PBLS2021D,115 NXP Semiconductors, PBLS2021D,115 Datasheet
PBLS2021D,115
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PBLS2021D,115 Summary of contents
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PBLS2021D 20 V, 1.8 A PNP BISS loadswitch Rev. 02 — 6 September 2009 1. Product profile 1.1 General description PNP low V Equipped Transistor (RET SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package. 1.2 Features I Low ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number Package PBLS2021D 4. Marking Table 4. Type number PBLS2021D PBLS2021D_2 Product data sheet Pinning Description base TR1 input (base) TR2 output (collector) TR2 GND (emitter) TR2 collector TR1 emitter TR1 Ordering information ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol TR1; PNP low V V CBO V CEO V EBO tot TR2; NPN resistor-equipped transistor V CBO V CEO V EBO tot Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors (1) Ceramic PCB, Al (2) FR4 PCB, mounting pad for collector 1 cm (3) FR4 PCB, standard footprint Fig 1. 6. Thermal characteristics Table 6. Symbol Per device R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors th(j- (K/W) 0.75 0. 0.33 0.20 0.10 0.05 10 0.02 0. FR4 PCB, standard footprint Fig 2. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse duration; typical values th(j-a) (K/ 0.75 0. 0.33 0.20 0.10 0.05 10 0.02 0. FR4 PCB, mounting pad for collector 1 cm Fig 3. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse duration ...
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... NXP Semiconductors th(j-a) (K/ 0. 0.50 0.33 0.20 0.10 10 0.05 0.02 0. Ceramic PCB standard footprint 2 3 Fig 4. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table unless otherwise specified. amb Symbol TR1; PNP low V ...
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... NXP Semiconductors Table unless otherwise specified. amb Symbol V BEon off TR2; NPN resistor-equipped transistor I CBO I CEO I EBO CEsat V I(off) V I(on) R1 R2/ [1] Pulse test: t PBLS2021D_2 Product data sheet Characteristics …continued Parameter Conditions base-emitter turn-on voltage delay time mA; Bon rise time Boff ...
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... NXP Semiconductors 800 h FE (1) 600 (2) 400 (3) 200 ( 100 C amb ( amb ( amb Fig 5. TR1 (PNP): DC current gain as a function of collector current; typical values 1 (V) 1.0 (1) 0.8 (2) 0.6 (3) 0 amb ( amb ( 100 C amb Fig 7. TR1 (PNP): Base-emitter voltage as a function of collector current; typical values ...
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... NXP Semiconductors 1 V CEsat ( ( 100 C amb ( amb ( amb Fig 9. TR1 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values CEsat ( ) ( 100 C amb ( amb ( amb Fig 11. TR1 (PNP): Collector-emitter saturation resistance as a function of collector current; typical values PBLS2021D_2 Product data sheet ...
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... NXP Semiconductors ( 150 C amb ( amb ( amb Fig 13. TR2 (NPN): DC current gain as a function of collector current; typical values I(on) (V) 10 (1) ( amb ( amb ( 100 C amb Fig 14. TR2 (NPN): On-state input voltage as a function of collector current; typical values PBLS2021D_2 Product data sheet ...
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... NXP Semiconductors CEsat (mV (1) ( 100 C amb ( amb ( amb Fig 16. TR2 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values PBLS2021D_2 Product data sheet 006aaa014 1 V CEsat ( (mA) C Fig 17. TR2 (NPN): Collector-emitter saturation Rev. 02 — 6 September 2009 PBLS2021D 20 V, 1.8 A PNP BISS loadswitch ...
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... NXP Semiconductors 8. Test information Fig 18. TR1: BISS transistor switching time definition Fig 19. TR1: Test circuit for switching times 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications ...
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... NXP Semiconductors 9. Package outline Fig 20. Package outline SOT457 (SC-74) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PBLS2021D [1] For further information and the availability of packing methods, see [2] T1: normal taping ...
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... NXP Semiconductors 11. Revision history Table 9. Revision history Document ID Release date PBLS2021D_2 20090906 • Modifications: Table 7 PBLS2021D_1 20090622 PBLS2021D_2 Product data sheet Data sheet status Product data sheet “Characteristics”: I conditions amended CES Product data sheet Rev. 02 — 6 September 2009 PBLS2021D ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 12 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 10 Packing information Revision history ...