PBSS302PX,115 NXP Semiconductors, PBSS302PX,115 Datasheet - Page 11

• Manufacturer Part Number: PBSS302PX,115
• Description: TRANS PNP 20V 5.1A SOT-89
• Manufacturer: NXP Semiconductors

Specifications of PBSS302PX,115

• Package / Case: SC-62, SOT-89, TO-243 (3 Leads + Tab)
• Transistor Type: PNP
• Current - Collector (ic) (max): 5.1A
• Voltage - Collector Emitter Breakdown (max): 20V
• Vce Saturation (max) @ Ib, Ic: 230mV @ 255mA, 5.1A
• Dc Current Gain (hfe) (min) @ Ic, Vce: 200 @ 2A, 2V
• Power - Max: 2.1W
• Frequency - Transition: 130MHz
• Mounting Type: Surface Mount
• Minimum Operating Temperature: - 65 C
• Configuration: Single
• Transistor Polarity: PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 20 V
• Emitter- Base Voltage Vebo: 5 V
• Maximum Dc Collector Current: 5.1 A
• Power Dissipation: 2100 mW
• Maximum Operating Frequency: 130 MHz (Typ)
• Maximum Operating Temperature: + 150 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4174-2; 934059015115; PBSS302PX T/R; PBSS302PX T/R

NXP Semiconductors
11. Soldering
PBSS302PX_2
Product data sheet
Fig 16. Reflow soldering footprint SOT89 (SC-62)
Fig 17. Wave soldering footprint SOT89 (SC-62)
4.60
0.85
Not recommended for wave soldering
1.20
1.20
1.00
0.20
(3x)
1.50
3
Rev. 02 — 20 November 2009
6.60
2.40
0.70
5.30
3
3.70
1.90
1.20
3.95
4.75
2.25
2.00
2
1
2
0.50
20 V, 5.1 A PNP low V
1.20
3.50
3.00
1
0.60 (3x)
0.70 (3x)
7.60
0.50
preferred transport direction during soldering
1.20
1.70
4.85
Dimensions in mm
msa442
PBSS302PX
CEsat
solder lands
solder resist
occupied area
Dimensions in mm
© NXP B.V. 2009. All rights reserved.
(BISS) transistor
solder lands
solder resist
occupied area
solder paste
msa423
11 of 15