BC847BPDXV6T1 ON Semiconductor, BC847BPDXV6T1 Datasheet

TRANS NPN/PNP DUAL LP 45V SOT563

BC847BPDXV6T1

Manufacturer Part Number
BC847BPDXV6T1
Description
TRANS NPN/PNP DUAL LP 45V SOT563
Manufacturer
ON Semiconductor
Datasheet

Specifications of BC847BPDXV6T1

Transistor Type
NPN, PNP
Current - Collector (ic) (max)
100mA
Voltage - Collector Emitter Breakdown (max)
45V
Vce Saturation (max) @ Ib, Ic
600mV @ 5mA, 100mA / 650mV @ 5mA, 100mA
Dc Current Gain (hfe) (min) @ Ic, Vce
200 @ 2mA, 5V
Power - Max
500mW
Frequency - Transition
100MHz
Mounting Type
Surface Mount
Package / Case
SOT-563, SOT-6
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Collector Cutoff (max)
-
Other names
BC847BPDXV6T1OS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BC847BPDXV6T1G
Manufacturer:
ON Semiconductor
Quantity:
2 050
Part Number:
BC847BPDXV6T1G
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
BC847BPDXV6T1G
Quantity:
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BC847BPDXV6T1,
BC847BPDXV6T5
Dual General Purpose
Transistor
NPN/PNP Dual (Complementary)
applications. It is housed in the SOT−563 which is designed for low
power surface mount applications.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−4 @ Minimum Pad
© Semiconductor Components Industries, LLC, 2005
September, 2005 − Rev. 1
MAXIMUM RATINGS − NPN
MAXIMUM RATINGS − PNP
THERMAL CHARACTERISTICS
Collector −Emitter Voltage
Collector −Base Voltage
Emitter −Base Voltage
Collector Current −
Collector −Emitter Voltage
Collector −Base Voltage
Emitter −Base Voltage
Collector Current −
Total Device Dissipation
Thermal Resistance −
Total Device Dissipation
Derate above 25°C
Thermal Resistance −
Junction and Storage
This transistor is designed for general purpose amplifier
Lead−Free Solder Plating
Continuous
Continuous
Derate above 25°C
Junction-to-Ambient
T
Junction-to-Ambient
Temperature Range
A
(Both Junctions Heated)
= 25°C
(One Junction Heated)
Characteristic
Characteristic
Rating
Rating
T
A
= 25°C
Symbol
Symbol
V
V
V
V
V
V
CEO
CBO
EBO
CEO
CBO
EBO
I
I
C
C
Symbol
Symbol
T
R
R
J
P
P
, T
qJA
qJA
D
D
stg
−55 to +150
Value
Value
−100
−5.0
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
100
−45
−50
6.0
45
50
Max
Max
357
350
500
250
2.9
4.0
1
mW/°C
mW/°C
mAdc
mAdc
°C/W
°C/W
Unit
Unit
Unit
Unit
mW
mW
°C
V
V
V
V
V
V
†For information on tape and reel specifications,
BC847BPDXV6T1
BC847BPDXV6T1G SOT−563
BC847BPDXV6T5
BC847BPDXV6T5G SOT−563
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Device
Q
4F = Specific Device Code
M
G
(Note: Microdot may be in either location)
ORDERING INFORMATION
(4)
(3)
1
MARKING DIAGRAM
= Month Code
= Pb−Free Package
http://onsemi.com
BC847BPDX6T1
1
CASE 463A
6
SOT−563
PLASTIC
(Pb−Free)
(Pb−Free)
SOT−563
SOT−563
Package
4F MG
5 4
(5)
G
Publication Order Number:
(2)
1 2
3
BC847BPDXV6T1/D
4000/Tape & Reel
4000/Tape & Reel
8000/Tape & Reel
8000/Tape & Reel
4 mm pitch
2 mm pitch
4 mm pitch
2 mm pitch
Shipping
(1)
(6)
Q
2

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BC847BPDXV6T1 Summary of contents

Page 1

... Microdot may be in either location) ORDERING INFORMATION Device Package Shipping BC847BPDXV6T1 SOT−563 4 mm pitch 4000/Tape & Reel BC847BPDXV6T1G SOT−563 2 mm pitch (Pb−Free) 4000/Tape & Reel BC847BPDXV6T5 SOT−563 4 mm pitch 8000/Tape & Reel BC847BPDXV6T5G SOT−563 2 mm pitch (Pb− ...

Page 2

... BC847BPDXV6T1, BC847BPDXV6T5 ELECTRICAL CHARACTERISTICS (NPN) Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage ( mA) C Collector −Emitter Breakdown Voltage = 10 μ Collector −Base Breakdown Voltage = 10 mA Emitter −Base Breakdown Voltage = 1.0 mA Collector Cutoff Current ( 150° CHARACTERISTICS DC Current Gain = 10 μ 5 2 Collector −Emitter Saturation Voltage (I C Collector − ...

Page 3

... BC847BPDXV6T1, BC847BPDXV6T5 ELECTRICAL CHARACTERISTICS (PNP) Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (I = −10 mA) C Collector −Emitter Breakdown Voltage = −10 μ Collector −Base Breakdown Voltage = −10 mA Emitter −Base Breakdown Voltage = −1.0 mA Collector Cutoff Current (V = − Collector Cutoff Current (V = − 150° CHARACTERISTICS DC Current Gain = − ...

Page 4

... BC847BPDXV6T1, BC847BPDXV6T5 2.0 1.5 1.0 0.8 0.6 0.4 0.3 0.2 0.2 0.5 1.0 2.0 5 COLLECTOR CURRENT (mAdc) C Figure 1. Normalized DC Current Gain 2 1.6 1 0.8 0.4 0 0.02 0.1 1 BASE CURRENT (mA) B Figure 3. Collector Saturation Region 10 7 2.0 1.0 0.4 0.6 0.8 1.0 2 ...

Page 5

... BC847BPDXV6T1, BC847BPDXV6T5 TYPICAL PNP CHARACTERISTICS 2 − 25°C A 1.0 0.7 0.5 0.3 0.2 −0.2 −0.5 −1.0 −2.0 −5.0 −10 − COLLECTOR CURRENT (mAdc) C Figure 7. Normalized DC Current Gain −2.0 T −1.6 −1 − −0.8 − − −0.4 0 −0.02 −0.1 −1 BASE CURRENT (mA) B Figure 9 ...

Page 6

... BC847BPDXV6T1, BC847BPDXV6T5 INFORMATION FOR USING THE SOT−563 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection The power dissipation of the SOT− ...

Page 7

... BC847BPDXV6T1, BC847BPDXV6T5 PACKAGE DIMENSIONS D A −X− −Y− 0.08 (0.003 SOLDERING FOOTPRINT* 1.35 0.0531 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOT−563, 6 LEAD CASE 463A−01 ...

Page 8

... BC847BPDXV6T1, BC847BPDXV6T5 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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