BU406 Fairchild Semiconductor, BU406 Datasheet

BU406

Manufacturer Part Number

BU406

Description

TRANSISTOR NPN 200V 7A TO-220

Manufacturer

Fairchild Semiconductor

Datasheet

1.BU406.pdf (5 pages)

Specifications of BU406

Transistor Type

NPN

Current - Collector (ic) (max)

Voltage - Collector Emitter Breakdown (max)

200V

Vce Saturation (max) @ Ib, Ic

1V @ 500mA, 5A

Current - Collector Cutoff (max)

5mA

Power - Max

60W

Frequency - Transition

10MHz

Mounting Type

Through Hole

Package / Case

TO-220-3 (Straight Leads)

Transistor Polarity

NPN

Mounting Style

Through Hole

Collector- Emitter Voltage Vceo Max

200 V

Emitter- Base Voltage Vebo

6 V

Maximum Dc Collector Current

7 A

Power Dissipation

60 W

Maximum Operating Temperature

+ 150 C

Continuous Collector Current

7 A

Maximum Operating Frequency

10 MHz

Minimum Operating Temperature

- 65 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Dc Current Gain (hfe) (min) @ Ic, Vce

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

BU406
BU406FS

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Current page: 1 of 6
Download datasheet (87Kb)

This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Sun, Brian

E-mail: Brian.Sun@fairchildsemi.com

Phone:

Implementation of change:

Expected 1st Device Shipment Date: 2008/01/29

Earliest Year/Work Week of Changed Product: 0805

Change Type Description: Lead Frame Dimensions (Internal and External)

Description of Change (From): Current TO-220 heatsink and die attach pad thickness of

1.30mm.

Description of Change (To): New TO-220 heatsink and die attach pad thickness will be

0.51mm. There is no change in heatsink and die attach pad material. Conversion of heatsink

thickness will be done on a part by part basis starting WW05 of 2008 to prevent mixing of

product with different heat sink dimensions in shipments during the transition period.

Reason for Change : Enhancement of leadframe design to improve package mechanical

performance and support additional demand for various TO-220 products to improve our

service to customers. There is insignificant difference in product thermal performance.

Qual/REL Plan Numbers : Q20070208

Qualification :

Passed and meet the FSC rel performance requirement

Change From

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: LEE, SANGDO

E-mail: SANGDO.LEE@fairchildsemi.com

Phone: 86-512-6762-3311 ext 8671

Date Issued On : 2007/11/29

Date Created : 2007/11/16

PCN# : Q3073802-A

Pg. 1

Related parts for BU406

BU406 Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Change To Pg. 2 ...

Page 3

Results/Discussion Test: (Autoclave) Lot Device Q20070208AAACLV MC78T12CT Q20070208BAACLV KA350TU Q20070208CAACLV KSE13003TH2ATU Q20070208DAACLV KSE13009TU Q20070208EAACLV FJP5027RTU_F080 Test: (High Temperature Reverse Bias) Lot Device Q20070208CAHTRB KSE13003TH2ATU Q20070208DAHTRB KSE13009TU Q20070208EAHTRB FJP5027RTU_F080 Test: (High Temperature Storage Life) Lot Device Q20070208AAHTSL MC78T12CT Q20070208BAHTSL KA350TU Q20070208CAHTSL ...

Page 4

Test: (Temperature Humidity Biased Test) Lot Device Q20070208AATHBT MC78T12CT Q20070208BATHBT KA350TU Q20070208CATHBT KSE13003TH2ATU Q20070208DATHBT KSE13009TU Q20070208EATHBT FJP5027RTU_F080 Test: -65C, 150C (Temperature Cycle) Lot Device Q20070208AATMCL1 MC78T12CT Q20070208AATMCL1 MC78T12CT Q20070208BATMCL1 KA350TU Q20070208BATMCL1 KA350TU Q20070208CATMCL1 KSE13003TH2ATU Q20070208CATMCL1 KSE13003TH2ATU Q20070208DATMCL1 KSE13009TU Q20070208DATMCL1 KSE13009TU ...

Page 5

... KSB707RTU KSB708RTU KSB834Y KSC1507OTU KSC1507YTU KSC2073H2 KSC2233 KSC2334RTU KSC2334YTU_NL KSC2335YTU KSC5039H2 KSC5338DTU KSC5504DTTU_NL KSD288O KSD288WTU KSD288YTU_NL BDX53BTU BDX53CTU_NBDC004 BDX54ATU BDX54CTU BU406TU BU407TU BU807 BUT11A BUT12A D44H10TU FJP13007H1TU_F080 FJP13007TU FJP13009H2TU_F080 FJP3305H1TU FJP5027OTU FJP5027TU FJP5321TU FJP5554TU FJP9100TU FYP1010DNTU FYP1504DNTU FYP2006DNTU FYP2010DNTU_F080 KSA1010RTU KSA614O ...

Page 6

KSD362R KSD363OTU KSD363Y KSD401G KSD401YTU KSD526Y KSD560OTU KSD560Y KSD568RTU KSD569RTU KSD73Y KSD880OPATU KSE13009TU KSE3055T KSE44H11 KSE45H11TU MBR3030CTTU MBRP3010NTU MBRP3045NTU_F080 MJE2955TTU_NL TIP102 TIP105 TIP107 TIP110TU TIP112 TIP115TU TIP120 TIP121TU TIP122TU_NL TIP125TU TIP127 TIP142TTU TIP29 TIP29C TIP30C TIP31A TIP31C TIP32A TIP32C TIP41A ...

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