GRM0335C1E820JD01D Murata Electronics, GRM0335C1E820JD01D Datasheet

GRM0335C1E820JD01D

Manufacturer Part Number

GRM0335C1E820JD01D

Description

Cap Ceramic 82pF 25VDC C0G 5% SMD 0201 Paper T/R

Manufacturer

Murata Electronics

Type

Flatr

Datasheet

1.GRM0335C1E820JD01D.pdf (1 pages)

Specifications of GRM0335C1E820JD01D

Package/case

0201

Mounting

Surface Mount

Capacitance Value

82 pF

Dielectric

C0G

Voltage

25 Vdc

Product Length

0.6 mm

Product Height

0.3 mm

Tolerance

5 %

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

GRM0335C1E820JD01D

Manufacturer:

MURATA

Quantity:

15 000

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I Dimensions

I Rated Value

! Note:

1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our

2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product

• The RoHS compliance means that we judge from EU Directive 2002/95/EC the products do not contain lead, cadmium, mercury, hexavalent

• This statement does not insure the compliance of any of the listed parts with any laws or legal imperatives developed by any EU members

Temperature Char.

products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.

specifications or transact the approval sheet for product specifications before ordering.

Capacitance Tol.

chromium, PBB and PBDE, except exemptions stated in EU Directive 2002/95/EC annex and impurities existing in natural world.

individually with regards to the RoHS Directive.

This data sheet is applied for CHIP MONOLITHIC CERAMIC CAPACITOR used for General Electronics equipment for your design.

Use of Sn-Zn based solder will deteriorate reliability of MLCC. Please check with our sales represetatives for the use of Sn-Zn based solder in advance.

Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin

melting point is used. Please confirm the solderability of Tin plating termination chip before use.

Rated Voltage

Capacitance

Electrode Gap g (min.)

Thickness T

Electrode e

Length L

Width W

GRM0335C1E820JD01p

Monolithic Ceramic Capacitors

Murata PN Code

820