BA 892 E6127

Manufacturer Part NumberBA 892 E6127
DescriptionDIODE RF SW 35V 100MA SCD-80
ManufacturerInfineon Technologies
BA 892 E6127 datasheets

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Specifications of BA 892 E6127

Package / CaseSCD 80Diode TypeStandard - Single
Voltage - Peak Reverse (max)35VCurrent - Max100mA
Capacitance @ Vr, F1.1pF @ 3V, 1MHzResistance @ If, F500 mOhm @ 10mA, 100MHz
ConfigurationSingleReverse Voltage35 V
Forward Continuous Current100 mACarrier Life0.12 us
Forward Voltage Drop1 VMaximum Diode Capacitance1.1 pF at 3 V
Maximum Operating Temperature+ 125 CMaximum Series Resistance @ Maximum If0.5 Ohms at 10 mA
Maximum Series Resistance @ Minimum If0.7 Ohms at 3 mAMinimum Operating Temperature- 55 C
Mounting StyleSMD/SMTLead Free Status / RoHS StatusLead free / RoHS Compliant
Power Dissipation (max)-Other namesBA892E6127XT
SP000104705
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Silicon RF Switching Diode
For band switching in TV/VTR tuners
and mobile applications
Very low forward resistance (typ. 0.45
Small capacitance
Pb-free (RoHS compliant) package
Qualified according AEC Q101
BA592
BA892/-02L
BA892-02V
Type
BA592
BA892
BA892-02L
BA892-02V
Maximum Ratings at T
= 25°C, unless otherwise specified
A
Parameter
Diode reverse voltage
Forward current
Junction temperature
Operating temperature range
Storage temperature
1
Pb-containing package may be available upon special request
@ 3 mA)
1)
Package
Configuration
SOD323
single
SCD80
single
TSLP-2-1
single, leadless
SC79
single
Symbol
V
R
I
F
T
j
T
op
T
stg
1
BA592/BA892...
L
Marking
(nH)
S
1.8
blue S
0.6
AA
0.4
AA
0.6
A
Value
Unit
35
V
100
mA
150
°C
-55 ... 125
-55 ... 150
2007-04-19

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BA 892 E6127 Summary of contents

  • Page 1

    Silicon RF Switching Diode For band switching in TV/VTR tuners and mobile applications Very low forward resistance (typ. 0.45 Small capacitance Pb-free (RoHS compliant) package Qualified according AEC Q101 BA592 BA892/-02L BA892-02V Type BA592 BA892 BA892-02L BA892-02V Maximum Ratings at ...

  • Page 2

    Thermal Resistance Parameter 1) Junction - soldering point BA592 BA892, BA892-02V BA892-02L Electrical Characteristics at T Parameter DC Characteristics Reverse current Forward voltage I = 100 For calculation of R please refer ...

  • Page 3

    Electrical Characteristics at T Parameter AC Characteristics Diode capacitance MHz MHz 100 MHz R Reverse parallel resistance V ...

  • Page 4

    Diode capacitance Parameter 2 pF 1.2 1 MHz ... 1 GHz 0.8 0 Forward resistance 100MHz 2 10 Ohm ...

  • Page 5

    Insertion loss Parameter F BA892-02L in series configuration -0.2 -0.3 -0.4 0 0.5 1 1.5 = (f) Isolation Paramter R BA892-02L in series ...

  • Page 6

    Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 0.4 Cathode marking 0.93 Package SC79 0.2 M ...

  • Page 7

    Package Outline Cathode marking Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Cathode marking Package SCD80 0.2 A ...

  • Page 8

    Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 Month ...

  • Page 9

    Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Cathode marking Package SOD323 +0.2 0.9 -0.1 +0.2 1.25 0 -0.1 ±0.05 2 Cathode marking 1 +0.1 0.3 -0.05 ...

  • Page 10

    Package Outline Top view 2 1 Cathode marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" Copper Marking Layout (Example) Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 ...

  • Page 11

    ... For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...

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