF
• Voltage: 50 Vdc
• Product Height: 5.3 mm
• Operating Temperature: -55 to 105 °C
• Tolerance: 20 %

153 CRV
Vishay BCcomponents
Table 2
MOUNTING
The capacitors are designed for automatic placement on to
printed-circuit boards.
Optimum dimensions of soldering pads depend amongst
others on soldering method, mounting accuracy, print layout
and/or adjacent components.
For recommended soldering pad dimensions, refer to Fig.3
and Table 3.
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
soldering pad and on top of the case during processing.
For maximum conditions refer to Fig.4.
Maximum 2 runs with pause of minimum 30 min between.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
Table 3
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52
DIMENSIONS in millimeters AND MASS
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters
4.0 x 4.0 x 5.3
5.0 x 5.0 x 5.3
6.3 x 6.3 x 5.3
8.0 x 8.0 x 6.5
8.0 x 8.0 x 10
10 x 10 x 10
10 x 10 x 12
10 x 10 x 14
CASE SIZE
L x W x H
NOMINAL
CASE CODE
0405
0505
0605
0807
0810
1010
1012
1014
CODE
CASE
0405
0505
0605
0807
0810
1010
1012
1014
L
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10.6
10.6
10.6
max.
4.5
5.5
6.8
8.6
8.6
W
SMD (Chip) Long Life Vertical
10.6
10.6
10.6
max.
4.5
5.5
6.8
8.6
8.6
2.6
3.0
3.5
4.0
3.5
4.0
4.3
4.3
a
Aluminum Capacitors
H
10.5
10.5
12.3
14.3
max.
5.5
5.5
5.5
6.8
Ø D
10.0
10.0
10.0
4.0
5.0
6.3
8.0
8.0
AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION
SHALL BE THE MINIMUM NECESSARY REQUIRED TO
ENSURE GOOD SOLDERING CONNECTIONS. HOWEVER, THE
SPECIFIED
EXCEEDED.
B
max.
0.8
0.8
0.8
0.8
1.1
1.1
1.2
1.2
1.6
1.6
1.6
1.6
2.5
2.5
2.5
2.5
b
1.0
1.4
2.0
2.3
3.1
4.7
4.5
4.5
S
MAXIMUM
Fig.3
≈ 0.13
≈ 0.20
≈ 0.30
≈ 0.50
≈ 1.00
≈ 1.30
≈ 1.40
≈ 1.50
MASS
(g)
Recommended soldering
pad dimensions
CURVES
0.4 ± 0.2
Fig.2 Dimensional outline
Document Number: 28388
SHOULD
W
W B
0.3
max.
Revision: 15-Oct-08
1.0
1.4
1.9
2.1
3.0
4.0
4.0
4.0
c
NEVER
S
D
L
BE