BC846W,115 NXP Semiconductors, BC846W,115 Datasheet
BC846W,115
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BC846W,115 Summary of contents
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BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors Rev. 07 — 17 November 2009 1. Product profile 1.1 General description NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages. Table 1. Type number BC846 BC846W BC846T [2] BC546A ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOT23; SOT323; SOT416 SOT54 SOT54A SOT54 variant BC846_BC546_SER_7 Product data sheet 65 V, 100 mA NPN general-purpose transistors Pinning Description base emitter collector emitter base collector emitter base collector emitter base collector Rev. 07 — 17 November 2009 BC846/BC546 series ...
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... NXP Semiconductors 3. Ordering information Table 4. Type number BC846 BC846W BC846T [2] BC546A [2] BC546B [1] Valid for all available selection groups. [2] Also available in SOT54 and SOT54 variant packages (see 4. Marking Table 5. Type number BC846 BC846A BC846B BC846W BC846AW BC846BW [ made in Hong Kong * = p: made in Hong Kong ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 7. Characteristics Table 8. ° amb Symbol Parameter I collector-base cut-off CBO current I emitter-base cut-off EBO current h DC current gain FE DC current gain V collector-emitter CEsat saturation voltage V base-emitter BEsat saturation voltage V base-emitter voltage transition frequency T C collector capacitance emitter capacitance e NF noise figure ...
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... NXP Semiconductors 400 h FE (1) 300 (2) 200 (3) 100 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 1. Selection A: DC current gain as a function of collector current; typical values CEsat (mV (1) (2) (3) 10 − 150 °C (1) T amb = 25 °C (2) T amb = − ...
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... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 5. Selection B: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − 150 °C (1) T amb = 25 °C ...
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... NXP Semiconductors 8. Package outline 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 9. Package outline SOT23 (TO-236AB) 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Fig 11. Package outline SOT416 (SC-75) 4.2 3.6 3 max 4.8 4.4 5.2 14.5 5.0 12.7 Dimensions in mm Fig 13 ...
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... NXP Semiconductors 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BC846 BC846W BC846T BC546A BC546B [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups. BC846_BC546_SER_7 Product data sheet ...
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... NXP Semiconductors 10. Soldering Dimensions in mm Fig 15. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Dimensions in mm Fig 16. Wave soldering footprint SOT23 (TO-236AB) BC846_BC546_SER_7 Product data sheet 65 V, 100 mA NPN general-purpose transistors 2.90 2. 0.85 1.30 3.00 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x) ...
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... NXP Semiconductors Fig 17. Reflow soldering footprint SOT323 (SC-70) 3.65 Fig 18. Wave soldering footprint SOT323 (SC-70) Fig 19. Reflow soldering footprint SOT416 (SC-75) BC846_BC546_SER_7 Product data sheet BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 2.65 0.75 1.325 1. 0.60 2.35 0.85 (3×) 1 0.55 (3×) 2 ...
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... Revision history Document ID Release date BC846_BC546_SER_7 20091117 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Table 3 • Figure 17 “Reflow soldering footprint SOT323 • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Packing information . . . . . . . . . . . . . . . . . . . . . 9 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 12 Legal information ...