B57020M2502A020 EPCOS Inc, B57020M2502A020 Datasheet - Page 5

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B57020M2502A020

Manufacturer Part Number
B57020M2502A020
Description
Thermistors - NTC M2020/5 K/A20 2% NTC Thermistor
Manufacturer
EPCOS Inc
Datasheet

Specifications of B57020M2502A020

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Cautions and warnings General
See "Important notes" at the end of this document.
Storage
Handling
Bending / twisting leads
Soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement
Probe assemblies
Store thermistors only in original packaging. Do not open the package prior to storage.
Storage conditions in original packaging: storage temperature
humidity 75% annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the
packing material may be deformed or components may stick together, causing problems during
mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SO
Use the components as soon as possible after opening the factory seals, i.e. the
polyvinyl-sealed packages.
Solder thermistors within the time specified after shipment from EPCOS.
For leaded components this is 24 months, for SMDs 12 months.
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused
during handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from
the component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Twisting (torsion) by 180 of a lead bent by 90 is permissible at 6 mm from the bottom of the
thermistor body.
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
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25 C ... +45 C, relative
x
, Cl etc).
B57020M2
M2020

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