Thermistors - NTC 1206 470Kohm 5% NCNR

NC20Q00474JBB

Manufacturer Part NumberNC20Q00474JBB
DescriptionThermistors - NTC 1206 470Kohm 5% NCNR
ManufacturerAVX Corporation
TypeNTC
NC20Q00474JBB datasheet
 


Specifications of NC20Q00474JBB

Resistance470 KOhmsTolerance5 %
Termination StyleSMD/SMTOperating Temperature Range- 55 C to + 150 C
Dimensions1.6 mm W x 3.2 mm L x 1.5 mm HPackage / Case1206
Lead Free Status / RoHS StatusLead free / RoHS Compliant  
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Surface Mounting Guide
Chip Thermistor – Application Notes
STORAGE
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
P/N
Termination
Solder
Type
Tin/Lead
Temp ºC
NC
AgPdPt
60/40
260 ± 5
NB
Nickel Barrier
60/40
260 ± 5
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes
with
peak
temperatures
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
Reflow
300
Preheat
250
200
150
100
50
0
1min
1min
10 sec. max
(Minimize soldering time)
300
250
200
150
100
50
0
0
50
100
150
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient: 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
18
Solder
Immersion
Time Seconds
15 max
30 ± 1
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
up
to
270ºC.
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
Natural
Cooling
220ºC
to
250ºC
REFLOW SOLDERING
Case
Size
0402
0603
0805
1206
WAVE SOLDERING
Case
Size
0603
200
250
300
Time (s)
0805
1206
Wave
300
Preheat
Natural
Cooling
250
T
200
230ºC
150
to
250ºC
100
50
0
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
D2
RECOMMENDED
D1
D3
SOLDERING PAD
LAYOUT
D4
Dimensions in
mm (inches)
P/N
D1
D2
D3
1.70
0.60
0.50
NB23
(.067)
(.024)
(.020)
2.30
0.80
0.70
NB21
(.091)
(.031)
(.028)
3.00
1.00
1.00
NB12
(.118)
(.039)
(.039)
4.00
1.00
2.00
NB20
(.157)
(.039)
(.079)
P/N
D1
D2
D3
3.10
1.20
0.70
NB21
(.122)
(.047)
(.028)
4.00
1.50
1.00
NB12
(.157)
(.059)
(.039)
5.00
1.50
2.00
NB20
(.197)
(.059)
(.079)
D5
D4
D5
0.60
0.50
(.024)
(.020)
0.80
0.75
(0.31)
(.030)
1.00
1.25
(.039)
(.049)
1.00
2.50
(.039)
(.098)
D4
D5
1.20
0.75
(.047)
(.030)
1.50
1.25
(.059)
(.049)
1.50
1.60
(.059)
(.063)