MRF6S20010GNR1 Freescale Semiconductor, MRF6S20010GNR1 Datasheet

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MRF6S20010GNR1

Manufacturer Part Number
MRF6S20010GNR1
Description
MOSFET RF N-CH 28V 10W TO2704 GW
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MRF6S20010GNR1

Transistor Type
N-Channel
Frequency
2.17GHz
Gain
15.5dB
Voltage - Rated
68V
Current Rating
10µA
Current - Test
130mA
Voltage - Test
28V
Power - Output
10W
Package / Case
TO-270-2 Gull Wing
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
© Freescale Semiconductor, Inc., 2005 - 2006, 2008 - 2009. All rights reserved.
RF Device Data
Freescale Semiconductor
Freescale Semiconductor
Technical Data
RF Power Field Effect Transistors
N - Channel Enhancement - Mode Lateral MOSFETs
frequencies from 1600 to 2200 MHz. Suitable for analog and digital modulation
and multipurpose amplifier applications.
• Typical Two - Tone Performance @ 2170 MHz: V
• Typical 2 - Carrier W - CDMA Performance: V
• Typical Single- Carrier N - CDMA Performance: V
• Typical GSM EDGE Performance: V
• Capable of Handling 5:1 VSWR, @ 28 Vdc, 2000 MHz, 10 Watts CW
Features
• Characterized with Series Equivalent Large - Signal Impedance Parameters
• Internally Matched for Ease of Use
• Qualified Up to a Maximum of 32 V
• Integrated ESD Protection
• 225°C Capable Plastic Package
• RoHS Compliant
• In Tape and Reel. R1 Suffix = 500 Units per 24 mm, 13 inch Reel.
Table 1. Maximum Ratings
Drain - Source Voltage
Gate - Source Voltage
Storage Temperature Range
Case Operating Temperature
Operating Junction Temperature
Designed for Class A or Class AB general purpose applications with
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access
130 mA, P
P
Bandwidth = 3.84 MHz. PAR = 8.5 dB @ 0.01% Probability
130 mA, P
IS - 95 (Pilot, Sync, Paging, Traffic Codes 8 through 13), Channel Band-
width = 1.2288 MHz. PAR = 9.8 dB @ 0.01% Probability on CCDF.
4 Watts Avg., Full Frequency Band (1805- 1880 MHz)
Output Power
out
MTTF calculators by product.
Power Gain — 15.5 dB
Drain Efficiency — 36%
IMD — - 34 dBc
Power Gain — 15.5 dB
Drain Efficiency — 15%
IM3 @ 10 MHz Offset — - 47 dBc in 3.84 MHz Channel Bandwidth
ACPR @ 5 MHz Offset — - 49 dBc in 3.84 MHz Channel Bandwidth
Power Gain — 15.5 dB
Drain Efficiency— 16%
ACPR @ 885 kHz Offset = - 60 dBc in 30 kHz Bandwidth
Power Gain — 16 dB
Drain Efficiency — 33%
EVM — 1.3% rms
= 1 Watt Avg., Full Frequency Band (2130 - 2170 MHz), Channel
out
out
= 10 Watts PEP
= 1 Watt Avg., Full Frequency Band (1930- 1990 MHz),
(1,2)
Rating
DD
DD
Operation
= 28 Volts, I
DD
= 28 Volts, I
DD
DD
= 28 Volts, I
DQ
= 28 Volts, I
= 130 mA, P
DQ
= 130 mA,
DQ
DQ
=
=
out
=
Symbol
V
V
T
T
DSS
T
stg
GS
C
J
Document Number: MRF6S20010N
MRF6S20010GNR1
MRF6S20010NR1
1600- 2200 MHz, 10 W, 28 V
LATERAL N - CHANNEL
CASE 1265A - 03, STYLE 1
RF POWER MOSFETs
CASE 1265 - 09, STYLE 1
GSM, GSM EDGE
SINGLE N - CDMA
MRF6S20010GNR1
MRF6S20010NR1
- 65 to +150
TO - 270 - 2 GULL
- 0.5, +68
- 0.5, +12
2 x W - CDMA
Value
150
225
TO - 270 - 2
PLASTIC
PLASTIC
Rev. 3, 6/2009
Unit
Vdc
Vdc
°C
°C
°C
1

Related parts for MRF6S20010GNR1

MRF6S20010GNR1 Summary of contents

Page 1

... Document Number: MRF6S20010N Rev. 3, 6/2009 MRF6S20010NR1 MRF6S20010GNR1 1600- 2200 MHz GSM, GSM EDGE SINGLE N - CDMA CDMA LATERAL N - CHANNEL RF POWER MOSFETs CASE 1265 - 09, STYLE 270 - 2 PLASTIC MRF6S20010NR1 CASE 1265A - 03, STYLE 270 - 2 GULL PLASTIC MRF6S20010GNR1 Symbol Value V - 0.5, +68 DSS V - 0.5, + +150 stg T 150 C T 225 ...

