2PB709ASL,215 NXP Semiconductors, 2PB709ASL,215 Datasheet

TRANSISTOR PNP 45V 100MA SOT-23

2PB709ASL,215

Manufacturer Part Number
2PB709ASL,215
Description
TRANSISTOR PNP 45V 100MA SOT-23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 2PB709ASL,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Transistor Type
PNP
Current - Collector (ic) (max)
100mA
Voltage - Collector Emitter Breakdown (max)
45V
Vce Saturation (max) @ Ib, Ic
500mV @ 10mA, 100mA
Dc Current Gain (hfe) (min) @ Ic, Vce
290 @ 2mA, 10V
Power - Max
250mW
Frequency - Transition
80MHz
Mounting Type
Surface Mount
Minimum Operating Temperature
- 55 C
Configuration
Single
Transistor Polarity
PNP
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
45 V
Emitter- Base Voltage Vebo
6 V
Maximum Dc Collector Current
0.1 A
Power Dissipation
250 mW
Maximum Operating Frequency
70 MHz
Maximum Operating Temperature
+ 150 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Collector Cutoff (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
2PB709ASL T/R
568-4658-2
934062299215
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
PNP general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted
Device (SMD) plastic package.
Table 1.
[1]
I
I
I
I
I
Table 2.
Type number
2PB709ARL
2PB709ASL
2PB709ARL/DG
2PB709ASL/DG
Symbol
V
I
h
C
FE
CEO
2PB709ARL; 2PB709ASL
45 V, 100 mA PNP general-purpose transistors
Rev. 01 — 12 November 2008
General-purpose transistors
Two current gain selections
AEC-Q101 qualified
Small SMD plastic package
General-purpose switching and amplification
/DG: halogen-free
Product overview
Quick reference data
Parameter
collector-emitter voltage
collector current
DC current gain
[1]
h
h
FE
FE
group R
group S
Package
NXP
SOT23
SOT23
Conditions
open base
V
I
C
CE
= 2 mA
= 10 V;
JEDEC
TO-236AB
TO-236AB
Min
-
-
210
290
Product data sheet
NPN complement
2PD601ARL
2PD601ASL
2PD601ARL/DG
2PD601ASL/DG
Typ
-
-
-
-
Max
340
460
45
100
Unit
V
mA

Related parts for 2PB709ASL,215

2PB709ASL,215 Summary of contents

Page 1

V, 100 mA PNP general-purpose transistors Rev. 01 — 12 November 2008 1. Product profile 1.1 General description PNP general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Table 1. Type number 2PB709ARL 2PB709ASL ...

Page 2

... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number 2PB709ARL 2PB709ASL 2PB709ARL/DG 2PB709ASL/DG [1] /DG: halogen-free 4. Marking Table 5. Type number 2PB709ARL 2PB709ASL 2PB709ARL/DG 2PB709ASL/DG [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 2PB709AXL_1 Product data sheet 2PB709ARL; 2PB709ASL ...

Page 3

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...

Page 4

... NXP Semiconductors Table unless otherwise specified. amb Symbol [1] Pulse test Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications. ...

Page 5

... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number 2PB709ARL 2PB709ASL 2PB709ARL/DG 2PB709ASL/DG [1] For further information and the availability of packing methods, see [2] /DG: halogen-free 11. Soldering 3 1.7 Fig 2. 2PB709AXL_1 Product data sheet 2PB709ARL ...

Page 6

... NXP Semiconductors 4.6 2.6 Fig 3. 2PB709AXL_1 Product data sheet 2PB709ARL; 2PB709ASL 45 V, 100 mA PNP general-purpose transistors 2 1.4 2.8 4.5 Wave soldering footprint SOT23 (TO-236AB) Rev. 01 — 12 November 2008 solder lands solder resist occupied area Dimensions in mm preferred transport direction during soldering sot023_fw © ...

Page 7

... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date 2PB709AXL_1 20081112 2PB709AXL_1 Product data sheet 2PB709ARL; 2PB709ASL 45 V, 100 mA PNP general-purpose transistors Data sheet status Change notice Product data sheet - Rev. 01 — 12 November 2008 Supersedes - © NXP B.V. 2008. All rights reserved. ...

Page 8

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 9

... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 4 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 4 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 10 Packing information Soldering ...

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