PBSS302PZ,135 NXP Semiconductors, PBSS302PZ,135 Datasheet - Page 11

• Manufacturer Part Number: PBSS302PZ,135
• Description: TRANS PNP 20V 5.5A SOT-223
• Manufacturer: NXP Semiconductors

Specifications of PBSS302PZ,135

• Package / Case: SOT-223 (3 leads + Tab), SC-73, TO-261
• Transistor Type: PNP
• Current - Collector (ic) (max): 5.5A
• Voltage - Collector Emitter Breakdown (max): 20V
• Vce Saturation (max) @ Ib, Ic: 265mV @ 275mA, 5.5A
• Dc Current Gain (hfe) (min) @ Ic, Vce: 200 @ 2A, 2V
• Power - Max: 2W
• Frequency - Transition: 130MHz
• Mounting Type: Surface Mount
• Minimum Operating Temperature: - 65 C
• Configuration: Single Dual Collector
• Transistor Polarity: PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 20 V
• Emitter- Base Voltage Vebo: 5 V
• Maximum Dc Collector Current: 5.5 A
• Power Dissipation: 2000 mW
• Maximum Operating Frequency: 130 MHz (Typ)
• Maximum Operating Temperature: + 150 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4180-2; 934059049135; PBSS302PZ /T3; PBSS302PZ /T3

NXP Semiconductors
11. Soldering
PBSS302PZ_2
Product data sheet
Fig 16. Reflow soldering footprint SOT223 (SC-73)
Fig 17. Wave soldering footprint SOT223 (SC-73)
1.9
(4×)
1.3
(4×)
1.2
1
1
2.7
2.3
Rev. 02 — 20 November 2009
6.15
8.9
6.7
1.1
3.85
(3×)
(3×)
3.6
3.5
1.2
1.3
7
4
2
4
2
0.3
2.3
2.7
3
(2×)
1.9
3
20 V, 5.5 A PNP low V
3.9
6.2
6.1
(3×)
1.9
7.65
8.7
PBSS302PZ
CEsat
Dimensions in mm
Dimensions in mm
direction during soldering
© NXP B.V. 2009. All rights reserved.
(BISS) transistor
preferred transport
solder lands
solder resist
occupied area
solder lands
solder resist
solder paste
occupied area
sot223_fr
sot223_fw
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