L77SDE09S1ACH4R Amphenol, L77SDE09S1ACH4R Datasheet - Page 97

• Manufacturer Part Number: L77SDE09S1ACH4R
• Manufacturer: Amphenol
• Type: D-Subminiaturer

Specifications of L77SDE09S1ACH4R

• Gender: SKT
• Pitch: 2.74 mm
• Termination Method: Solder
• Mounting: Through Hole
• Body Orientation: Right Angle

Amphenol InfoCom Europe | www.amphenolinfocom.eu | [e-mail] | Specifications subject to change
Miniature Card – MiCro Sd ConneCtor
Part Numbers:
101-00112-68
101-00139-64
101-00139-68
101-00139-69
101-00240-64
101-00240-68
101-00240-69
101-00349-64
101-00349-68
101-00349-69
101-00303-68
101-00581-59
P/n
Micro-SD 8P p-p, w/o C/D, 15 u “ Au plated
Micro-SD 9P p-p, w/ C/D , 1 u “ Au plated
Micro-SD 9P p-p, w/ C/D , 15 u “ Au plated
Micro-SD 9P p-p, w/ C/D , 30 u “ Au plated
Micro-SD 8P, manual, w/ C/D, 1 u “ Au plated
Micro-SD 8P, manual, w/ C/D, 15 u “ Au plated
Micro-SD 8P, manual, w/ C/D, 30 u “ Au plated
Micro-SD 9P p-p, w/ C/D, 1 u “ Au plated
Micro-SD 9P p-p, w/ C/D, 15 u “ Au plated
Micro-SD 9P p-p, w/ C/D, 30 u “ Au plated
Micro SD Hinge Type, 15 u “ Au plated
Micro-SD p-p w/ C/D (Normal Close), 20u “ Au plated
Specifications:
Materials:
Description
Contact Resistance: 100 mΩ max at 100 mA
Insulation Resistance: 1000 MΩ min at 500 VDC
Voltage rating: 100V AC
Current Rating: 0.5 A per contact
Dielectric Strenght: 500 VAC/RMS initial and 250 VAC
final at 60 Hz for 1 minute
Operating Temperature: -25°C to +85°C
Housing: High Temperature thermoplastic,
UL94V-0 rated
Contact: Copper alloy with selective Au plating,
Tin plated on solder tail
Cover: Copper alloy nickel overall
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