CRCW0805301RFKEA Vishay, CRCW0805301RFKEA Datasheet - Page 6

Res Thick Film 0805 301 Ohm 1% 1/8W ±100ppm/°C Molded SMD

CRCW0805301RFKEA

Manufacturer Part Number
CRCW0805301RFKEA
Description
Res Thick Film 0805 301 Ohm 1% 1/8W ±100ppm/°C Molded SMD
Manufacturer
Vishay
Type
Thick Filmr
Series
CRCWr
Datasheet

Specifications of CRCW0805301RFKEA

Case Size
0805
Resistance Value
301 Ohm
Power Rating
1/8 W
Tolerance
1 %
Resistance
301 Ohms
Voltage Rating
150 Volts
Temperature Coefficient
±100ppm/°C
Resistance (ohms)
301
Power (watts)
0.125W, 1/8W
Composition
Thick Film
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Height
0.018" (0.45mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0805 (2012 Metric)
Resistance In Ohms
301
Case
0805 (2012 metric)
Termination Style
SMD/SMT
Operating Temperature Range
- 55 C to + 155 C
Dimensions
1.25 mm W x 2 mm L x 0.45 mm H
Product
Thick Film Resistors SMD
Resistance Tolerance
± 1%
Resistor Element Material
Thick Film
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
541-301CTR
D12/CRCW0805 100 301R 1% ET1 E3
D/CRCW e3
Vishay
www.vishay.com
130
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
METHOD
60068-2
21 (Uu
21 (Uu
14 (Na)
30 (Db)
30 (Db)
58 (Td)
13 (M)
2 (Ba)
1 (Aa)
TEST
IEC
-
-
-
-
-
-
-
3
1
)
)
Short time overload
Substrate bending
Climatic sequence:
Rapid change of
Damp heat, cyclic
Damp heat, cyclic
Low air pressure
Voltage proof
Temperature
Solderability
temperature
Resistance
Endurance
(adhesion)
coefficient
DC load
at 70 °C
Dry heat
Shear
TEST
Cold
For technical questions, contact:
Standard Thick Film Chip Resistors
Stability for product types:
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
This datasheet is subject to change without notice.
1 kPa; (25 ± 10) °C; 1 h
U =
duration: Acc. to style
Solder bath method;
Solder bath method;
U = 2.5 x
(20/- 55/20) C and
U = 1.4 x U
non activated flux;
non-activated flux;
30 min. at - 55 °C;
55 °C;  90 % RH;
55 °C;  90 % RH;
1.5 h on; 0.5 h off;
30 min. at 125 °C
Sn96.5Ag3Cu0.5
(20/125/20) C
PROCEDURE
U =
24 h; 5 cycles
70 °C; 1000 h
70 °C; 8000 h
Depth 2 mm;
125 °C; 16 h
24 h; 1 cycle
(235 ± 5) °C
(245 ± 5) C
1000 cycles
 2 x U
- 55 °C; 2 h
P
Sn60Pb40
(2 ± 0.2) s
(3 ± 0.3) s
5 cycles
70
3 times
P
x R
D/CRCW e3
-
-
70
P
max.
ins
70
x R
 U
; 60 s
;
x R
max.
;
thickfilmchip@vishay.com
±0.25 % R + 0.05)
± (0.25 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
No visible damage, no open circuit in bent position
OR BETTER
± 100 ppm/K
STABILITY
CLASS 1
± 1 %
PERMISSIBLE CHANGE (R)
Good tinning ( 95 % covered)
Good tinning ( 95 % covered)
No flashover or breakdown
± (0.25 % R + 0.05 )
SIZE 0402 to 2512
No visible damage
REQUIREMENTS
no visible damage
no visible damage
1  to 10 M
± (0.5 % R + 0.05 )
±0.5 % R + 0.05)
Document Number: 20035
www.vishay.com/doc?91000
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (2 % R + 0.1 )
± (4 % R + 0.1 )
OR BETTER
± 200 ppm/K
STABILITY
CLASS 2
Revision: 08-Mar-11
± 5 %

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