BCV65,215 NXP Semiconductors, BCV65,215 Datasheet
BCV65,215
Specifications of BCV65,215
BCV65 T/R
BCV65 T/R
Related parts for BCV65,215
BCV65,215 Summary of contents
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BCV65 NPN/PNP general-purpose transistor Rev. 4 — 27 July 2010 1. Product profile 1.1 General description NPN/PNP general-purpose transistor in a small SOT143B Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Low current (max. 100 mA) Low voltage (max. ...
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... NXP Semiconductors 3. Ordering information Table 3. Type number BCV65 4. Marking Table 4. Type number BCV65 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor; for the PNP transistor with negative polarity ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) [1] Device mounted on an FR4 Printed-Circuit Board (PCB). 7. Characteristics Table 7. ° Symbol Per transistor; for the PNP transistor with negative polarity I CBO CEsat V BEsat V BE [1] V BEsat [ BCV65 Product data sheet Thermal characteristics Parameter thermal resistance from junction ...
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... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 1. TR1 (NPN): DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − 150 °C (1) T amb = 25 °C ...
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... NXP Semiconductors 1000 h FE 800 600 (1) 400 (2) 200 (3) 0 −2 −1 −10 −10 −1 = − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 5. TR2 (PNP): DC current gain as a function of collector current; typical values − CEsat (mV) −10 3 −10 ...
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... NXP Semiconductors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 9. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. ...
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... NXP Semiconductors 11. Soldering 0.7 (3×) 0.7 Fig 10. Reflow soldering footprint SOT143B 4.6 Fig 11. Wave soldering footprint SOT143B BCV65 Product data sheet 3.25 0.6 (3×) 0.5 (3×) 1.9 0.6 (3×) 0.6 0.75 0.95 0.9 1 4.45 2.2 2.575 1.2 All information provided in this document is subject to legal disclaimers. ...
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... Release date BCV65 v.4 20100727 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 1 “Product • Section 3 “Ordering • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information ...