UPC8179TK NEC, UPC8179TK Datasheet

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UPC8179TK

Manufacturer Part Number
UPC8179TK
Description
RF Amplifier Lo-Current Amplifier
Manufacturer
NEC
Datasheet

Specifications of UPC8179TK

Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Document No. PU10059EJ02V0DS (2nd edition)
Date Published April 2005 CP(K)
DESCRIPTION
IC can realize low current consumption with external chip inductor which can not be realized on internal 50 
wide band matched IC.
FEATURES
• Low current consumption
• Supply voltage
• Excellent isolation
• Power gain
• Gain 1 dB compression output power : P
• Operating frequency
• High-density surface mounting
• Light weight
APPLICATION
• Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system
PC8179TB in 6-pin super minimold.
The
TK suffix IC which is smaller package than TB suffix IC contributes to reduce mounting space by 50%.
This IC is manufactured using our 30 GHz f
PC8179TK is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This
3 V SILICON MMIC LOW CURRENT AMPLIFIER
PC8179TK adopts 6-pin lead-less minimold package using same chip as the conventional
FOR MOBILE COMMUNICATIONS
The mark  shows major revised points.
: I
: V
: ISL = 43.0 dB TYP. @ f = 1.0 GHz
: G
: 0.1 to 2.4 GHz (Output port LC matching)
: 6-pin lead-less minimold package (1.5  1.3  0.55 mm)
: 3 mg (Standard value)
ISL = 42.0 dB TYP. @ f = 1.9 GHz
ISL = 42.0 dB TYP. @ f = 2.4 GHz
G
G
P
P
BIPOLAR ANALOG INTEGRATED CIRCUIT
CC
CC
O (1 dB)
O (1 dB)
O (1 dB)
P
P
P
= 4.0 mA TYP. @ V
= 13.5 dB TYP. @ f = 1.0 GHz
= 15.5 dB TYP. @ f = 1.9 GHz
= 16.0 dB TYP. @ f = 2.4 GHz
DATA SHEET
max
= 2.4 to 3.3 V
UHS0 (Ultra High Speed Process) silicon bipolar process.
= +2.0 dBm TYP. @ f = 1.0 GHz
= +0.5 dBm TYP. @ f = 1.9 GHz
= +0.5 dBm TYP. @ f = 2.4 GHz
CC
= 3.0 V
NEC Compound Semiconductor Devices, Ltd. 2002, 2005
PC8179TK

Related parts for UPC8179TK

UPC8179TK Summary of contents

Page 1

... +0.5 dBm TYP 2.4 GHz O (1 dB) : 0.1 to 2.4 GHz (Output port LC matching) : 6-pin lead-less minimold package (1.5  1.3  0.55 mm (Standard value) The mark  shows major revised points.  PC8179TK  NEC Compound Semiconductor Devices, Ltd. 2002, 2005 ...

Page 2

ORDERING INFORMATION Part Number Order Number   PC8179TK-E2 PC8179TK-E2-A 6-pin lead-less minimold (1511) (Pb-Free) Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact ...

Page 3

SYSTEM APPLICATION EXAMPLE Location examples in digital cellular These ICs can be added to your system around herein, however, shows only examples, therefore the application can depend on your kit evaluation. parts, when you need more isolation or gain. The ...

Page 4

... Ground pattern on the board should be formed as wide as possible. All the ground pins must be con- nected together with wide ground pattern to decrease impedance defference. Signal output pin. This pin is de- signed as collector output. Due to the high impedance output, this ...

Page 5

ABSOLUTE MAXIMUM RATINGS Parameter Symbol Supply Voltage V CC Circuit Current I CC Power Dissipation P D Operating Ambient Temperature T A Storage Temperature T stg Input Power P in Note Mounted on double-sided copper-clad 50  50  1.6 ...

Page 6

TEST CIRCUITS <1> 1.0 GHz <2> 1.9 GHz <3> 2.4 GHz 6 Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 7

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD <1> 1.0 GHz Remarks 1. 42  35  0.4 mm double-sided copper-clad polyimide board 2. Back side: GND pattern 3. Gold plated on pattern 4. :Through holes COMPONENT ...

Page 8

GHz Remarks 1. 42  35  0.4 mm double-sided copper-clad polyimide board 2. Back side: GND pattern 3. Gold plated on pattern 4. :Through holes COMPONENT LIST Form Symbol Chip capacitor ...

Page 9

GHz Remarks 1. 42  35  0.4 mm double-sided copper-clad polyimide board 2. Back side: GND pattern 3. Gold plated on pattern 4. :Through holes COMPONENT LIST Form Symbol Chip capacitor ...

Page 10

TYPICAL CHARACTERISTICS (T A Remark The graph indicates nominal characteristics +25C, unless otherwise specified) Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 11

GHz MATCHING Remark The graphs indicate nominal characteristics. Data Sheet PU10059EJ02V0DS  PC8179TK 11 ...

Page 12

Remark The graphs indicate nominal characteristics. 12 Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 13

Remark The graphs indicate nominal characteristics. Data Sheet PU10059EJ02V0DS  PC8179TK 13 ...

Page 14

Remark The graphs indicate nominal characteristics. 14 Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 15

GHz MATCHING Remark The graphs indicate nominal characteristics. Data Sheet PU10059EJ02V0DS  PC8179TK 15 ...

Page 16

Remark The graphs indicate nominal characteristics. 16 Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 17

Remark The graphs indicate nominal characteristics. Data Sheet PU10059EJ02V0DS  PC8179TK 17 ...

Page 18

Remark The graphs indicate nominal characteristics. 18 Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 19

GHz MATCHING Remark The graphs indicate nominal characteristics. Data Sheet PU10059EJ02V0DS  PC8179TK 19 ...

Page 20

Remark The graphs indicate nominal characteristics. 20 Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 21

Remark The graphs indicate nominal characteristics. Data Sheet PU10059EJ02V0DS  PC8179TK 21 ...

Page 22

Remark The graphs indicate nominal characteristics. 22 Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 23

GHz MATCHING Remark The graphs indicate nominal characteristics. Data Sheet PU10059EJ02V0DS  PC8179TK 23 ...

Page 24

PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) 24 Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 25

... Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to V (4) The inductor (L) should be attached between output and V should be adjusted for applied frequency to match impedance to next stage ...

Page 26

Data Sheet PU10059EJ02V0DS  PC8179TK ...

Page 27

PC8179TK ...

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