DIODE SCHOTTKY DET/SW 30V TO92-2

 

MBD301G

Manufacturer Part NumberMBD301G
DescriptionDIODE SCHOTTKY DET/SW 30V TO92-2
ManufacturerON Semiconductor
MBD301G datasheets

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Specifications of MBD301G

Diode TypeSchottky - SingleVoltage - Peak Reverse (max)30V
Capacitance @ Vr, F1.5pF @ 15V, 1MHzPower Dissipation (max)280mW
Package / CaseTO-92-2, TO-226ACProductSchottky Diodes
Peak Reverse Voltage30 VConfigurationSingle
Forward Voltage Drop0.6 V @ 0.01 AMaximum Reverse Leakage Current0.2 uA @ 25 V
Operating Temperature Range- 55 C to + 150 CMounting StyleThrough Hole
Package TypeTO-92 (TO-226AC)Power Dissipation280 mW
Primary TypeSchottky BarrierTemperature, Junction, Maximum+125 °C
Temperature, Operating-55 to +125 °CVoltage, Forward0.52 V
Voltage, Reverse30 VLead Free Status / RoHS StatusLead free / RoHS Compliant
Current - Max-Resistance @ If, F-
Other namesMBD301GOS  
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D
3
H
E
E
1
2
b
e
A
A1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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PUBLICATION ORDERING INFORMATION
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PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
SEE VIEW C
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
c
0.25
q
L
STYLE 8:
L1
VIEW C
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
5
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
MILLIMETERS
INCHES
DIM
MIN
NOM
MAX
MIN
NOM
A
0.89
1.00
1.11
0.035
0.040
A1
0.01
0.06
0.10
0.001
0.002
b
0.37
0.44
0.50
0.015
0.018
c
0.09
0.13
0.18
0.003
0.005
D
2.80
2.90
3.04
0.110
0.114
E
1.20
1.30
1.40
0.047
0.051
e
1.78
1.90
2.04
0.070
0.075
L
0.10
0.20
0.30
0.004
0.008
0.35
0.54
0.69
0.014
0.021
L1
H
2.10
2.40
2.64
0.083
0.094
E
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
2.0
mm
inches
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
MBD301/D
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104