Page 2

... MTTF calculators by product. 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955. 3. Part internally matched on input. 4. Measurement made with device in straight lead configuration before any lead forming operation is applied. MRF6S20010NR1 MRF6S20010GNR1 2 Rating 3 = 25°C unless otherwise noted) ...

Page 3

... Avg., DQ out — 15.5 — dB — 16 — % — 0.3 — dB — — dBc = 28 Vdc 130 mA Avg out — 16 — dB — 33 — % — 0.3 — dB — 1.3 — % rms — — dBc — — dBc MRF6S20010NR1 MRF6S20010GNR1 3 ...

Page 4

... Chip Capacitor C2, C6 4.7 pF Chip Capacitors C3, C7, C8 9.1 pF Chip Capacitors C4, C5, C9, C10 10 μ Chip Capacitors C11 10 μ Tantalum Chip Capacitor R1 1 kΩ, 1/4 W Chip Resistor R2 10 kΩ, 1/4 W Chip Resistor R3 10 Ω, 1/4 W Chip Resistor MRF6S20010NR1 MRF6S20010GNR1 Z16 R3 Z10 DUT Z17 Z10 0.930″ ...

Page 5

... R2 C1 C11 Figure 2. MRF6S20010NR1(GNR1) Test Circuit Component Layout — 2110 - 2170 MHz RF Device Data Freescale Semiconductor R3 MRF6S20010N, Rev. 2 MRF6S20010NR1 MRF6S20010GNR1 C10 C8 5 ...

Page 6

... MHz 2170.1 MHz −20 Two−Tone Measurements −30 −40 −50 5th Order −60 −70 0 OUTPUT POWER (WATTS) PEP out Figure 6. Intermodulation Distortion Products versus Output Power MRF6S20010NR1 MRF6S20010GNR1 6 — 2110 - 2170 MHz η D IRL Vdc (PEP) DD out I = 130 mA, 100 kHz Tone Spacing DQ IMD G ...

Page 7

... MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product −30_C 25_C 85_C η OUTPUT POWER (WATTS) CW out versus CW Output Power S21 S11 1200 1600 2000 2400 2800 f, FREQUENCY (MHz) 230 250 = 36%. D MRF6S20010NR1 MRF6S20010GNR1 −3 −6 −9 −12 −15 3200 7 ...

Page 8

... W−CDMA, 10 MHz Carrier Spacing, 3.84 MHz Channel 35 Bandwidth, PAR = 8 0.01% Probability (CCDF 0.1 Figure 14 Carrier W - CDMA ACPR, IM3, Power Gain and Drain Efficiency versus Output Power MRF6S20010NR1 MRF6S20010GNR1 8 — 2110 - 2170 MHz = 28 Vdc (Avg.), I = 130 mA out DQ 2080 2100 2120 2140 2160 2180 ...

Page 9

... Freescale Semiconductor W - CDMA TEST SIGNAL +20 +30 0 −10 −20 −30 −40 −50 −60 −IM3 in 3.84 MHz BW −70 − −25 −20 3.84 MHz Channel BW −ACPR in +ACPR in 3.84 MHz BW 3.84 MHz BW +IM3 in 3.84 MHz BW −15 −10 − FREQUENCY (MHz) Figure 16. 2-Carrier W-CDMA Spectrum MRF6S20010NR1 MRF6S20010GNR1 ...

Page 10

... Chip Capacitor C2, C6 4.7 pF Chip Capacitors C3, C7, C8 9.1 pF Chip Capacitors C4, C5, C9, C10 10 μF Chip Capacitors C11 10 μ Tantalum Chip Capacitor R1 kΩ, 1/4 W Chip Resistors R3 10 Ω, 1/4 W Chip Resistor MRF6S20010NR1 MRF6S20010GNR1 10 — 1930 - 1990 MHz Z7 C7 Z17 Z10 DUT ...

Page 11

... N - CDMA TYPICAL CHARACTERISTICS C11 MRF6S20010N Rev 0 Figure 18. MRF6S20010NR1(GNR1) Test Circuit Component Layout — 1930 - 1990 MHz RF Device Data Freescale Semiconductor — 1930 - 1990 MHz R3 MRF6S20010NR1 MRF6S20010GNR1 C10 11 ...

Page 12

... Figure 19. Single - Carrier N - CDMA Broadband Performance 1960 MHz, N−CDMA IS−95 40 (Pilot, Sync, Paging, Traffic Codes 8 Through 13 0.1 Figure 20. Single - Carrier N - CDMA ACPR and Drain MRF6S20010NR1 MRF6S20010GNR1 12 — 1930 - 1990 MHz = 28 Vdc (Avg.), I = 500 mA out DQ ACPR IRL 1920 1930 1940 1950 ...

Page 13

... FREQUENCY (MHz) MRF6S20010NR1 MRF6S20010GNR1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 14

... Chip Capacitor C2, C6 4.7 pF Chip Capacitors C3, C7, C8 9.1 pF Chip Capacitors C4, C5, C9, C10 10 μF Chip Capacitors C11 10 μ Tantalum Chip Capacitor R1 kΩ, 1/4 W Chip Resistors R3 10 Ω, 1/4 W Chip Resistor MRF6S20010NR1 MRF6S20010GNR1 14 — 1805 - 1880 MHz Z17 R3 Z10 Z11 DUT ...

Page 15

... GSM EDGE TYPICAL CHARACTERISTICS C11 MRF6S20010N Rev. 0 Figure 24. MRF6S20010NR1(GNR1) Test Circuit Component Layout — 1805 - 1880 MHz RF Device Data Freescale Semiconductor — 1805 - 1880 MHz R3 MRF6S20010NR1 MRF6S20010GNR1 C10 15 ...

Page 16

... Vdc 130 mA − 1840 MHz − 400 kHz −65 −70 −75 −80 0 OUTPUT POWER (WATTS) out Figure 27. Spectral Regrowth at 400 kHz and 600 kHz versus Output Power MRF6S20010NR1 MRF6S20010GNR1 η D IRL Vdc 130 FREQUENCY (MHz Watts out η D EVM OUTPUT POWER (WATTS) AVG. ...

Page 17

... DD DQ out source load MHz Ω Ω 1805 13.237 + j5.810 2.445 + j3.698 1840 13.953 + j6.084 2.542 + j3.942 1880 14.858 + j6.279 2.695 + j4.170 = Test circuit impedance as measured from gate to ground. = Test circuit impedance as measured from drain to ground. Output Matching Network MRF6S20010NR1 MRF6S20010GNR1 17 ...

Page 18

... MRF6S20010NR1 MRF6S20010GNR1 126 mA 25°C, 50 ohm system ∠ φ 1.195 42.42 0.001 0.947 40.48 0.001 ...

Page 19

... MRF6S20010NR1 MRF6S20010GNR1 19 ...

Page 20

... MRF6S20010NR1 MRF6S20010GNR1 20 PACKAGE DIMENSIONS RF Device Data Freescale Semiconductor ...

Page 21

... RF Device Data Freescale Semiconductor MRF6S20010NR1 MRF6S20010GNR1 21 ...

Page 22

... MRF6S20010NR1 MRF6S20010GNR1 22 RF Device Data Freescale Semiconductor ...

Page 23

... RF Device Data Freescale Semiconductor MRF6S20010NR1 MRF6S20010GNR1 23 ...

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... MRF6S20010NR1 MRF6S20010GNR1 24 RF Device Data Freescale Semiconductor ...

Page 25

... RF Device Data Freescale Semiconductor MRF6S20010NR1 MRF6S20010GNR1 25 ...

Page 26

... Added footnote, Measurement made with device in straight lead configuration before any lead forming operation is applied, to Functional Tests table • Added AN3789, Clamping of High Power RF Transistors and RFICs in Over - Molded Plastic Packages to Product Documentation, Application Notes • Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software MRF6S20010NR1 MRF6S20010GNR1 26 REVISION HISTORY Description to V ...

Page 27

... Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005 - 2006, 2008 - 2009. All rights reserved. MRF6S20010NR1 MRF6S20010GNR1 27 ...

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